品牌是'Intel' (1712)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 包装/外壳 | 供应商器件包装 | 材料 | 厂商 | 操作温度 | 包装 | 系列 | 容差 | 终端 | 行数 | 电容量 | 子类别 | 螺距 | 技术 | 方向 | 深度 | 终端样式 | 接头数量 | 房屋颜色 | 电介质 | 配置 | 弱电 | 电路数量 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 测试电流 | 产品类别 | 主要属性 | 齐纳电流 | 闪光大小 | 产品 | 特征 | 产品类别 | 高度 | 长度 | 宽度 | 可燃性等级 | |||||||||||||||||||||||||||
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![]() | AGIB027R29A1E2VR0 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 1 | 3-1192074-9 | TE Connectivity | TE Connectivity / Raychem | N | 720 | Tray | 0°C ~ 100°C (TJ) | Tray | Agilex I | Circular Connectors | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Circular MIL Spec Strain Reliefs & Adapters | FPGA - 2.7M Logic Elements | - | Circular MIL Spec Strain Reliefs & Adapters | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R24C3E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 744 | Tray | 活跃 | 1 | TE Connectivity | TE Connectivity / Raychem | 0°C ~ 100°C (TJ) | Agilex F | 数据总线组件 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 数据总线微耦合器 | FPGA - 2.7M Logic Elements | - | Data Bus Components - Microcouplers | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA022R24C2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB022R31C2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 720 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX040HH3F35I3VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | 活跃 | TE Connectivity / AMP | TE Connectivity | 1000 | -40°C ~ 100°C (TJ) | Stratix® 10 SX | Wire & Cable Management | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Wire Labels & Markers | FPGA - 400K Logic Elements | - | Wire Labels & Markers | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX040HH3F35I2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1206 (3216 metric) | 1152-FBGA (35x35) | 100 VDC | Vishay / Vitramon | Details | Class 1 | 374 | Intel | Tray | 活跃 | 1206 | 3216 | 1.5 nF | + 125 C | 0.000952 oz | - 55 C | 15000 | 0.0015 uF | Vishay | -40°C ~ 100°C (TJ) | Reel | VJ W1BC Basic Comm | 1 % | Flexible (Soft) | 1500 pF | Capacitors | SMD/SMT | C0G (NP0) | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 陶瓷电容器 | FPGA - 400K Logic Elements | - | 通用型MLCC | Multilayer Ceramic Capacitors MLCC - SMD/SMT | 0.8 mm | 3.2 mm | 1.6 mm | |||||||||||||||||||||||||||||
![]() | AGIB023R18A2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | - | - | Intel | Tray | 活跃 | Non-Compliant | 480 | 0°C ~ 100°C (TJ) | Agilex I | Solder | 1 | 6.35 mm | 直角 | 18 | Black | Compliant | 18 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | UL94 V-0 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA019R25A2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Steel | Intel | Other | 480 | Tray | 活跃 | 无 | IP30 | Other | -40°C ~ 100°C (TJ) | Agilex F | 315 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | 1780 | 1215 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Intel | Non-Compliant | Bulk | 活跃 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA012R24C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGID023R18A2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 3000 | PCB 安装 | TT Electronics | Welwyn Components / TT Electronics | 480 | Tray | 活跃 | 1206 | 3216 | 0.000705 oz | 0°C ~ 100°C (TJ) | Reel | PWC | Resistors | 厚膜 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 厚膜电阻器 | FPGA - 2.3M Logic Elements | - | - | Thick Film Resistors - SMD | ||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB006R24C2I1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | SOT-23-3 | - | Panjit | Panjit | 22 V | Details | 576 | Intel | Tray | 活跃 | 0.1 uA | 55 Ohms | 0.1 uA | 300 mW | + 150 C | 0.000296 oz | - 55 C | 12000 | SMD/SMT | -40°C ~ 100°C (TJ) | Reel | Agilex F | Diodes & Rectifiers | 双共阳极 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 5 mA | 齐纳二极管 | FPGA - 573K Logic Elements | 0.1 uA | - | 齐纳二极管 | 1 mm | 3.04 mm | 1.4 mm | ||||||||||||||||||||||||||||||||
![]() | AGFC019R25A1I1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 0.000145 oz | 12000 | Panjit | Panjit | Details | 480 | Tray | -40°C ~ 100°C (TJ) | Reel | Agilex F | Diodes & Rectifiers | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Diodes - General Purpose, Power, Switching | FPGA - 1.9M Logic Elements | - | Diodes - General Purpose, Power, Switching | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB008R16A3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 384 | Tray | 活跃 | Advanced Energy | Advanced Energy | 1 | -40°C ~ 100°C (TJ) | Agilex F | DC-DC Converter | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Non-Isolated DC-DC Converters | FPGA - 764K Logic Elements | - | Non-Isolated DC/DC Converters | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA022R31C2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 720 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB022R24C2E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA022R31C3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 720 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA006R16A2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 384 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB006R16A2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 384 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA014R24C2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGIB022R31B2I1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 720 | Tray | -40°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX065HH2F35I2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 活跃 | 392 | Tray | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA014R24C3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFD023R25A3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 480 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R25A2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 624 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - |
AGIB027R29A1E2VR0
Intel
分类:Embedded - System On Chip (SoC)
AGFB027R24C3E3V
Intel
分类:Embedded - System On Chip (SoC)
AGFA022R24C2I3E
Intel
分类:Embedded - System On Chip (SoC)
AGFB022R31C2I3E
Intel
分类:Embedded - System On Chip (SoC)
1SX040HH3F35I3VG
Intel
分类:Embedded - System On Chip (SoC)
1SX040HH3F35I2VG
Intel
分类:Embedded - System On Chip (SoC)
AGIB023R18A2E3V
Intel
分类:Embedded - System On Chip (SoC)
AGFA019R25A2I3V
Intel
分类:Embedded - System On Chip (SoC)
10AS027
Intel
分类:Embedded - System On Chip (SoC)
AGFA012R24C2E3V
Intel
分类:Embedded - System On Chip (SoC)
AGID023R18A2E3E
Intel
分类:Embedded - System On Chip (SoC)
AGFB006R24C2I1V
Intel
分类:Embedded - System On Chip (SoC)
AGFC019R25A1I1V
Intel
分类:Embedded - System On Chip (SoC)
AGFB008R16A3I3E
Intel
分类:Embedded - System On Chip (SoC)
AGFA022R31C2I3V
Intel
分类:Embedded - System On Chip (SoC)
AGFB022R24C2E1V
Intel
分类:Embedded - System On Chip (SoC)
AGFA022R31C3E4X
Intel
分类:Embedded - System On Chip (SoC)
AGFA006R16A2I2V
Intel
分类:Embedded - System On Chip (SoC)
AGFB006R16A2E4F
Intel
分类:Embedded - System On Chip (SoC)
AGFA014R24C2E4F
Intel
分类:Embedded - System On Chip (SoC)
AGIB022R31B2I1V
Intel
分类:Embedded - System On Chip (SoC)
1SX065HH2F35I2VG
Intel
分类:Embedded - System On Chip (SoC)
AGFA014R24C3E4X
Intel
分类:Embedded - System On Chip (SoC)
AGFD023R25A3E4X
Intel
分类:Embedded - System On Chip (SoC)
AGFA027R25A2E3E
Intel
分类:Embedded - System On Chip (SoC)
