2476 In Stock

• 1: ¥1,366.225896
• 10: ¥1,288.892356
• 100: ¥1,215.936182
• 500: ¥1,147.109610
查看所有的价格

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

30

267

Tray

M2GL060

活跃

56520 LE

+ 85 C

0 C

SMD/SMT

1.14 V

M2GL060T-FGG484

有

活跃

MICROSEMI CORP

BGA,

5.26

3

85 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.26 V

1.2 V

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

1.2 V

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

23 mm

23 mm

2159 In Stock

• 1: ¥3,156.452703
• 10: ¥2,977.785570
• 100: ¥2,809.231666
• 500: ¥2,650.218557
查看所有的价格

-

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

M2S150-1FCG1152

活跃

MICROSEMI CORP

微芯片技术

1.26 V

1.2 V

40

574

Tray

M2S150

活跃

-

166 MHz

146124 LE

SMD/SMT

-

64 kB

1.14 V

FBGA-1152

5.77

4

85 °C

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

有

0°C ~ 85°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

1 Core

512KB

35 mm

35 mm

159 In Stock

• 1: ¥549.907772
• 10: ¥518.780916
• 100: ¥489.415956
• 500: ¥461.713170
查看所有的价格

-

Production (Last Updated: 2 months ago)

256-LBGA

YES

256-FPBGA (17x17)

256

MICROSEMI CORP

LFBGA, BGA256,16X16,32

5.8

微芯片技术

3

85 °C

PLASTIC/EPOXY

1.2000 V

Non-Compliant

138

Tray

M2S010

活跃

-

166 MHz

12084 LE

-

64 kB

1.14 V

LFBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

1.2 V

40

M2S010TS-VFG256

有

活跃

0 to 85 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

STD

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

2584 In Stock

• 1: ¥1,564.101509
• 10: ¥1,475.567460
• 100: ¥1,392.044774
• 500: ¥1,313.249790
查看所有的价格

-

484-BGA

YES

484-FPBGA (23x23)

484

BGA484,22X22,40

SQUARE

网格排列

微芯片技术

1.26 V

1.2 V

40

267

Tray

M2S050

活跃

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

1.14 V

M2S050-1FGG484

有

活跃

MICROSEMI CORP

FBGA-484

5.76

3

85 °C

PLASTIC/EPOXY

BGA

0°C ~ 85°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

23 mm

23 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

896

400.011771 mg

896

M1AGLE3000V2-FG896

无

Obsolete

MICROSEMI CORP

FBGA-896

5.88

3

70 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

20

620

Compliant

1.425 V

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B896

不合格

1.5 V

COMMERCIAL

1.575 V

1.14 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

3e+06

892.86 MHz

75264

75264

3000000

1.73 mm

29 mm

29 mm

无

N/A

-

YES

256

1.575 V

1.2 V

30

1.14 V

M1A3P600L-1FG256I

无

Obsolete

MICROSEMI CORP

BGA, BGA256,16X16,40

5.26

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

网格排列

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

177

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

13824

600000

17 mm

17 mm

2403 In Stock

• 1: ¥1,232.471214
• 10: ¥1,162.708689
• 100: ¥1,096.894997
• 500: ¥1,034.806597
查看所有的价格

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

活跃

1.14 V

56520 LE

+ 100 C

- 40 C

SMD/SMT

M2GL060T-1FCS325I

无

活跃

MICROSEMI CORP

BGA,

5.26

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.26 V

1.2 V

20

200

Tray

M2GL060

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

1.2 V

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

YES

484

40

1.5 V

1.575 V

网格排列

SQUARE

BGA

PLASTIC/EPOXY

85 °C

3

350 MHz

5.25

BGA,

MICROSEMI CORP

Obsolete

有

M1A3P400-1FGG484

1.425 V

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

2.44 mm

现场可编程门阵列

9216

400000

23 mm

23 mm

N/A

-

484-BGA

YES

484-FPBGA (23x23)

484

BGA

BGA484,22X22,40

SQUARE

网格排列

1.26 V

微芯片技术

1.2 V

30

1.2000 V

1.14 V

1.26 V

233

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

1.14 V

M2S010T-1FG484I

无

活跃

MICROSEMI CORP

FBGA-484

5.84

3

PLASTIC/EPOXY

-40 to 100 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

9744

1 Core

256KB

23 mm

23 mm

11 In Stock

• 1: ¥373.797934
• 10: ¥352.639564
• 100: ¥332.678832
• 500: ¥313.847951
查看所有的价格

-

Production (Last Updated: 1 month ago)

256-LFBGA

YES

256-FPBGA (14x14)

