品牌是'IDT' (6623)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

底架

包装/外壳

表面安装

引脚数

Current - Supply (Nom)

包装

已出版

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

频率

时间@峰值回流温度-最大值(s)

资历状况

电源

温度等级

界面

内存大小

端口的数量

电源电流-最大值

访问时间

组织结构

输出特性

地址总线宽度

密度

待机电流-最大值

I/O类型

同步/异步

字长

待机电压-最小值

电压 - 供电 (最大值)

电压 - 供电 (最小值)

座位高度(最大)

长度

宽度

器件厚度

辐射硬化

RoHS状态

无铅

70V9079S6PF8
70V9079S6PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

395mA

RAM, SRAM

Tape & Reel

2009

no

活跃

EAR99

70°C

0°C

3.3V

100MHz

Parallel

2

15 ns

30b

256 kb

Synchronous

8b

3.6V

3V

14mm

14mm

1.4mm

符合RoHS标准

含铅

7005S55J
7005S55J
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

68

250mA

RAM, SDR, SRAM

2005

e0

no

活跃

1 (Unlimited)

68

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE

5V

QUAD

J BEND

225

1

5V

COMMERCIAL

Parallel

8kB

2

55 ns

8KX8

3-STATE

26b

64 kb

0.015A

COMMON

Asynchronous

8b

5.5V

4.5V

24mm

24mm

3.63mm

符合RoHS标准

含铅

70V08L15PF
70V08L15PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

225mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

Tin/Lead (Sn85Pb15)

70°C

0°C

3.3V

QUAD

鸥翼

240

1

0.5mm

20

COMMERCIAL

Parallel

64kB

2

15 ns

64KX8

3-STATE

32b

512 kb

0.003A

COMMON

Asynchronous

8b

3V

3.6V

3V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V9289L9PRFI8
70V9289L9PRFI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

128

240mA

83MHz

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

128

Tin/Lead (Sn85Pb15)

85°C

-40°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

QUAD

鸥翼

225

1

0.5mm

40MHz

INDUSTRIAL

Parallel

128kB

2

9 ns

64KX16

3-STATE

16b

1 Mb

COMMON

Synchronous

16b

3V

3.6V

3V

1.6mm

20mm

14mm

1.4mm

符合RoHS标准

含铅

70V639S15BF8
70V639S15BF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

208

440mA

RAM, SRAM

Tape & Reel

2009

e0

no

活跃

3 (168 Hours)

208

Tin/Lead (Sn63Pb37)

70°C

0°C

3.3V

BOTTOM

BALL

225

1

0.8mm

20

COMMERCIAL

Parallel

2

15 ns

3-STATE

17b

2.3 Mb

0.015A

COMMON

Asynchronous

18b

3.45V

3.15V

15mm

15mm

1.4mm

符合RoHS标准

含铅

70T651S12BCI8
70T651S12BCI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

256

395mA

RAM, SRAM

Tape & Reel

2009

e0

no

活跃

3 (168 Hours)

256

Tin/Lead (Sn63Pb37)

85°C

-40°C

2.5V

BOTTOM

BALL

225

1

1mm

20

INDUSTRIAL

Parallel

2

12 ns

3-STATE

18b

9 Mb

COMMON

Asynchronous

36b

2.6V

2.4V

1.5mm

17mm

17mm

1.4mm

符合RoHS标准

含铅

71V321L55TF8
71V321L55TF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

64

85mA

RAM, SDR, SRAM

2001

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

BATTERY BACKUP;AUTOMATIC POWER DOWN

3.3V

QUAD

鸥翼

240

1

0.5mm

20

COMMERCIAL

Parallel

2kB

2

55 ns

3-STATE

22b

16 kb

0.0015A

COMMON

Asynchronous

8b

2V

3.6V

3V

1.6mm

10mm

10mm

1.4mm

符合RoHS标准

含铅

7015S20PF8
7015S20PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

80

290mA

RAM, SDR, SRAM

2010

e0

no

活跃

3 (168 Hours)

80

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

鸥翼

240

1

0.65mm

20

5V

COMMERCIAL

Parallel

9kB

2

20 ns

8KX9

3-STATE

26b

72 kb

0.015A

COMMON

Asynchronous

9b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V3589S133BFI8
70V3589S133BFI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

208

480mA

RAM, SRAM

Tape & Reel

2009

e0

no

活跃

3 (168 Hours)

208

Tin/Lead (Sn63Pb37)

85°C

-40°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

BOTTOM

BALL

1

0.8mm

133MHz

INDUSTRIAL

Parallel

2

15 ns

64KX36

3-STATE

32b

2.3 Mb

0.04A

COMMON

Synchronous

36b

3.45V

3.15V

1.7mm

15mm

15mm

1.4mm

符合RoHS标准

含铅

70V639S12PRF8
70V639S12PRF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

128

465mA

RAM, SRAM

Tape & Reel

2009

e0

no

活跃

3 (168 Hours)

128

Tin/Lead (Sn85Pb15)

70°C

0°C

3.3V

QUAD

鸥翼

225

1

0.5mm

COMMERCIAL

Parallel

2

12 ns

3-STATE

34b

2.3 Mb

0.015A

COMMON

Asynchronous

18b

3.45V

3.15V

1.6mm

20mm

14mm

1.4mm

符合RoHS标准

含铅

70T3519S166BCI
70T3519S166BCI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

