品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 温度等级 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 长度 | 宽度 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | EP1C4F324I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | INTEL CORP | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 19 mm | 19 mm | ||||||||||||||
![]() | EP3SL110F780I2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 活跃 | INTEL CORP | BGA, BGA780,28X28,40 | 100 MHz | 100 °C | -40 °C | PLASTIC | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.15 V | 1.05 V | 1.1 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 488 | 不合格 | 488 | 4300 CLBS | 现场可编程门阵列 | 4300 | 107500 | ||||||||||||
![]() | EP1C12F256I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | INTEL CORP | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 17 mm | 17 mm | ||||||||||||||
![]() | EP20K200CP240I8 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | INTEL CORP | , | 8542.39.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||
![]() | 10AX115S2F45I2VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 有 | 活跃 | INTEL CORP | 8542.39.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||
![]() | EP1C12Q240I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | INTEL CORP | 34.60 X 34.60 MM, 0.50 PITCH, PLASTIC, LEAD FREE, QFP-240 | 275 MHz | 3 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G240 | 不合格 | 12060 CLBS | 4.1 mm | 现场可编程门阵列 | 12060 | 32 mm | 32 mm | ||||||||||||||
![]() | 5CEBA7F23C6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 网格排列 | SQUARE | BGA484,22X22,40 | BGA | PLASTIC/EPOXY | 85 °C | ROHS COMPLIANT, FBGA-484 | INTEL CORP | 活跃 | 1.1 V | 1.07 V | 1.13 V | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 240 | OTHER | 240 | 5648 CLBS | 2 mm | 现场可编程门阵列 | 23 mm | 23 mm | ||||||||||||||||
![]() | EP1C4F324C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | INTEL CORP | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 19 mm | 19 mm | ||||||||||||||
![]() | EP2S180F1508I5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 1.15 V | 1.25 V | 网格排列 | SQUARE | BGA1508,39X39,40 | BGA | PLASTIC/EPOXY | -40 °C | 100 °C | 3 | INTEL CORP | 活跃 | 无 | 1.2 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 1162 | 不合格 | 1170 | 现场可编程门阵列 | 179400 | |||||||||||||||
![]() | EP4SE820H40I2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | 网格排列 | 活跃 | INTEL CORP | HBGA-1517 | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 325220 CLBS | 3.8 mm | 现场可编程门阵列 | 325220 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||
![]() | EP2C35F672I7 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | FBGA-672 | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 459 | 不合格 | 475 | 2100 CLBS | 2.6 mm | 现场可编程门阵列 | 2100 | 33216 | 27 mm | 27 mm | |||||||||||
![]() | EP1S20F1508I5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 活跃 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | 现场可编程门阵列 | 1846 | 18460 | 40 mm | 40 mm | ||||||||||||||
![]() | EP1C20F400I6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 400 | INTEL CORP | 21 X 21 MM, 1.00 MM PITCH, LEAD FREE, FBGA-400 | 405 MHz | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B400 | 不合格 | 20060 CLBS | 2.2 mm | 现场可编程门阵列 | 20060 | 21 mm | 21 mm | ||||||||||||||
![]() | EP1C3T144C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | INTEL CORP | LFQFP, | 405 MHz | 3 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G144 | 不合格 | 2910 CLBS | 1.6 mm | 现场可编程门阵列 | 2910 | 20 mm | 20 mm | ||||||||||||||
![]() | 5AGXBA7D6F35I5N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 活跃 | INTEL CORP | FBGA-1152 | 100 °C | -40 °C | PLASTIC/EPOXY | HBGA | BGA1152,34X34,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1.13 V | 1.07 V | 1.1 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 544 | INDUSTRIAL | 544 | 9168 CLBS | 2.7 mm | 现场可编程门阵列 | 9168 | 242000 | 35 mm | 35 mm | ||||||||||
![]() | 5CEFA9F27C6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | INTEL CORP | ROHS COMPLIANT, FBGA-672 | 85 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 有 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 未说明 | S-PBGA-B672 | 336 | 不合格 | OTHER | 336 | 11356 CLBS | 2 mm | 现场可编程门阵列 | 301000 | 27 mm | 27 mm | |||||||||||
![]() | EP1C12F324I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | INTEL CORP | 19 X 19 MM, 1.0 MM PITCH, LEAD FREE, FBGA-324 | 275 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 19 mm | 19 mm | ||||||||||||||
![]() | HC20K1500BC652 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 652 | INTEL CORP | BGA, BGA652,35X35,50 | 85 °C | PLASTIC/EPOXY | BGA | BGA652,35X35,50 | SQUARE | 网格排列 | 1.89 V | 1.71 V | 1.8 V | 无 | 活跃 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1.27 mm | compliant | S-PBGA-B652 | 480 | 不合格 | OTHER | 480 | 现场可编程门阵列 | 5184 | 51840 | ||||||||||||||
![]() | EP3SL340F1760I2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | 无 | 活跃 | INTEL CORP | BGA, BGA1760,42X42,40 | 100 MHz | 1 | 100 °C | -40 °C | PLASTIC | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 1.15 V | 1.05 V | 1.1 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1760 | 1120 | 不合格 | 1120 | 13500 CLBS | 现场可编程门阵列 | 337500 | ||||||||||||
![]() | EP1C3T100I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | INTEL CORP | 16 X 16 MM, 0.50 MM PITCH, LEAD FREE, TQFP-100 | 275 MHz | 3 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 2910 CLBS | 1.2 mm | 现场可编程门阵列 | 2910 | 14 mm | 14 mm | ||||||||||||||
![]() | EP1S30F1508C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 3247 | 32470 | 40 mm | 40 mm | ||||||||||||||
![]() | EP1SGX25DF1020C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1020 | INTEL CORP | BGA, | 6 MHz | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.5 V | 1.425 V | 1.575 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1020 | 607 | 不合格 | OTHER | 607 | 2566 CLBS | 3.5 mm | 现场可编程门阵列 | 7.49 ns | 33 mm | 33 mm | |||||||||||
![]() | EP4S100G5F45C2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1932 | LEAD FREE, FBGA-1932 | 800 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA1932,44X44,40 | SQUARE | 网格排列 | 0.95 V | 0.92 V | 0.98 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B | 781 | OTHER | 781 | 21248 CLBS | 3.6 mm | 现场可编程门阵列 | 212480 | 531200 | 45 mm | 45 mm | |||||||||||||
![]() | EP1C3T100I6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | INTEL CORP | 16 X 16 MM, 0.50 MM PITCH, LEAD FREE, TQFP-100 | 405 MHz | 3 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 2910 CLBS | 1.2 mm | 现场可编程门阵列 | 2910 | 14 mm | 14 mm | ||||||||||||||
![]() | 5AGZME1E2H29I3L | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 2020-06-17 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.18 V | 1.12 V | 1.15 V | 活跃 | INTEL CORP | HBGA-780 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 414 | INDUSTRIAL | 414 | 8302 CLBS | 3.6 mm | 现场可编程门阵列 | 8302 | 220000 | 33 mm | 33 mm |
EP1C4F324I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SL110F780I2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F256I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP20K200CP240I8
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX115S2F45I2VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12Q240I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CEBA7F23C6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C4F324C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2S180F1508I5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SE820H40I2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C35F672I7
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S20F1508I5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C20F400I6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C3T144C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGXBA7D6F35I5N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CEFA9F27C6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F324I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
HC20K1500BC652
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SL340F1760I2
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C3T100I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S30F1508C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1SGX25DF1020C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4S100G5F45C2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C3T100I6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGZME1E2H29I3L
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