256

1.2 V

微芯片技术

30

Non-Compliant

138

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

1.14 V

M2S010T-VF256I

无

活跃

MICROSEMI CORP

LFBGA, BGA256,16X16,32

5.81

PLASTIC/EPOXY

LFBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

-40°C ~ 100°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

2400 In Stock

• 1: ¥1,074.562806
• 10: ¥1,013.738494
• 100: ¥956.357073
• 500: ¥902.223655
查看所有的价格

-

400-LFBGA

YES

400-VFBGA (17x17)

400

1.2 V

30

M2S025T-1VF400

无

活跃

微芯片技术

MICROSEMI CORP

LFBGA, BGA400,20X20,32

5.3

1.2000 V

1.14 V

1.26 V

207

Tray

M2S025

活跃

-

166 MHz

27696 LE

SMD/SMT

-

64 kB

85 °C

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

1.14 V

0 to 85 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 25K Logic Modules

23988

1 Core

256KB

17 mm

17 mm

2502 In Stock

• 1: ¥1,573.103395
• 10: ¥1,484.059805
• 100: ¥1,400.056424
• 500: ¥1,320.807945
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

1.2 V

20

1.2000 V

1.14 V

1.26 V

377

Non-Compliant

Tray

M2GL050

活跃

1.14 V

M2GL050T-FG896

无

活跃

MICROSEMI CORP

BGA, BGA896,30X30,40

5.3

3

85 °C

PLASTIC/EPOXY

BGA

BGA896,30X30,40

SQUARE

网格排列

1.26 V

0 to 85 °C

IGLOO2

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

STD

56340

31 mm

31 mm

2400 In Stock

• 1: ¥851.812669
• 10: ¥803.596854
• 100: ¥758.110242
• 500: ¥715.198340
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484

484-FPBGA (23x23)

484

BGA484,22X22,40

BGA

PLASTIC/EPOXY

85 °C

微芯片技术

3

5.3

BGA, BGA484,22X22,40

267

Tray

M2GL025

活跃

有

This product may require additional documentation to export from the United States.

27696 LE

+ 85 C

0 C

60

SMD/SMT

Microchip Technology / Atmel

IGLOO2

N

1.14 V

M2GL025-FG484

无

活跃

MICROSEMI CORP

20

1.2 V

1.26 V

网格排列

SQUARE

0°C ~ 85°C (TJ)

Tray

IGLOO2

3A991.D

85 °C

0 °C

8542.31.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

256 kB

138 kB

667 Mb/s

267

2.44 mm

现场可编程门阵列

27696

FPGA - Field Programmable Gate Array

1130496

400 MHz

34

4 Transceiver

27696

FPGA - Field Programmable Gate Array

23 mm

23 mm

2183 In Stock

• 1: ¥789.073859
• 10: ¥744.409304
• 100: ¥702.272922
• 500: ¥662.521630
查看所有的价格

-

484-BGA

YES

484-FPBGA (23x23)

484

PLASTIC/EPOXY

BGA

BGA484,26X26,40

微芯片技术

SQUARE

网格排列

1.575 V

1.5 V

30

1.5000 V

1.425 V

200000

1.575 V

MCU - 41, FPGA - 94

Tray

A2F200

活跃

1.425 V

A2F200M3F-FGG484I

有

活跃

MICROSEMI CORP

BGA, BGA484,26X26,40

1.39

80 MHz

3

100 °C

-40 °C

-40 to 100 °C

SmartFusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

94

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

现场可编程门阵列

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

23 mm

23 mm

N/A

-

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

微芯片技术

1.5 V

20

MCU - 31, FPGA - 78

Tray

A2F200

活跃

1.425 V

A2F200M3F-CS288I

无

活跃

MICROSEMI CORP

TFBGA, BGA288,21X21,20

5.24

80 MHz

100 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA288,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.575 V

-40°C ~ 100°C (TJ)

SmartFusion®

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B288

78

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

4608 CLBS, 200000 GATES

1.05 mm

现场可编程门阵列

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

11 mm

11 mm

2996 In Stock

• 1: ¥1,607.856514
• 10: ¥1,516.845768
• 100: ¥1,430.986576
• 500: ¥1,349.987336
查看所有的价格

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

1.575 V

1.5 V

30

165

Tray

AGLE600

活跃

1.425 V

AGLE600V5-FG256I

无

活跃

MICROSEMI CORP

BGA, BGA256,16X16,40

5.3

250 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

网格排列

-40°C ~ 85°C (TA)

