品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 时钟频率 | 传播延迟 | 输入数量 | 组织结构 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | LABs数量/ CLBs数量 | 输出功能 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 专用输入数量 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 5CGXFC9E6F35C7N | Intel | 数据表 | 2769 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 1152-BGA | YES | 560 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V GX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.07V~1.13V | BOTTOM | BALL | 1.1V | 1mm | 5CGXFC9 | S-PBGA-B1152 | 560 | 不合格 | 1.11.2/3.32.5V | 560 | 11356 CLBS | 现场可编程门阵列 | 301000 | 14251008 | 113560 | 2.4mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||||||
![]() | EP3SE260H780C4N | Intel | 数据表 | 837 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 780-BBGA, FCBGA | YES | 488 | 0°C~85°C TJ | Tray | Stratix® III E | 活跃 | 3 (168 Hours) | 780 | 3A001.A.7.A | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | 8542.39.00.01 | 0.86V~1.15V | BOTTOM | BALL | 0.9V | 1mm | EP3SE260 | S-PBGA-B780 | 488 | 不合格 | 1.2/3.3V | 717MHz | 488 | 现场可编程门阵列 | 255000 | 16672768 | 10200 | 3.5mm | 33mm | 33mm | 符合RoHS标准 | ||||||||||||||||
![]() | EPF10K130EBI356-2 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 356-LBGA | YES | 274 | -40°C~85°C TA | Tray | FLEX-10KE® | e0 | Obsolete | 3 (168 Hours) | 356 | 3A991 | TIN/LEAD (SN63PB37) | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | 220 | 2.5V | 1.27mm | compliant | 30 | EPF10K130 | S-PBGA-B356 | 274 | 不合格 | 2.52.5/3.3V | 0.5 ns | 274 | 可加载 PLD | 6656 | 65536 | 342000 | 832 | MIXED | 1.63mm | 35mm | 35mm | Non-RoHS Compliant | |||||||||||
![]() | EP20K100EFC144-2N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-BGA | YES | 93 | 0°C~85°C TJ | Tray | APEX-20KE® | e1 | Obsolete | 3 (168 Hours) | 144 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.71V~1.89V | BOTTOM | BALL | 260 | 1.8V | 1mm | compliant | 40 | EP20K100 | S-PBGA-B144 | 85 | 不合格 | 1.81.8/3.3V | 160MHz | 2.02 ns | 85 | 可加载 PLD | 4160 | 53248 | 263000 | 416 | MACROCELL | 4 | 1.7mm | 13mm | 13mm | 符合RoHS标准 | |||||||||
![]() | EP1AGX60EF1152I6N | Intel | 数据表 | 3000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 1152-BBGA, FCBGA | YES | 514 | -40°C~100°C TJ | Tray | Arria GX | e1 | 活跃 | 3 (168 Hours) | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 未说明 | EP1AGX60 | S-PBGA-B1152 | 514 | 不合格 | 1.22.5/3.3V | 640MHz | 514 | 现场可编程门阵列 | 60100 | 2528640 | 3005 | 3.5mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||
![]() | EP20K600CB652C7 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 652-BGA | YES | 488 | 0°C~85°C TJ | Tray | APEX-20KC® | e0 | Obsolete | 3 (168 Hours) | 652 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.71V~1.89V | BOTTOM | BALL | 220 | 1.8V | 1.27mm | compliant | 30 | EP20K600 | S-PBGA-B652 | 480 | 不合格 | 1.81.8/3.3V | 1.48 ns | 480 | 可加载 PLD | 24320 | 311296 | 1537000 | 2432 | MACROCELL | 4 | 2mm | 45mm | 45mm | Non-RoHS Compliant | ||||||||||
![]() | EP2AGX45DF25I5N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 572-BGA, FCBGA | YES | 252 | -40°C~100°C TJ | Tray | Arria II GX | e1 | Obsolete | 3 (168 Hours) | 572 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.87V~0.93V | BOTTOM | BALL | 260 | 0.9V | 1mm | 40 | EP2AGX45 | S-PBGA-B572 | 252 | 不合格 | 0.91.2/3.31.52.5V | 500MHz | 252 | 现场可编程门阵列 | 42959 | 3517440 | 1805 | 2.2mm | 25mm | 25mm | 符合RoHS标准 | ||||||||||||||
