品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 时钟频率 | 传播延迟 | 输入数量 | 组织结构 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | LABs数量/ CLBs数量 | 输出功能 | 逻辑块数量 | 逻辑单元数 | 专用输入数量 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | EP3C10E144C7N | Intel | 数据表 | 3000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 144-LQFP Exposed Pad | YES | 94 | 0°C~85°C TJ | Tray | Cyclone® III | e3 | 活跃 | 3 (168 Hours) | 144 | EAR99 | MATTE TIN (472) OVER COPPER | 8542.39.00.01 | 1.15V~1.25V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 40 | EP3C10 | R-PQFP-G144 | 94 | 不合格 | 472.5MHz | 94 | 现场可编程门阵列 | 10320 | 423936 | 645 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | |||||||||||||
![]() | EP20K100BC356-1 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 356-LBGA | YES | 252 | 0°C~85°C TJ | Tray | APEX-20K® | e0 | Obsolete | 3 (168 Hours) | 356 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | 220 | 2.5V | 1.27mm | compliant | 30 | EP20K100 | S-PBGA-B356 | 246 | 不合格 | 2.52.5/3.3V | 2.5 ns | 246 | 可加载 PLD | 4160 | 53248 | 263000 | 416 | MACROCELL | 4 | 1.63mm | 35mm | 35mm | Non-RoHS Compliant | ||||||||||
![]() | EP2C20F484I8N | Intel | 数据表 | 33 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 484-BGA | YES | 315 | -40°C~100°C TJ | Tray | Cyclone® II | e1 | 活跃 | 3 (168 Hours) | 484 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | EP2C20 | S-PBGA-B484 | 299 | 不合格 | 1.21.5/3.33.3V | 402.5MHz | 315 | 现场可编程门阵列 | 18752 | 239616 | 1172 | 2.6mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||
![]() | EPF10K30RC240-3 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 240-BFQFP Exposed Pad | YES | 189 | 0°C~70°C TA | Tray | FLEX-10K® | e0 | Obsolete | 3 (168 Hours) | 240 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 4.75V~5.25V | QUAD | 鸥翼 | 220 | 5V | 0.5mm | 30 | EPF10K30 | S-PQFP-G240 | 189 | 不合格 | 3.3/55V | 66.67MHz | 0.6 ns | 189 | 可加载 PLD | 1728 | 12288 | 69000 | 216 | REGISTERED | 4 | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | |||||||||
![]() | EP4SGX530HH35C4N | Intel | 数据表 | 866 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 1152-BBGA, FCBGA | YES | 564 | 0°C~85°C TJ | Tray | Stratix® IV GX | 活跃 | 3 (168 Hours) | 3A001.A.7.A | 8542.39.00.01 | 0.87V~0.93V | BOTTOM | BALL | 1mm | EP4SGX530 | S-PBGA-B1152 | 564 | 不合格 | 0.91.2/31.52.5V | 564 | 现场可编程门阵列 | 531200 | 28033024 | 21248 | 3.7mm | 42.5mm | 42.5mm | 符合RoHS标准 | |||||||||||||||||||
![]() | EP3C16F256I7 | Intel | 数据表 | 23 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 256-LBGA | YES | 168 | -40°C~100°C TJ | Tray | Cyclone® III | e0 | 活跃 | 3 (168 Hours) | 256 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 220 | 1.2V | 1mm | 30 | EP3C16 | R-PBGA-B256 | 168 | 不合格 | 472.5MHz | 168 | 现场可编程门阵列 | 15408 | 516096 | 963 | 1.55mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||
![]() | 5CEBA4F23C8N | Intel | 数据表 | 720 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 484-BGA | YES | 224 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V E | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.07V~1.13V | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5CEBA4 | S-PBGA-B484 | 224 | 不合格 | 1.11.2/3.32.5V | 224 | 现场可编程门阵列 | 49000 | 3464192 | 18480 | 2mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||
![]() | EPF8636AQC208-4 | Intel | 数据表 | 20 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 136 | 0°C~70°C TA | Tray | FLEX 8000 | e0 | Obsolete | 3 (168 Hours) | 208 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 4.75V~5.25V | QUAD | 鸥翼 | 220 | 5V | 0.5mm | compliant | 30 | EPF8636 | S-PQFP-G208 | 132 | 不合格 | 3.3/55V | 357MHz | 136 | 可加载 PLD | 504 | 6000 | 63 | REGISTERED | 504 | 4 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||
![]() | EP4CGX150DF27C7N | Intel | 数据表 | 2526 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 672-BGA | YES | 393 | 0°C~85°C TJ | Tray | Cyclone® IV GX | e1 | 活跃 | 3 (168 Hours) | 672 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 1.16V~1.24V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | EP4CGX150 | S-PBGA-B672 | 393 | 不合格 | 1.21.2/3.32.5V | 472.5MHz | 393 | 现场可编程门阵列 | 149760 | 6635520 | 9360 | 2.4mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||