IGLOOe

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

165

不合格

1.5 V

INDUSTRIAL

165

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

13824

600000

17 mm

17 mm

N/A

-

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

GRID ARRAY, LOW PROFILE

3.6 V

3.3 V

40

3.3, 5 V

2.97, 4.5 V

3.63, 5.5 V

111

Compliant

Tray

A54SX08

活跃

3 V

A54SX08-1FGG144I

有

活跃

MICROSEMI CORP

1 MM PITCH, ROHS COMPLIANT, FBGA-144

5.24

280 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

-40 to 85 °C

SX

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

280 MHz

S-PBGA-B144

111

不合格

5 V

3.3,5 V

INDUSTRIAL

5.5 V

4.5 V

800 ps

800 ps

111

768 CLBS, 8000 GATES

1.55 mm

现场可编程门阵列

768

12000

280 MHz

768

768

1

256

0.8 ns

768

768

8000

1.05 mm

13 mm

13 mm

无

N/A

-

YES

484

2.75 V

2.5 V

30

2.25 V

A54SX32A-2FG484I

无

Obsolete

MICROSEMI CORP

1 MM PITCH, FBGA-484

5.3

313 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA484,26X26,40

SQUARE

网格排列

e0

Tin/Lead (Sn/Pb)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

249

不合格

2.5,2.5/5 V

INDUSTRIAL

249

2880 CLBS, 48000 GATES

2.44 mm

现场可编程门阵列

0.9 ns

2880

2880

48000

27 mm

27 mm

2707 In Stock

• 1: ¥2,511.272017
• 10: ¥2,369.124547
• 100: ¥2,235.023152
• 500: ¥2,108.512409
查看所有的价格

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

微芯片技术

GRID ARRAY, LOW PROFILE

1.575 V

1.5 V

30

97

Tray

A3P1000

活跃

1.425 V

Automotive grade

A3P1000-1FGG144T

有

活跃

MICROSEMI CORP

LBGA, BGA144,12X12,40

5.23

350 MHz

3

125 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

AUTOMOTIVE

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

AEC-Q100

24576

24576

1000000

13 mm

13 mm

2547 In Stock

• 1: ¥1,572.390848
• 10: ¥1,483.387592
• 100: ¥1,399.422253
• 500: ¥1,320.209673
查看所有的价格

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

活跃

有

AGL1000V5-FGG484

1.5000 V

1.425 V

1.575 V

300

Tray

AGL1000

活跃

40

1.5 V

1.425 V

1.575 V

网格排列

SQUARE

BGA

PLASTIC/EPOXY

85 °C

3

108 MHz

1.44

BGA,

MICROSEMI CORP

0 to 70 °C

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

不合格

OTHER

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

1152-BGA

YES

1152

1152-FPBGA (35x35)

400.011771 mg

1152

微芯片技术

40

684

Tray

AX2000

活跃

Compliant

1.425 V

Military grade

AX2000-1FGG1152M

有

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.29

763 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.575 V

1.5 V

-55°C ~ 125°C (TA)

Axcelerator

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

245

1 mm

compliant

S-PBGA-B1152

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

36 kB

850 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

763 MHz

32256

MIL-STD-883 Class B

1

21504

0.84 ns

21504

32256

2000000

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

30

300

Tray

AGL1000

活跃

1.425 V

AGL1000V5-FG484I

无

活跃

MICROSEMI CORP

BGA,

1.61

108 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

-40°C ~ 85°C (TA)

IGLOO

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B484

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

YES

144

2.75 V

2.5 V

30

2.25 V

A54SX08A-1FG144I

无

Obsolete

MICROSEMI CORP

LBGA, BGA144,12X12,40

5.28

278 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,3.3/5 V

INDUSTRIAL

111

768 CLBS, 12000 GATES

1.55 mm

现场可编程门阵列

1.1 ns

768

768

12000

13 mm

13 mm

N/A

-

表面贴装

289-TFBGA, CSBGA

YES

289-CSP (14x14)

289

微芯片技术

未说明

212

Tray

AGLP125

Obsolete

1.425 V

AGLP125V5-CS289I

无

活跃

MICROSEMI CORP

TFBGA, BGA289,17X17,32

1.64

250 MHz

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

-40°C ~ 100°C (TJ)

IGLOO PLUS

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.8 mm

unknown

S-PBGA-B289

212

不合格

1.5 V

INDUSTRIAL

212

3120 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3120

36864

125000

STD

3120

3120

125000

14 mm

14 mm

N/A

-

YES

256

PLASTIC/EPOXY

-40 °C

85 °C

2.25 V

3

294 MHz

5.32

BGA, BGA256,16X16,40

MICROSEMI CORP

Obsolete

无

A54SX16A-2FG256I

30

2.5 V

2.75 V

网格排列

SQUARE

BGA256,16X16,40

BGA

TIN LEAD/TIN LEAD SILVER

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

180

不合格

2.5,3.3/5 V

INDUSTRIAL

180

1452 CLBS, 24000 GATES

1.97 mm

现场可编程门阵列

1 ns

1452

1452

24000

17 mm

17 mm