品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 温度等级 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 长度 | 宽度 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | EP1S80F1508I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | BGA, | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | compliant | S-PBGA-B1508 | 1203 | 不合格 | 1203 | 7904 CLBS | 现场可编程门阵列 | |||||||||||||||||
![]() | 1SG280HN3F43E3VGS1 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2018-08-08 | INTEL CORP | , | 活跃 | 8542.39.00.01 | compliant | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||
![]() | EP3C80F780I8 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 活跃 | INTEL CORP | BGA, BGA780,28X28,40 | 1 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 429 | 不合格 | 429 | 5079 CLBS | 2.4 mm | 现场可编程门阵列 | 81264 | 29 mm | 29 mm | ||||||||||
![]() | EP1C4F400C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 400 | INTEL CORP | BGA, | 405 MHz | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B400 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 21 mm | 21 mm | ||||||||||||||
![]() | EP1S40F1508I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 活跃 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 822 | 不合格 | 822 | 4125 CLBS | 现场可编程门阵列 | 4125 | 41250 | 40 mm | 40 mm | |||||||||||
![]() | 10M08SCM153A7G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 153 | 活跃 | INTEL CORP | MBGA-153 | 125 °C | -40 °C | PLASTIC/EPOXY | VFBGA | BGA153,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3.15 V | 2.85 V | 3 V | 有 | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | 未说明 | S-PBGA-B153 | 250 | AUTOMOTIVE | 250 | 500 CLBS | 1 mm | 现场可编程门阵列 | 500 | 8000 | 8 mm | 8 mm | |||||||||
![]() | 10AS057H4F34I3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 活跃 | INTEL CORP | FBGA-1152 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 492 | INDUSTRIAL | 492 | 21708 CLBS | 3.35 mm | 现场可编程门阵列 | 21708 | 570000 | 35 mm | 35 mm | ||||||||||||
![]() | 10AX115U4F45E3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1932 | INTEL CORP | FBGA-1932 | 100 °C | PLASTIC/EPOXY | BGA | BGA1932,44X44,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.9 V | 有 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1932 | 480 | OTHER | 480 | 42720 CLBS | 3.5 mm | 现场可编程门阵列 | 42720 | 1150000 | 45 mm | 45 mm | |||||||||||||
![]() | EP3C55U484I8N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 活跃 | INTEL CORP | FBGA, BGA484,22X22,32 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 1.25 V | 1.15 V | 1.2 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B484 | 327 | 不合格 | 327 | 3491 CLBS | 2.05 mm | 现场可编程门阵列 | 55856 | 19 mm | 19 mm | |||||||||||
![]() | EP1C4F400C8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 400 | INTEL CORP | BGA, | 275 MHz | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B400 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 21 mm | 21 mm | ||||||||||||||
![]() | 10AS066N4F40E3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | INTEL CORP | FBGA-1517 | 100 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 588 | OTHER | 588 | 25168 CLBS | 3.5 mm | 现场可编程门阵列 | 25168 | 660000 | 40 mm | 40 mm | |||||||||||||
![]() | EP1S30F1508C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 3247 | 32470 | 40 mm | 40 mm | ||||||||||||||
![]() | EP1C6Q240I6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | INTEL CORP | 34.60 X 34.60 MM, 0.50 PITCH, PLASTIC, LEAD FREE, QFP-240 | 405 MHz | 3 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G240 | 不合格 | 5980 CLBS | 4.1 mm | 现场可编程门阵列 | 5980 | 32 mm | 32 mm | ||||||||||||||
![]() | 10AS032H4F34I3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 活跃 | INTEL CORP | FBGA-1152 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 384 | INDUSTRIAL | 384 | 11990 CLBS | 3.35 mm | 现场可编程门阵列 | 11990 | 320000 | 35 mm | 35 mm | ||||||||||||
![]() | EP1C12F256C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | INTEL CORP | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 17 mm | 17 mm | ||||||||||||||
![]() | EP2C70F896I7 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 896 | FBGA-896 | PLASTIC/EPOXY | BGA | BGA896,30X30,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B896 | 606 | 不合格 | 622 | 4300 CLBS | 2.6 mm | 现场可编程门阵列 | 4300 | 68416 | 31 mm | 31 mm | |||||||||||
![]() | EP1M350B780C7 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | INTEL CORP | , | 8542.39.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||
![]() | EP20K100RC240 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | INTEL CORP | , | 8542.39.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||
![]() | EP3C160240C8N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066H4F34I3LP | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 活跃 | INTEL CORP | FBGA-1152 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 无 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | INDUSTRIAL | 492 | 25168 CLBS | 3.35 mm | 现场可编程门阵列 | 25168 | 660000 | 35 mm | 35 mm | |||||||||||
![]() | 10AS066N4F40I3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | 活跃 | INTEL CORP | FBGA-1517 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 588 | INDUSTRIAL | 588 | 25168 CLBS | 3.5 mm | 现场可编程门阵列 | 25168 | 660000 | 40 mm | 40 mm | ||||||||||||
![]() | EP2C50F672I7N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | LEAD FREE, FBGA-672 | INTEL CORP | 活跃 | 有 | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | e1 | 锡银铜 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 434 | 不合格 | 450 | 3182 CLBS | 2.6 mm | 现场可编程门阵列 | 3182 | 50528 | 27 mm | 27 mm | |||||||||||
![]() | EP3SL200F1517I2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | 活跃 | INTEL CORP | BGA, BGA1517,39X39,40 | 100 MHz | 100 °C | -40 °C | PLASTIC | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 1.15 V | 1.05 V | 1.1 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 976 | 不合格 | 976 | 8000 CLBS | 现场可编程门阵列 | 200000 | |||||||||||||
![]() | 5CEBA4F23I7N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | ROHS COMPLIANT, FBGA-484 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 224 | 224 | 1848 CLBS | 2 mm | 现场可编程门阵列 | 23 mm | 23 mm | ||||||||||||||||
![]() | EP1SGX40DF1020C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1020 | INTEL CORP | BGA, | 6 MHz | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1020 | 624 | 不合格 | OTHER | 624 | 4125 CLBS | 3.5 mm | 现场可编程门阵列 | 7.49 ns | 33 mm | 33 mm |
EP1S80F1508I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG280HN3F43E3VGS1
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C80F780I8
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C4F400C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S40F1508I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M08SCM153A7G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS057H4F34I3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX115U4F45E3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C55U484I8N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C4F400C8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS066N4F40E3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S30F1508C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C6Q240I6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS032H4F34I3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F256C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C70F896I7
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1M350B780C7
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP20K100RC240
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C160240C8N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS066H4F34I3LP
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS066N4F40I3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C50F672I7N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SL200F1517I2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CEBA4F23I7N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1SGX40DF1020C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