![]() | EP4SGX530NF45C2N | Intel | 数据表 | 423 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 1932-BBGA, FCBGA | YES | 920 | 0°C~85°C TJ | Tray | Stratix® IV GX | e1 | 活跃 | 3 (168 Hours) | 3A001.A.7.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.87V~0.93V | BOTTOM | BALL | 1mm | EP4SGX530 | S-PBGA-B1932 | 920 | 不合格 | 0.91.2/31.52.5V | 920 | 现场可编程门阵列 | 531200 | 28033024 | 21248 | 3.8mm | 45mm | 45mm | 符合RoHS标准 | |||||||||||||||||
![]() | EP3SL50F780C2N | Intel | 数据表 | 682 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 780-BBGA, FCBGA | YES | 488 | 0°C~85°C TJ | Tray | Stratix® III L | Obsolete | 3 (168 Hours) | 780 | 3A991 | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | 8542.39.00.01 | 0.86V~1.15V | BOTTOM | BALL | 0.9V | 1mm | EP3SL50 | S-PBGA-B780 | 488 | 不合格 | 1.2/3.3V | 800MHz | 488 | 现场可编程门阵列 | 47500 | 2184192 | 1900 | 3.5mm | 29mm | 29mm | 符合RoHS标准 | ||||||||||||||||
![]() | EP2AGX45DF29I5N | Intel | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 780-BBGA, FCBGA | YES | 364 | -40°C~100°C TJ | Tray | Arria II GX | e1 | Obsolete | 3 (168 Hours) | 780 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.87V~0.93V | BOTTOM | BALL | 245 | 0.9V | 1mm | 40 | EP2AGX45 | S-PBGA-B780 | 364 | 不合格 | 0.91.2/3.31.52.5V | 500MHz | 364 | 现场可编程门阵列 | 42959 | 3517440 | 1805 | 2.7mm | 29mm | 29mm | 符合RoHS标准 | |||||||||||||
![]() | 5CGXFC4C6F23C7N | Intel | 数据表 | 33 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 484-BGA | YES | 240 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V GX | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.07V~1.13V | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5CGXFC4 | S-PBGA-B484 | 240 | 不合格 | 1.11.2/3.32.5V | 240 | 现场可编程门阵列 | 50000 | 2862080 | 18868 | 2mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||
![]() | EP1C6T144C7N | Intel | 数据表 | 193 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 98 | 0°C~85°C TJ | Tray | Cyclone® | e3 | Obsolete | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | compliant | 40 | EP1C6 | S-PQFP-G144 | 98 | 不合格 | 1.51.5/3.3V | 320MHz | 185 | 现场可编程门阵列 | 5980 | 92160 | 598 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | ||||||||||||
![]() | EPF10K30ATC144-2 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 102 | 0°C~70°C TA | Tray | FLEX-10KA® | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 3V~3.6V | QUAD | 鸥翼 | 220 | 3.3V | 0.5mm | 30 | EPF10K30 | S-PQFP-G144 | 246 | 不合格 | 2.5/3.33.3V | 80MHz | 0.7 ns | 246 | 可加载 PLD | 1728 | 12288 | 69000 | 216 | REGISTERED | 4 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||
![]() | EP1SGX25FF1020I6N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1020-BBGA | YES | 607 | -40°C~100°C TJ | Tray | Stratix® GX | e1 | Obsolete | 3 (168 Hours) | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 1mm | compliant | 30 | EP1SGX25 | S-PBGA-B1020 | 607 | 不合格 | 1.51.5/3.3V | 607 | 2852 CLBS | 现场可编程门阵列 | 25660 | 1944576 | 2566 | 2852 | 3.5mm | 33mm | 33mm | 符合RoHS标准 | ||||||||||||
![]() | EP1K10TC144-3 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 92 | 0°C~70°C TA | Tray | ACEX-1K® | e0 | Obsolete | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EP1K10 | S-PQFP-G144 | 92 | 不合格 | 2.52.5/3.3V | 0.7 ns | 92 | 可加载 PLD | 576 | 12288 | 56000 | 72 | MIXED | 576 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||
![]() | EP1S10F484C7N | Intel | 数据表 | 2000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BBGA, FCBGA | YES | 335 | 0°C~85°C TJ | Tray | 2014 | Stratix® | e1 | Obsolete | 3 (168 Hours) | 484 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | compliant | 40 | EP1S10 | S-PBGA-B484 | 426 | 不合格 | 1.51.5/3.3V | 426 | 1200 CLBS | 现场可编程门阵列 | 10570 | 920448 | 1057 | 1200 | 3.5mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||
![]() | EP4CE15F17A7N | Intel | 数据表 | 16 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 256-LBGA | YES | 165 | -40°C~125°C TJ | Tray | 2016 | Cyclone® IV E | e1 | 活跃 | 3 (168 Hours) | 256 | 锡银铜 | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | EP4CE15 | S-PBGA-B256 | 165 | 不合格 | 1.21.2/3.32.5V | 472.5MHz | 165 | 现场可编程门阵列 | 15408 | 516096 | 963 | 963 | 1.55mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||
