品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 温度等级 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 长度 | 宽度 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | EP1M350B780C7 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | INTEL CORP | , | 活跃 | 8542.39.00.01 | compliant | ||||||||||||||||||||||||||||||||||||||
![]() | EP1S10F1508I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | 现场可编程门阵列 | 1057 | 10570 | 40 mm | 40 mm | |||||||||||||
![]() | EP1S20F1508C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 1846 | 18460 | 40 mm | 40 mm | |||||||||||||
![]() | EP4SGX290HF35I2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | LEAD FREE, FBGA-1152 | 800 MHz | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 564 | 564 | 11648 CLBS | 3.6 mm | 现场可编程门阵列 | 116480 | 35 mm | 35 mm | |||||||||||||
![]() | EP1C6F256I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 17 X 17 MM, 1.00 MM PITCH, LEAD FREE, FBGA-256 | 275 MHz | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | 5980 CLBS | 2.2 mm | 现场可编程门阵列 | 5980 | 17 mm | 17 mm | |||||||||||||
![]() | EP1C4F400I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 400 | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B400 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 21 mm | 21 mm | |||||||||||||
![]() | EP1C3T144C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | LFQFP, | 320 MHz | 3 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G144 | 不合格 | 2910 CLBS | 1.6 mm | 现场可编程门阵列 | 2910 | 20 mm | 20 mm | |||||||||||||
![]() | EP1S30F1508C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 3247 | 32470 | 40 mm | 40 mm | |||||||||||||
![]() | EP1C6Q240I6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | 34.60 X 34.60 MM, 0.50 PITCH, PLASTIC, LEAD FREE, QFP-240 | 405 MHz | 3 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G240 | 不合格 | 5980 CLBS | 4.1 mm | 现场可编程门阵列 | 5980 | 32 mm | 32 mm | |||||||||||||
![]() | 10AS032H4F34I3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | INTEL CORP | FBGA-1152 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 384 | INDUSTRIAL | 384 | 11990 CLBS | 3.35 mm | 现场可编程门阵列 | 11990 | 320000 | 35 mm | 35 mm | |||||||||||
![]() | EP1C3T144I6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 22 X 22 MM, 0.50 MM PITCH, LEAD FREE, TQFP-144 | 405 MHz | 3 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G144 | 不合格 | 2910 CLBS | 1.6 mm | 现场可编程门阵列 | 2910 | 20 mm | 20 mm | |||||||||||||
![]() | 10AX016E4F29M3LG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | 有 | INTEL CORP | 8542.39.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||
![]() | 10AS066H4F34I3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | INTEL CORP | FBGA-1152 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 492 | INDUSTRIAL | 492 | 25168 CLBS | 3.35 mm | 现场可编程门阵列 | 25168 | 660000 | 35 mm | 35 mm | |||||||||||
![]() | EP1S40F1508I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 822 | 不合格 | 822 | 4125 CLBS | 现场可编程门阵列 | 4125 | 41250 | 40 mm | 40 mm | ||||||||||
![]() | 10M08SCM153A7G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 153 | INTEL CORP | MBGA-153 | 125 °C | -40 °C | PLASTIC/EPOXY | VFBGA | BGA153,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3.15 V | 2.85 V | 3 V | 有 | 活跃 | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | 未说明 | S-PBGA-B153 | 250 | AUTOMOTIVE | 250 | 500 CLBS | 1 mm | 现场可编程门阵列 | 500 | 8000 | 8 mm | 8 mm | ||||||||
![]() | 5SGXEA5H2F35I2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | INTEL CORP | FBGA-1152 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 无 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 552 | 不合格 | INDUSTRIAL | 552 | 18500 CLBS | 3.6 mm | 现场可编程门阵列 | 18500 | 490000 | 35 mm | 35 mm | ||||||||||
![]() | EP1S25F1508C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 2566 | 25660 | 40 mm | 40 mm | |||||||||||||
![]() | EP2C50F672I6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 有 | 活跃 | INTEL CORP | LEAD FREE, FBGA-672 | e1 | 锡银铜 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 434 | 不合格 | 450 | 3182 CLBS | 2.6 mm | 现场可编程门阵列 | 3182 | 50528 | 27 mm | 27 mm | ||||||||||
![]() | 5CGXFC5C7F23C6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 活跃 | INTEL CORP | ROHS COMPLIANT, FBGA-484 | 85 °C | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 240 | OTHER | 240 | 2908 CLBS | 2 mm | 现场可编程门阵列 | 23 mm | 23 mm | |||||||||||||||
![]() | EP1SGX25DF1020C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1020 | BGA, | 4.7 MHz | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1020 | 607 | 不合格 | OTHER | 607 | 2566 CLBS | 3.5 mm | 现场可编程门阵列 | 9.48 ns | 33 mm | 33 mm | ||||||||||
![]() | EP2S180F1020I5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1020 | INTEL CORP | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1020,32X32,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 无 | 活跃 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1020 | 734 | 不合格 | 742 | 现场可编程门阵列 | 179400 | ||||||||||||||
![]() | 10AS066N4F40E3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | FBGA-1517 | 100 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 588 | OTHER | 588 | 25168 CLBS | 3.5 mm | 现场可编程门阵列 | 25168 | 660000 | 40 mm | 40 mm | ||||||||||||
![]() | 10AS066N4F40I3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | INTEL CORP | FBGA-1517 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 588 | INDUSTRIAL | 588 | 25168 CLBS | 3.5 mm | 现场可编程门阵列 | 25168 | 660000 | 40 mm | 40 mm | |||||||||||
![]() | EP2C50F672I7N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | 网格排列 | 1.25 V | 1.15 V | 1.2 V | LEAD FREE, FBGA-672 | INTEL CORP | 活跃 | 有 | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | e1 | 锡银铜 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 434 | 不合格 | 450 | 3182 CLBS | 2.6 mm | 现场可编程门阵列 | 3182 | 50528 | 27 mm | 27 mm | ||||||||||
![]() | 10AS057N4F40I3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | INTEL CORP | FBGA-1517 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 588 | INDUSTRIAL | 588 | 21708 CLBS | 3.5 mm | 现场可编程门阵列 | 21708 | 570000 | 40 mm | 40 mm |
EP1M350B780C7
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S10F1508I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S20F1508C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SGX290HF35I2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C6F256I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C4F400I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C3T144C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S30F1508C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C6Q240I6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS032H4F34I3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C3T144I6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX016E4F29M3LG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS066H4F34I3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S40F1508I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M08SCM153A7G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5SGXEA5H2F35I2
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S25F1508C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C50F672I6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CGXFC5C7F23C6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1SGX25DF1020C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2S180F1020I5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS066N4F40E3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS066N4F40I3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C50F672I7N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS057N4F40I3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
