Intel的专用模块_正品采购_价格信息

品牌是'Intel' (20)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量		Date Of Intro																	JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	功能数量	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	电源电压-最大值(Vsup)	温度等级	电源电压-最小值(Vsup)	操作模式	电源电流-最大值	组织结构	座位高度-最大	内存宽度	待机电流-最大值	记忆密度	内存IC类型	混合内存类型	长度	宽度
RD38F2040W0YTQ0	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88		Obsolete	INTEL CORP	BGA	TFBGA, BGA88,8X12,32	65 ns	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V	无	e0	无	EAR99	锡铅	CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		88	R-PBGA-B88	不合格	1.95 V	OTHER	1.7 V	SYNCHRONOUS	0.035 mA	4MX16	1.2 mm	16	0.0001 A	67108864 bit	存储器电路	FLASH+PSRAM	10 mm	8 mm
RD38F3040L0YTQ0	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88		GRID ARRAY, THIN PROFILE, FINE PITCH	RECTANGULAR	BGA88,8X12,32	TFBGA	PLASTIC/EPOXY	-25 °C	85 °C	8000000	8388608 words	85 ns	TFBGA, BGA88,8X12,32	BGA	INTEL CORP	Obsolete	无	1.8 V	e0		EAR99	锡铅	CONTAINS 32M BIT PSRAM	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		88	R-PBGA-B88	不合格	2 V	OTHER	1.7 V	SYNCHRONOUS	0.035 mA	8MX16	1.2 mm	16	0.0001 A	134217728 bit	存储器电路	FLASH+PSRAM	10 mm	8 mm
PF38F4050M0Y1Q0	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88	Transferred	INTEL CORP	BGA	TFBGA, BGA107,9X12,32	70 ns	3	67108864 words	64000000	PLASTIC/EPOXY	TFBGA	BGA107,9X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V	有		e1		EAR99	锡银铜	FLASH IS ALSO ORGANIZED AS 32M X 16 AND 64M X 16, PSEUDO SRAM IS ORGANIZED AS 4M X 16 OR 8M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		88	R-PBGA-B88	不合格	1.95 V		1.7 V	SYNCHRONOUS		64MX16	1.2 mm	16	0.00025 A	1073741824 bit	存储器电路	FLASH+PSRAM	10 mm	8 mm
RD28F1602C3T90	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	66	INTEL CORP	BGA	LFBGA, BGA68,8X12,32	90 ns	1048576 words	1000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	BGA68,8X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	Obsolete				EAR99		SRAM IS ORGANIZED AS 256K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown		66	R-PBGA-B66	不合格	3.3 V	商业扩展	2.7 V	ASYNCHRONOUS	0.055 mA	1MX16	1.4 mm	16	0.000035 A	16777216 bit	存储器电路	FLASH+SRAM	10 mm	8 mm
PF28F1602C3TD70	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	66		Obsolete	INTEL CORP	BGA	LFBGA, BGA66,8X12,32	70 ns	1048576 words	1000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	BGA66,8X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	有			EAR99		SRAM IS ORGANIZED AS 256K X 16	8542.32.00.71	BOTTOM	BALL	未说明	1	0.8 mm	compliant	未说明	66	R-PBGA-B66	不合格	3.3 V	商业扩展	2.7 V	ASYNCHRONOUS	0.05 mA	1MX16	1.4 mm	16	0.000005 A	16777216 bit	存储器电路	FLASH+SRAM	10 mm	8 mm
PF38F2040W0YTQ0	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88	有		Transferred	INTEL CORP	BGA	TFBGA, BGA88,8X12,32	70 ns	3	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V	e1		EAR99	锡银铜	CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		88	R-PBGA-B88	不合格	1.95 V	OTHER	1.7 V	SYNCHRONOUS	0.055 mA	4MX16	1.2 mm	16	0.000045 A	67108864 bit	存储器电路	FLASH+PSRAM+SRAM	10 mm	8 mm
SSDSC2KB480G701	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2018-07-27	,			Obsolete	INTEL CORP			EAR99			8542.32.00.71						compliant															存储器电路