![]() | EP3SL50F484C3N | Intel | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BBGA, FCBGA | YES | 296 | 0°C~85°C TJ | Tray | Stratix® III L | Obsolete | 3 (168 Hours) | 484 | 3A991 | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | 8542.39.00.01 | 0.86V~1.15V | BOTTOM | BALL | 0.9V | 1mm | EP3SL50 | S-PBGA-B484 | 296 | 不合格 | 1.2/3.3V | 717MHz | 296 | 现场可编程门阵列 | 47500 | 2184192 | 1900 | 3.5mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||
![]() | EP3SE80F780C4N | Intel | 数据表 | 933 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 780-BBGA, FCBGA | YES | 488 | 0°C~85°C TJ | Tray | Stratix® III E | e1 | 活跃 | 3 (168 Hours) | 780 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | 8542.39.00.01 | 0.86V~1.15V | BOTTOM | BALL | 245 | 0.9V | 1mm | 40 | EP3SE80 | S-PBGA-B780 | 488 | 不合格 | 1.2/3.3V | 717MHz | 488 | 现场可编程门阵列 | 80000 | 6843392 | 3200 | 3.5mm | 29mm | 29mm | 符合RoHS标准 | |||||||||||
![]() | EP4SGX110DF29C4N | Intel | 数据表 | 445 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 780-BBGA, FCBGA | YES | 372 | 0°C~85°C TJ | Tray | Stratix® IV GX | e1 | Obsolete | 3 (168 Hours) | 780 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.87V~0.93V | BOTTOM | BALL | 245 | 0.9V | 1mm | 40 | EP4SGX110 | S-PBGA-B780 | 372 | 不合格 | 0.91.2/31.52.5V | 717MHz | 372 | 现场可编程门阵列 | 105600 | 9793536 | 4224 | 3.3mm | 29mm | 29mm | 符合RoHS标准 | ||||||||||||||
EP1C3T100C7N | Intel | 数据表 | 338 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 65 | 0°C~85°C TJ | Tray | Cyclone® | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | compliant | 40 | EP1C3 | S-PQFP-G100 | 104 | 不合格 | 1.51.5/3.3V | 320MHz | 104 | 现场可编程门阵列 | 2910 | 59904 | 291 | 1.2mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||
![]() | EP3SL50F780C4N | Intel | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 780-BBGA, FCBGA | YES | 488 | 0°C~85°C TJ | Tray | Stratix® III L | e1 | Obsolete | 3 (168 Hours) | 780 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | 8542.39.00.01 | 0.86V~1.15V | BOTTOM | BALL | 245 | 0.9V | 1mm | 40 | EP3SL50 | S-PBGA-B780 | 488 | 不合格 | 1.2/3.3V | 717MHz | 488 | 现场可编程门阵列 | 47500 | 2184192 | 1900 | 3.5mm | 29mm | 29mm | 符合RoHS标准 | ||||||||||||
![]() | EPF10K30AQC240-3 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 240-BFQFP | YES | 189 | 0°C~70°C TA | Tray | FLEX-10KA® | e0 | Obsolete | 3 (168 Hours) | 240 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 3V~3.6V | QUAD | 鸥翼 | 220 | 3.3V | 0.5mm | 30 | EPF10K30 | S-PQFP-G240 | 246 | 不合格 | 2.5/3.33.3V | 80MHz | 0.9 ns | 246 | 可加载 PLD | 1728 | 12288 | 69000 | 216 | REGISTERED | 4 | 4.1mm | 32mm | 32mm | Non-RoHS Compliant |
EP3C10E144C7N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP20K100BC356-1
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C20F484I8N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EPF10K30RC240-3
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SGX530HH35C4N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C16F256I7
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CEBA4F23C8N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EPF8636AQC208-4
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4CGX150DF27C7N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SGX530NF45C2N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SL50F780C2N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2AGX45DF29I5N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CGXFC4C6F23C7N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C6T144C7N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EPF10K30ATC144-2
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1SGX25FF1020I6N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1K10TC144-3
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S10F484C7N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4CE15F17A7N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SL50F484C3N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SE80F780C4N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SGX110DF29C4N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C3T100C7N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SL50F780C4N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EPF10K30AQC240-3
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