![]() | EPF10K100EQC240-3 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 240-BQFP | YES | 189 | 0°C~70°C TA | Tray | FLEX-10KE® | e0 | Obsolete | 3 (168 Hours) | 240 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EPF10K100 | S-PQFP-G240 | 189 | 不合格 | 2.52.5/3.3V | 140MHz | 0.7 ns | 189 | 可加载 PLD | 4992 | 49152 | 257000 | 624 | MIXED | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | |||||||||||
![]() | EP3C25U256C8 | Intel | 数据表 | 23 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 256-LFBGA | YES | 156 | 0°C~85°C TJ | Tray | Cyclone® III | e0 | 活跃 | 3 (168 Hours) | 256 | 3A991 | 锡铅 | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 235 | 1.2V | 0.8mm | 30 | EP3C25 | S-PBGA-B256 | 156 | 不合格 | 472.5MHz | 156 | 现场可编程门阵列 | 24624 | 608256 | 1539 | 1.5mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||
![]() | EP4SGX110FF35I3N | Intel | 数据表 | 122 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | YES | 372 | -40°C~100°C TJ | Tray | Stratix® IV GX | e1 | Obsolete | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.87V~0.93V | BOTTOM | BALL | 245 | 0.9V | 1mm | 40 | EP4SGX110 | S-PBGA-B1152 | 372 | 不合格 | 0.91.2/31.52.5V | 717MHz | 372 | 现场可编程门阵列 | 105600 | 9793536 | 4224 | 3.4mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||||
![]() | EP3C16E144C8 | Intel | 数据表 | 33 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 144-LQFP Exposed Pad | YES | 84 | 0°C~85°C TJ | Tray | 2009 | Cyclone® III | e0 | 活跃 | 3 (168 Hours) | 144 | 3A991 | 锡铅 | 8542.39.00.01 | 1.15V~1.25V | QUAD | 鸥翼 | 220 | 1.2V | 0.4mm | 30 | EP3C16 | S-PQFP-G144 | 84 | 不合格 | 472.5MHz | 84 | 现场可编程门阵列 | 15408 | 516096 | 963 | 1.65mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||
![]() | EP2AGX65DF25I5N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 572-BGA, FCBGA | YES | 252 | -40°C~100°C TJ | Tray | Arria II GX | e1 | Obsolete | 3 (168 Hours) | 572 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.87V~0.93V | BOTTOM | BALL | 260 | 0.9V | 1mm | 40 | EP2AGX65 | S-PBGA-B572 | 252 | 不合格 | 0.91.2/3.31.52.5V | 500MHz | 252 | 现场可编程门阵列 | 60214 | 5371904 | 2530 | 2.2mm | 25mm | 25mm | 符合RoHS标准 | ||||||||||||||
![]() | EP4SGX360KF43C4N | Intel | 数据表 | 933 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 1760-BBGA, FCBGA | YES | 880 | 0°C~85°C TJ | Tray | Stratix® IV GX | e1 | 活跃 | 3 (168 Hours) | 3A001.A.7.A | 锡银铜 | 8542.39.00.01 | 0.87V~0.93V | BOTTOM | BALL | 245 | 0.9V | 1mm | 40 | EP4SGX360 | S-PBGA-B1760 | 880 | 不合格 | 0.91.2/31.52.5V | 717MHz | 880 | 现场可编程门阵列 | 353600 | 23105536 | 14144 | 3.7mm | 42.5mm | 42.5mm | 符合RoHS标准 | ||||||||||||||
![]() | EP3C80F780I7 | Intel | 数据表 | 2354 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 780-BGA | YES | 429 | -40°C~100°C TJ | Tray | Cyclone® III | e0 | 活跃 | 3 (168 Hours) | 780 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 220 | 1.2V | 1mm | 30 | EP3C80 | S-PBGA-B780 | 429 | 不合格 | 472.5MHz | 429 | 现场可编程门阵列 | 81264 | 2810880 | 5079 | 2.4mm | 29mm | 29mm | 符合RoHS标准 | ||||||||||||||
