N/A

-

484-BGA

YES

484-FPBGA (23x23)

484

1.26 V

微芯片技术

1.2 V

40

267

Tray

M2S050

活跃

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

1.14 V

M2S050-1FGG484

有

活跃

MICROSEMI CORP

FBGA-484

5.76

3

85 °C

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

0°C ~ 85°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

23 mm

23 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

896

400.011771 mg

896

Obsolete

MICROSEMI CORP

FBGA-896

5.88

3

70 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

20

620

Compliant

1.425 V

M1AGLE3000V2-FG896

无

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B896

不合格

1.5 V

COMMERCIAL

1.575 V

1.14 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

3e+06

892.86 MHz

75264

75264

3000000

1.73 mm

29 mm

29 mm

无

N/A

-

YES

256

1.14 V

M1A3P600L-1FG256I

无

Obsolete

MICROSEMI CORP

BGA, BGA256,16X16,40

5.26

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

网格排列

1.575 V

1.2 V

30

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

177

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

13824

600000

17 mm

17 mm

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

+ 100 C

- 40 C

SMD/SMT

M2GL060T-1FCS325I

无

活跃

MICROSEMI CORP

BGA,

5.26

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.26 V

1.2 V

20

200

Tray

M2GL060

活跃

1.14 V

56520 LE

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

1.2 V

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

YES

484

40

1.5 V

1.575 V

网格排列

SQUARE

BGA

PLASTIC/EPOXY

85 °C

3

350 MHz

5.25

BGA,

MICROSEMI CORP

Obsolete

有

M1A3P400-1FGG484

1.425 V

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

2.44 mm

现场可编程门阵列

9216

400000

23 mm

23 mm

N/A

-

484-BGA

YES

484-FPBGA (23x23)

484

网格排列

1.26 V

1.2 V

微芯片技术

30

1.2000 V

1.14 V

1.26 V

233

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

1.14 V

M2S010T-1FG484I

无

活跃

MICROSEMI CORP

FBGA-484

5.84

3

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

-40 to 100 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

9744

1 Core

256KB

23 mm

23 mm

N/A

-

Production (Last Updated: 1 month ago)

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

138

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

1.14 V

M2S010T-VF256I

无

活跃

MICROSEMI CORP

LFBGA, BGA256,16X16,32

5.81

PLASTIC/EPOXY

LFBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

1.2 V

30

Non-Compliant

-40°C ~ 100°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

N/A

-

400-LFBGA

YES

400-VFBGA (17x17)

400

无

活跃

MICROSEMI CORP

微芯片技术

LFBGA, BGA400,20X20,32

5.3

1.2000 V

1.14 V

1.26 V

207

Tray

M2S025

活跃

-

166 MHz

27696 LE

SMD/SMT

-

64 kB

85 °C

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

1.14 V

1.2 V

30

M2S025T-1VF400

0 to 85 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 25K Logic Modules

23988

1 Core

256KB

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

1.14 V

1.26 V

377

Non-Compliant

Tray

M2GL050

活跃

1.14 V

M2GL050T-FG896

无

活跃

MICROSEMI CORP

BGA, BGA896,30X30,40

5.3

3

85 °C

PLASTIC/EPOXY

BGA

BGA896,30X30,40

SQUARE

网格排列

1.26 V

1.2 V

20

1.2000 V

0 to 85 °C

IGLOO2

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

STD

56340

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484

484-FPBGA (23x23)

484

85 °C

3

微芯片技术

5.3

BGA, BGA484,22X22,40

267

Tray

M2GL025

活跃

有

This product may require additional documentation to export from the United States.

27696 LE

+ 85 C

0 C

60

SMD/SMT

Microchip Technology / Atmel

IGLOO2

N

1.14 V

M2GL025-FG484

无

活跃

MICROSEMI CORP

20

1.2 V

1.26 V

网格排列

SQUARE

BGA484,22X22,40

BGA

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

Tray

IGLOO2

3A991.D

85 °C

0 °C

8542.31.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

256 kB

138 kB

667 Mb/s

267

2.44 mm

现场可编程门阵列

27696

FPGA - Field Programmable Gate Array

1130496

400 MHz

34

4 Transceiver

27696

FPGA - Field Programmable Gate Array

23 mm

23 mm

N/A

-

微芯片技术

Programmable Logic Tools

Bulk

Obsolete

AGLP125

IGLOO PLUS

Programmable Logic Tools

Board(s), Cable(s), Power Supply, Programmer

无

无

N/A

-

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

1.2 V

40

Non-Compliant

200

Tray

M2S050

活跃

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

M2S050TS-FCSG325I

有

活跃

MICROSEMI CORP

FBGA-325

5.82

3

PLASTIC/EPOXY

TFBGA

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.26 V

1.14 V

-40°C ~ 100°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

N/A

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

M2GL090

活跃

86184 LE

+ 100 C

- 40 C

SMD/SMT

1.14 V

M2GL090TS-FGG676I

有

活跃

MICROSEMI CORP

27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-676

5.27

3

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

网格排列

1.26 V

1.2 V

30

425

Tray

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

425

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

12084 LE

+ 100 C

- 40 C

SMD/SMT

1.14 V

3

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

1.2 V

30

5.27

LFBGA,

MICROSEMI CORP

活跃

有

M2GL010T-1VFG256I

138

Tray

M2GL010

活跃

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484

484-FPBGA (23x23)

484

微芯片技术

Compliant

Tray

M2GL090

活跃

86184 LE

+ 85 C

0 C

SMD/SMT

1.14 V

M2GL090T-1FGG484

有

活跃

MICROSEMI CORP

BGA, BGA484,22X22,40

5.3

3

85 °C

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.26 V

1.2 V

30

267

0°C ~ 85°C (TJ)