RD38F3352LLZDQ0	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88		Obsolete	INTEL CORP	BGA	LFBGA, BGA88,8X12,32	85 ns	8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	1.8 V	无	e0		EAR99	锡铅	ALSO CONTAINS 128M BIT FLASH; CONTAINS 64M BIT PSRAM; CONTAINS 8 M BIT SRAM	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		88	R-PBGA-B88	不合格	2 V	OTHER	1.7 V	SYNCHRONOUS	0.045 mA	8MX16	1.4 mm	16	0.00015 A	134217728 bit	存储器电路	FLASH+PSRAM	13 mm	11 mm
PF38F4470LLYBB0	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1
SSDSC2KB240G8	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1
RD38F2030W0ZTQ0	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88		Obsolete	INTEL CORP	BGA	TFBGA, BGA88,8X12,32	70 ns	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V	无	e0	无	EAR99	锡铅	CONTAINS 16 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		88	R-PBGA-B88	不合格	1.95 V	OTHER	1.7 V	SYNCHRONOUS	0.055 mA	4MX16	1.2 mm	16	0.000015 A	67108864 bit	存储器电路	FLASH+SRAM	10 mm	8 mm
SSDSC2KB240G801	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1
SSDPE2KX040T807	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1			Obsolete		INTEL CORP												compliant															存储器电路
SSDSC2KG019T701	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2018-07-27	,			Obsolete	INTEL CORP			EAR99			8542.32.00.71						compliant															存储器电路
SSDSC2BA800G401	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2018-07-27	INTEL CORP			活跃			EAR99			8542.32.00.71						compliant															存储器电路
SSDSC2KB240G701	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2018-07-23	,			Obsolete	INTEL CORP			EAR99			8542.32.00.71						compliant															存储器电路
PF38F5060M0Y0B0	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	105		Transferred	INTEL CORP	BGA	TFBGA, BGA105,9X12,32	3	33554432 words	32000000	85 °C	-30 °C	PLASTIC/EPOXY	TFBGA	BGA105,9X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V	有	e1		EAR99	锡银铜	PSEUDO SRAM IS ORGANIZED AS 8M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		105	R-PBGA-B105	不合格	2 V	OTHER	1.7 V	SYNCHRONOUS		32MX16	1.2 mm	16	0.00012 A	536870912 bit	存储器电路	FLASH+PSRAM	11 mm	9 mm
RD28F3208C3T70	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	66		Obsolete	INTEL CORP	BGA	LFBGA, BGA68,8X12,32	70 ns	2097152 words	2000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	BGA68,8X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	无			EAR99		SRAM IS ORGANIZED AS 512K X 16	8542.32.00.71	BOTTOM	BALL	240	1	0.8 mm	compliant	30	66	R-PBGA-B66	不合格	3.3 V	商业扩展	2.7 V	ASYNCHRONOUS	0.055 mA	2MX16	1.4 mm	16	0.000006 A	33554432 bit	存储器电路	FLASH+SRAM	10 mm	8 mm
SSDSCKJR150G7XA	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2018-07-27	RECTANGULAR			活跃	INTEL CORP	PACKAGE	161061273600 words	150000000000	70 °C	UNSPECIFIED			EAR99			8542.32.00.71				1		compliant						COMMERCIAL		ASYNCHRONOUS		150GX8		8		1288490188800 bit	存储器电路
RD28F3204W30B70	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	80	LFBGA,	2097152 words	2000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	1.8 V	Obsolete		INTEL CORP	BGA			EAR99		SRAM IS CONFIGURED AS 256K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown		80	R-PBGA-B80	不合格	1.9 V	OTHER	1.7 V	SYNCHRONOUS		2MX16	1.4 mm	16		33554432 bit	存储器电路		14 mm	8 mm