![]() | EP1S30F780C6 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 780-BBGA, FCBGA | YES | 597 | 0°C~85°C TJ | Tray | Stratix® | e0 | Obsolete | 3 (168 Hours) | 780 | 3A001.A.7.A | 锡铅 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 220 | 1.5V | 1mm | 30 | EP1S30 | S-PBGA-B780 | 726 | 不合格 | 1.51.5/3.3V | 726 | 3819 CLBS | 现场可编程门阵列 | 32470 | 3317184 | 3247 | 3819 | 3.5mm | 29mm | 29mm | Non-RoHS Compliant | |||||||||||||
![]() | EPF8282ALC84-3 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | 0°C~70°C TA | Tray | FLEX 8000 | e0 | Obsolete | 3 (168 Hours) | 84 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 4.75V~5.25V | QUAD | J BEND | 220 | 5V | 1.27mm | compliant | 30 | EPF8282 | S-PQCC-J84 | 64 | 不合格 | 5V | 385MHz | 68 | 可加载 PLD | 208 | 2500 | 26 | REGISTERED | 208 | 4 | 5.08mm | 29.3116mm | 29.3116mm | Non-RoHS Compliant | ||||||||||
![]() | EPF10K100EQC240-2X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 240-BQFP | YES | 189 | 0°C~70°C TA | Tray | FLEX-10KE® | e0 | Obsolete | 3 (168 Hours) | 240 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EPF10K100 | S-PQFP-G240 | 189 | 不合格 | 2.52.5/3.3V | 140MHz | 0.5 ns | 189 | 可加载 PLD | 4992 | 49152 | 257000 | 624 | MIXED | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | |||||||||||
![]() | EPF10K200SBC600-2 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 600-BGA | YES | 470 | 0°C~70°C TA | Tray | FLEX-10KS® | e0 | Obsolete | 3 (168 Hours) | 600 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | 220 | 2.5V | 1.27mm | compliant | 30 | EPF10K200 | S-PBGA-B600 | 470 | 不合格 | 2.52.5/3.3V | 0.6 ns | 470 | 可加载 PLD | 9984 | 98304 | 513000 | 1248 | MIXED | 1.93mm | 45mm | 45mm | Non-RoHS Compliant | |||||||||||
![]() | EP2S130F1020C5 | Intel | 数据表 | 164 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1020-BBGA | YES | 742 | 0°C~85°C TJ | Tray | Stratix® II | e0 | 不用于新设计 | 3 (168 Hours) | 3A001.A.7.A | 锡铅 | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 220 | 1.2V | 1mm | 30 | EP2S130 | S-PBGA-B1020 | 734 | 不合格 | 1.21.5/3.33.3V | 640MHz | 742 | 53016 CLBS | 现场可编程门阵列 | 132540 | 6747840 | 6627 | 5.962 ns | 53016 | 3.5mm | 33mm | 33mm | Non-RoHS Compliant | ||||||||||||
![]() | EP20K60EFC324-2 | Intel | 数据表 | 1608 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 324-BGA | YES | 196 | 0°C~85°C TJ | Tray | APEX-20KE® | e0 | Obsolete | 3 (168 Hours) | 324 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.71V~1.89V | BOTTOM | BALL | 220 | 1.8V | 1mm | compliant | 30 | EP20K60 | S-PBGA-B324 | 188 | 不合格 | 1.81.8/3.3V | 160MHz | 2.41 ns | 188 | 可加载 PLD | 32768 | 162000 | 2560 | MACROCELL | 4 | 3.5mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||
![]() | EP20K60EFC144-2X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-BGA | YES | 93 | 0°C~85°C TJ | Tray | APEX-20KE® | e0 | Obsolete | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.71V~1.89V | BOTTOM | BALL | 235 | 1.8V | 1mm | compliant | 30 | EP20K60 | S-PBGA-B144 | 85 | 不合格 | 1.81.8/3.3V | 160MHz | 2.41 ns | 85 | 可加载 PLD | 32768 | 162000 | 2560 | MACROCELL | 4 | 1.7mm | 13mm | 13mm | Non-RoHS Compliant | ||||||||||