IGLOO2

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

323.3 kB

267

2.44 mm

现场可编程门阵列

86316

2648064

1

4 Transceiver

86316

23 mm

23 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

M2GL150

活跃

1.14 V

146124 LE

+ 100 C

- 40 C

SMD/SMT

M2GL150-FCG1152I

有

活跃

MICROSEMI CORP

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

5.27

4

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.26 V

1.2 V

30

574

Tray

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

1.2 V

667 Mb/s

574

2.9 mm

现场可编程门阵列

146124

5120000

STD

16 Transceiver

146124

35 mm

35 mm

N/A

-

256-LBGA

YES

256-FPBGA (17x17)

256

1.2 V

微芯片技术

40

1.2000 V

138

Tray

M2S010

活跃

1.14 V

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

M2S010T-1VFG256I

有

活跃

MICROSEMI CORP

LFBGA, BGA256,16X16,32

5.77

3

PLASTIC/EPOXY

LFBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

-40 to 100 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

N/A

-

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

M2GL150-FCVG484

有

活跃

MICROSEMI CORP

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-484

5.27

4

85 °C

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

1.26 V

1.2 V

30

248

Tray

M2GL150

活跃

1.14 V

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

STD

19 mm

19 mm

N/A

-

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

SQUARE

网格排列

1.26 V

微芯片技术

1.2 V

40

1.2000 V

1.14 V

1.26 V

574

Tray

M2S150

活跃

-

166 MHz

146124 LE

-

64 kB

1.14 V

M2S150T-FCG1152

有

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.77

4

85 °C

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

0 to 85 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

1152

S-PBGA-B1152

574

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

STD

FPGA - 150K Logic Modules

146124

1 Core

512KB

35 mm

35 mm

N/A

-

表面贴装

VFBGA-256

YES

256-FPBGA (14x14)

256

1.26 V

1.2 V

微芯片技术

30

有

6060 LE

161 I/O

+ 85 C

0 C

119

SMD/SMT

Microchip Technology / Atmel

IGLOO2

Details

Tray

M2GL005

活跃

1.14 V

M2GL005-1VFG256

有

活跃

MICROSEMI CORP

LFBGA,

5.28

3

85 °C

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

0°C ~ 85°C (TJ)

Tray

M2GL005

可编程逻辑集成电路

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

-

1.56 mm

现场可编程门阵列

6060

FPGA - Field Programmable Gate Array

719872

-

FPGA - Field Programmable Gate Array

14 mm

14 mm

N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

1.2 V

30

微芯片技术

207

Tray

M2GL060

活跃

有

56520 LE

+ 100 C

0.299386 oz

- 40 C

90

SMD/SMT

Microchip Technology / Atmel

IGLOO2

Details

1.14 V

M2GL060-VFG400I

有

活跃

MICROSEMI CORP

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

5.25

3

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

-40°C ~ 100°C (TJ)

Tray

IGLOO2

8542.39.00.01

可编程逻辑集成电路

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.2 V

667 Mb/s

1.51 mm

现场可编程门阵列

56520

FPGA - Field Programmable Gate Array

1869824

STD

4 Transceiver

FPGA - Field Programmable Gate Array

17 mm

17 mm

N/A

-

表面贴装

VFBGA-256

YES

256-FPBGA (14x14)

256

1.2 V

20

微芯片技术

有

6060 LE

161 I/O

+ 100 C

0.321234 oz

- 40 C

119

SMD/SMT

Microchip Technology / Atmel

IGLOO2

N

Tray

M2GL005

活跃

1.14 V

M2GL005-VF256I

无

活跃

MICROSEMI CORP

LFBGA,

5.27

IC FPGA 161 I/O 256VFBGA

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

-40°C ~ 100°C (TJ)

Tray

M2GL005

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

可编程逻辑集成电路

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

-

1.56 mm

现场可编程门阵列

6060

FPGA - Field Programmable Gate Array

719872

STD

-

FPGA - Field Programmable Gate Array

14 mm

14 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

MICROSEMI CORP

活跃

无

M1A3P1000L-FG256I

1.2000 V

1.14 V

1.26 V

177

Tray

M1A3P1000

活跃

30

1.2 V

1.14 V

1.575 V

网格排列

SQUARE

BGA256,16X16,40

BGA

PLASTIC/EPOXY

-40 °C

85 °C

3

350 MHz

5.24

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

-40 to 85 °C

ProASIC3L

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

17 mm

17 mm

N/A

-

BGA-676

YES

676-FBGA (27x27)

676

BGA

BGA676,26X26,40

SQUARE

网格排列

1.26 V

1.2 V

微芯片技术

30

有

-

166 MHz

86316 LE

1.071118 oz

40

SMD/SMT

7193 LAB

Microchip Technology / Atmel

N

-

64 kB

425

Tray

M2S090

活跃

1.14 V

M2S090TS-1FG676I

无

活跃

MICROSEMI CORP

FBGA-676

5.29

3

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

425

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

SoC FPGA

FPGA - 90K Logic Modules

86316

1 Core

512KB

SoC FPGA

27 mm

27 mm

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

M2GL090TS-FCS325

无

活跃

MICROSEMI CORP

BGA, BGA325,21X21,20

5.27

85 °C

PLASTIC/EPOXY

BGA

BGA325,21X21,20

SQUARE

网格排列

1.26 V

1.2 V

20

180

Tray

M2GL090

活跃

1.14 V

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

180

现场可编程门阵列

86184

2648064

86316