品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | Contact plating | 安装类型 | 包装/外壳 | 表面安装 | Number of pins | 供应商器件包装 | 终端数量 | Connector pinout layout | Contacts pitch | Date Of Intro | Electrical mounting | Gross weight | Kind of connector | 厂商 | Row pitch | Spatial orientation | Type of connector | Operating temperature | 操作温度 | 系列 | JESD-609代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | Current rating | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 温度等级 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | Rated voltage | 个人资料 | 长度 | 宽度 | Plating thickness | Flammability rating | ||||||||||||||||||||
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![]() | 1SD110PJ2F43I2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) | Intel | 528 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Stratix® 10 DX | 0.87V ~ 0.97V | 1325000 | 112197632 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AX016 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Intel | Bulk | 活跃 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SG040HH1F35I1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Stratix® 10 GX | 0.77V ~ 0.97V | 378000 | 31457280 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SG065HH3F35E2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 392 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Stratix® 10 GX | 0.77V ~ 0.97V | 612000 | 51380224 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SD280PT1F55E2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 2912-BBGA, FCBGA | 2912-FBGA (55x55) | Intel | 816 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Stratix® 10 DX | 0.87V ~ 0.97V | 2753000 | 240123904 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1C20F324C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | INTEL CORP | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 20060 CLBS | 2.2 mm | 现场可编程门阵列 | 20060 | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | 5SEE9H40C2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | INTEL CORP | HBGA-1517 | 85 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 无 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 696 | 不合格 | OTHER | 696 | 31700 CLBS | 3.9 mm | 现场可编程门阵列 | 31700 | 840000 | 45 mm | 45 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | 10M04SFM153I7G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 153 | 活跃 | INTEL CORP | 8 X 8 MM, 0.50 MM PITCH, ROHS COMPLIANT, MBGA-153 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA153,15X15,20 | SQUARE | 网格排列 | 3.15 V | 2.85 V | 3 V | 有 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | 未说明 | S-PBGA-B153 | 112 | 不合格 | 112 | 现场可编程门阵列 | 4000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C8Q208I7 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | INTEL CORP | PLASTIC, PQFP-208 | 3 | 1.2 V | 1.15 V | 1.25 V | FLATPACK, FINE PITCH | SQUARE | QFP208,1.2SQ,20 | FQFP | PLASTIC/EPOXY | 无 | 活跃 | e0 | 锡铅 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G208 | 130 | 不合格 | 138 | 540 CLBS | 4.1 mm | 现场可编程门阵列 | 540 | 8256 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EP3C80U484I8N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | Obsolete | INTEL CORP | FBGA, BGA484,22X22,32 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 1.25 V | 1.15 V | 1.2 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B484 | 295 | 不合格 | 295 | 5079 CLBS | 2.05 mm | 现场可编程门阵列 | 81264 | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | EP4CE75F23 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 36 | 484 | 2x18 | 2.54mm | SMT | 1.74 g | female | BGA | SQUARE | 网格排列 | 1.24 V | 1.16 V | 1.2 V | socket | 活跃 | INTEL CORP | 2.54mm | straight | FBGA-484 | PLASTIC/EPOXY | pin strips | -40...163°C | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | 3A | S-PBGA-B484 | 47 CLBS | 2.4 mm | 现场可编程门阵列 | 47 | 150V | beryllium copper | 23 mm | 23 mm | 0.75µm | UL94V-0 | ||||||||||||||||||||||||||||||||
![]() | 5CEBA9F23C6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | ROHS COMPLIANT, FBGA-484 | 85 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 224 | OTHER | 224 | 11356 CLBS | 2 mm | 现场可编程门阵列 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1C6Q240I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | INTEL CORP | 34.60 X 34.60 MM, 0.50 PITCH, PLASTIC, LEAD FREE, QFP-240 | 275 MHz | 3 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G240 | 不合格 | 5980 CLBS | 4.1 mm | 现场可编程门阵列 | 5980 | 32 mm | 32 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C55F780I6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 活跃 | INTEL CORP | BGA, BGA780,28X28,40 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 377 | 不合格 | 377 | 3491 CLBS | 2.4 mm | 现场可编程门阵列 | 55856 | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | EP2S15F672I3 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | 活跃 | INTEL CORP | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 358 | 不合格 | 366 | 现场可编程门阵列 | 15600 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C25U256I8N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 活跃 | INTEL CORP | LFBGA, BGA256,16X16,32 | 100 °C | -40 °C | PLASTIC/EPOXY | LFBGA | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.25 V | 1.15 V | 1.2 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B256 | 156 | 不合格 | 156 | 1539 CLBS | 1.5 mm | 现场可编程门阵列 | 24624 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | EP1S25F1508C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 2566 | 25660 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | 1SG280LH3F55E2VGS1 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2018-08-08 | 活跃 | INTEL CORP | 8542.39.00.01 | compliant | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1S60B956C5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 956 | INTEL CORP | 40 X 40 MM, 1.27 MM PITCH, BGA-956 | 85 °C | PLASTIC/EPOXY | BGA | BGA956,31X31,50 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1.27 mm | compliant | S-PBGA-B956 | 683 | 不合格 | 商业扩展 | 683 | 5712 CLBS | 现场可编程门阵列 | 5712 | 57120 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | EP3C55F780I6 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 无 | 活跃 | INTEL CORP | BGA, BGA780,28X28,40 | 1 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 377 | 不合格 | 377 | 3491 CLBS | 2.4 mm | 现场可编程门阵列 | 55856 | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EP1SGX25DF672C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | Obsolete | INTEL CORP | BGA, | 5.37 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 455 | 不合格 | OTHER | 455 | 2566 CLBS | 3.5 mm | 现场可编程门阵列 | 8.245 ns | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EP3SE260F780I3N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | INTEL CORP | BGA, BGA780,28X28,40 | 100 MHz | PLASTIC | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 有 | 接触制造商 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 480 | 不合格 | 488 | 现场可编程门阵列 | 255000 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP4S100G5H40C2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | LEAD FREE, HBGA-1517 | 800 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.98 V | 0.92 V | 0.95 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B | 654 | OTHER | 654 | 21248 CLBS | 3.8 mm | 现场可编程门阵列 | 212480 | 531200 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C15AF256I6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | INTEL CORP | LEAD FREE, FBGA-256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | 1.25 V | 1.15 V | 1.2 V | 有 | 活跃 | e1 | 锡银铜 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 144 | 不合格 | 152 | 1.55 mm | 现场可编程门阵列 | 14448 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | EP1M120B484C5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | INTEL CORP | , | 8542.39.00.01 | compliant |
1SD110PJ2F43I2VG
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX016
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG040HH1F35I1VG
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG065HH3F35E2VG
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SD280PT1F55E2VG
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C20F324C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5SEE9H40C2
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M04SFM153I7G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C8Q208I7
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C80U484I8N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4CE75F23
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CEBA9F23C6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C6Q240I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C55F780I6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2S15F672I3
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C25U256I8N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S25F1508C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG280LH3F55E2VGS1
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S60B956C5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C55F780I6
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1SGX25DF672C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SE260F780I3N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4S100G5H40C2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C15AF256I6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1M120B484C5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