![]() | EP1S20F484C6 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BBGA, FCBGA | YES | 361 | 0°C~85°C TJ | Tray | Stratix® | e0 | Obsolete | 3 (168 Hours) | 484 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 220 | 1.5V | 1mm | 30 | EP1S20 | S-PBGA-B484 | 586 | 不合格 | 1.51.5/3.3V | 586 | 2132 CLBS | 现场可编程门阵列 | 18460 | 1669248 | 1846 | 2132 | 3.5mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||
![]() | EPF8452AQC160-4 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 120 | 0°C~70°C TA | Tray | FLEX 8000 | e0 | Obsolete | 3 (168 Hours) | 160 | EAR99 | 锡铅 | 4.75V~5.25V | QUAD | 鸥翼 | 220 | 5V | 0.65mm | 30 | EPF8452 | S-PQFP-G160 | 116 | 不合格 | 3.3/55V | 357MHz | 120 | 可加载 PLD | 336 | 4000 | 42 | REGISTERED | 336 | 4 | 4.07mm | 28mm | 28mm | Non-RoHS Compliant | ||||||||||||
![]() | EP4CE10E22I8L | Intel | 数据表 | 16 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 144-LQFP Exposed Pad | YES | 91 | -40°C~100°C TJ | Tray | Cyclone® IV E | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅 | 8542.39.00.01 | 0.97V~1.03V | QUAD | 鸥翼 | 220 | 1V | 0.5mm | 30 | EP4CE10 | S-PQFP-G144 | 91 | 不合格 | 11.2/3.32.5V | 362MHz | 91 | 现场可编程门阵列 | 10320 | 423936 | 645 | 645 | 1.65mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||
![]() | EP2C20Q240C8 | Intel | 数据表 | 2256 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 240-BFQFP | YES | 142 | 0°C~85°C TJ | Tray | Cyclone® II | e0 | 活跃 | 3 (168 Hours) | 240 | 3A991 | 锡铅 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 1.15V~1.25V | QUAD | 鸥翼 | 220 | 1.2V | 0.5mm | 30 | EP2C20 | S-PQFP-G240 | 126 | 不合格 | 1.21.5/3.33.3V | 402.5MHz | 142 | 现场可编程门阵列 | 18752 | 239616 | 1172 | 4.1mm | 32mm | 32mm | Non-RoHS Compliant |
5CGXFC9E6F35C7N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SE260H780C4N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EPF10K130EBI356-2
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP20K100EFC144-2N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1AGX60EF1152I6N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP20K600CB652C7
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2AGX45DF25I5N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EPF10K100EQC240-3
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C25U256C8
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SGX110FF35I3N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C16E144C8
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2AGX65DF25I5N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SGX360KF43C4N
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C80F780I7
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S30F780C6
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EPF8282ALC84-3
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EPF10K100EQC240-2X
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EPF10K200SBC600-2
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2S130F1020C5
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP20K60EFC324-2
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP20K60EFC144-2X
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S20F484C6
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EPF8452AQC160-4
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4CE10E22I8L
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C20Q240C8
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