256

510mA

166MHz

RAM, SDR, SRAM

2009

活跃

85°C

-40°C

2.5V

166MHz

Parallel

1.1MB

2

3.6 ns

36b

9 Mb

Synchronous

36b

2.6V

2.4V

17mm

17mm

1.4mm

符合RoHS标准

含铅

7142SA20J8
7142SA20J8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

52

250mA

RAM, SDR, SRAM

2004

活跃

70°C

0°C

5V

Parallel

2kB

2

20 ns

22b

16 kb

Asynchronous

8b

5.5V

4.5V

19mm

19mm

3.63mm

符合RoHS标准

含铅

7007L15PF8
7007L15PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

80

285mA

RAM, SDR, SRAM

2010

e0

no

活跃

3 (168 Hours)

80

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

SEMAPHORE; AUTOMATIC POWER DOWN

5V

QUAD

鸥翼

240

1

0.65mm

20

5V

COMMERCIAL

Parallel

32kB

2

15 ns

3-STATE

15b

256 kb

0.005A

COMMON

Asynchronous

8b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

7015S12PF
7015S12PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

80

325mA

RAM, SDR, SRAM

2010

e3

yes

活跃

3 (168 Hours)

80

EAR99

Matte Tin (Sn) - annealed

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

鸥翼

260

1

0.65mm

30

不合格

5V

COMMERCIAL

Parallel

9kB

2

12 ns

8KX9

3-STATE

26b

72 kb

0.015A

COMMON

Asynchronous

9b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V3569S6BF8
70V3569S6BF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

208

310mA

RAM, SRAM

Tape & Reel

2008

e0

no

活跃

3 (168 Hours)

208

Tin/Lead (Sn63Pb37)

70°C

0°C

PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE

3.3V

BOTTOM

BALL

225

1

0.8mm

83.3MHz

20

COMMERCIAL

Parallel

2

6 ns

16KX36

3-STATE

14b

576 kb

0.015A

COMMON

Synchronous

36b

3.45V

3.15V

15mm

15mm

1.4mm

符合RoHS标准

含铅

7038L20PF
7038L20PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

300mA

RAM, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE

5V

QUAD

鸥翼

240

1

0.5mm

20

5V

COMMERCIAL

Parallel

2

20 ns

64KX18

3-STATE

16b

1.1 Mb

0.003A

COMMON

Asynchronous

18b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V24S25PF8
70V24S25PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

TQFP

YES

100

RAM, SDR, SRAM

2008

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

3.3V

QUAD

鸥翼

240

1

0.5mm

20

COMMERCIAL

Parallel

8kB

2

0.19mA

25 ns

4KX16

3-STATE

24b

64 kb

0.005A

COMMON

3V

3.6V

3V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

7130SA55JI8
7130SA55JI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

52

190mA

RAM, SDR, SRAM

2013

e0

no

活跃

3 (168 Hours)

52

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

5V

QUAD

J BEND

225

1

5V

INDUSTRIAL

Parallel

1kB

2

55 ns

1KX8

3-STATE

20b

8 kb

0.03A

COMMON

Asynchronous

8b

5.5V

4.5V

4.57mm

19mm

19mm

3.63mm

符合RoHS标准

含铅

7016L12PF
7016L12PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

80

275mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

80

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

SEMAPHORE; INTERRUPT FLAG; AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE

5V

QUAD

鸥翼

240

1

0.65mm

20

5V

COMMERCIAL

Parallel

18kB

2

12 ns

16KX9

3-STATE

28b

144 kb

0.005A

COMMON

Asynchronous

9b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

7015L20PFI8
7015L20PFI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

80

310mA

RAM, SRAM

Tape & Reel

2010

e0

no

活跃

3 (168 Hours)

80

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

鸥翼

240

1

0.65mm

20

5V

INDUSTRIAL

Parallel

2

20 ns

8KX9

3-STATE

26b

72 kb

0.005A

COMMON

Asynchronous

9b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V9269S12PRF
70V9269S12PRF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

128

240mA

RAM, SDR, SRAM

Bulk

2008

e0

no

活跃

3 (168 Hours)

128

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

3.3V

QUAD

鸥翼

225

0.5mm

33.3MHz

COMMERCIAL

Parallel

32kB

2

12 ns

16KX16

3-STATE

28b

256 kb

0.005A

COMMON

Synchronous

16b

3V

3.6V

3V

20mm

14mm

1.4mm

符合RoHS标准

含铅

71342LA25J8
71342LA25J8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

52

240mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

52

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP

5V

QUAD

J BEND

225

1

5V

COMMERCIAL

Parallel

4kB

2

25 ns

4KX8

3-STATE

24b

32 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

4.57mm

19mm

19mm

3.63mm

符合RoHS标准

含铅

7034L20PF
7034L20PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

240mA

RAM, SDR, SRAM

Bulk

2009

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

5V

QUAD

鸥翼

240

1

0.5mm

20

5V

COMMERCIAL

Parallel

9kB

2

20 ns

4KX18

3-STATE

12b

72 kb

0.0015A

COMMON

Asynchronous

18b

2V

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V27L35PF
70V27L35PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

190mA

RAM, SDR, SRAM

2012

活跃

70°C

0°C

3.3V

Parallel

64kB

2

35 ns

30b

512 kb

Asynchronous

16b

3.6V

3V

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V3399S133BF8
70V3399S133BF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

16 Weeks

表面贴装

208

400mA

133MHz

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

208

Tin/Lead (Sn63Pb37)

70°C

0°C

PIPELINED OR FLOW-THROUGH ARCHITECTURE

3.3V

BOTTOM

BALL

225

1

0.8mm

133MHz

COMMERCIAL

Parallel

256kB

2

4.2 ns

3-STATE

34b

2.3 Mb

0.03A

COMMON

Synchronous

18b

3.45V

3.15V

1.7mm

15mm

15mm

1.4mm

符合RoHS标准

含铅