N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

活跃

8542310000, 8542390000/8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000/8542390000

1.575 V

Details

-

154 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

350 MHz

有

24

110592 bit

ProASIC3

0.183425 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P600

0 to 70 °C

Tray

A3P600

70 °C

0 °C

1.425V ~ 1.575V

231 MHz

1.5 V

1.575 V

1.425 V

13.5 kB

5 mA

13.5 kB

6500

110592

600000

231 MHz

STD

13824

3.4 mm

28 mm

28 mm

无

无铅

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

活跃

SQUARE

FQFP

350 MHz

A3P1000-PQG208I

有

100 °C

40

1.5 V

-40 °C

PLASTIC/EPOXY

3

FLATPACK, FINE PITCH

FQFP,

Details

11000 LE

154 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

144 kbit

144 kbit

350 MHz

有

24

147456 bit

ProASIC3

1.399983 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P1000

活跃

1.575 V

1.32

MICROSEMI CORP

-40 to 85 °C

Tray

A3P1000

e3

3A001.A.7.A

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

75 mA

-

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

STD

-

24576

1000000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA-256

256-FBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

11000 LE

177 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

144 kbit

350 MHz

-

90

1 kbit

ProASIC3

1.5 V

Tray

A3P1000

活跃

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.14V ~ 1.575V

1.5 V

8 mA

700 Mb/s

147456

1000000

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

186 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

2.7 V

Tray

APA300

活跃

0°C ~ 70°C (TA)

Tray

APA300

2.3V ~ 2.7V

2.5 V

73728

300000

STD

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

COMMERCIALC

PLCC

24000

0C to 70C

72

微芯片技术

24000

608

0.45UM

5.25(V)

3.3/5(V)

无

3(V)

0C

有

608

928

表面贴装

5.25 V

Tube

A42MX16

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-PLG84

94 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

1.52

Details

608 LE

72 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

16

Actel

0.239083 oz

42MX

70C

0°C ~ 70°C (TA)

Tube

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

103/172(MHz)

84

S-PQCC-J84

不合格

3.3 V, 5 V

COMMERCIAL

-

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

STD

-

2.8 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

19

Actel

0.171777 oz

40MX

85C

INDUSTRIALC

PLCC

6000

微芯片技术

-40C to 85C

57

6000

547

0.45UM

5.5(V)

3.3/5(V)

无

3(V)

-40C

有

547

273

表面贴装

5.5 V

Tube

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

未说明

85 °C

有

A40MX04-PLG68I

80 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

Details

547 LE

57 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

139 MHz

有

547 LAB

-40°C ~ 85°C (TA)

Tube

A40MX04

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

未说明

1.27 mm

compliant

83/139(MHz)

68

S-PQCC-J68

不合格

3.3 V, 5 V

INDUSTRIAL

-

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

STD

-

2.7 ns

547

6000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.22

Details

660 LE

96 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

-

1

18432 bit

ProASIC3

1.575 V

Tray

A3P060

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P060-FGG144I

350 MHz

LBGA

-40°C ~ 100°C (TJ)

Tray

A3P060

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

15 mA

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

STD

1536

60000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

有

60

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3PE3000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

70 °C

有

A3PE3000L-FGG484

250 MHz

BGA

0 to 70 °C

Tray

A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

25 mA

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.34

This product may require additional documentation to export from the United States.

Details

11000 LE

97 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-55 °C

1.5 V

40

125 °C

有

A3P1000-FGG144M

-55°C ~ 125°C (TJ)

Tray

A3P1000

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5 V

1.5,1.5/3.3 V

MILITARY

8 mA

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

This product may require additional documentation to export from the United States.

Details

341 I/O

1.14 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

40

125 °C

有

A3PE3000L-FGG484M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

-55°C ~ 125°C (TJ)

Tray

A3PE3000L

e1

3A001.A.2.C

锡银铜

125 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

MILITARY

1.575 V

1.14 V

25 mA

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

350 MHz

75264

75264

75264

3000000

23 mm

23 mm

无

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

N

-

96 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

350 MHz

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

A3P060

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P060-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.52

0°C ~ 85°C (TJ)

Tray

A3P060

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

STD

1536

60000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

0.014110 oz

1.425 V

1.575 V

IGLOO

85C

Industrial

FBGA

微芯片技术

600000

-40C to 85C

177

600000

130NM

1.575(V)

1.5(V)

无

1.425(V)

-40C

有

13824

表面贴装

Tray

AGL600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

AGL600V5-FGG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Details

7000 LE

177 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

892.86 MHz

有

90

IGLOOe

-40°C ~ 85°C (TA)

Tray

AGL600V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

256

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

-

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

-

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

144

144-FPBGA (13x13)

400.011771 mg

微芯片技术

2.7 V

Tray

APA150

活跃

This product may require additional documentation to export from the United States.

N

100 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

0.014110 oz

Actel

160

0°C ~ 70°C (TA)

Tray

APA150

70 °C

0 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

4.5 kB

36864

150000

180 MHz

STD

6144

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

活跃

MICROSEMI CORP

1.58

3

FLATPACK, FINE PITCH

FQFP, QFP208,1.2SQ,20

This product may require additional documentation to export from the United States.

Details

2000 LE

158 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

-

24

36864 bit

ProASICPLUS

2.7 V

Tray

APA150

活跃

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

有

APA150-PQG208

180 MHz

FQFP

SQUARE

0°C ~ 70°C (TA)

Tray

APA150

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

158

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

5 mA

-

158

150000 GATES

4.1 mm

现场可编程门阵列

36864

150000

-

6144

150000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

TQFP-100

100-TQFP (14x14)

微芯片技术

Details

512 LE

81 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

238 MHz

有

768 LAB

90

Actel

0.023175 oz

768

TQFP

2.5000 V

2.25 V

12000

81

8000

2.75 V

表面贴装

5.25 V

Tray

A54SX08

活跃

Commercial grade

0 to 70 °C

Tray

A54SX08A

2.25V ~ 5.25V

100

2.25 V to 5.25 V

-

12000

768

Commercial

STD

-

512

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

0C to 70C

158

300000

0.22UM

2.7(V)

2.5(V)

无

2.3(V)

0C

有

8192

表面贴装

2.7 V

Tray

APA300

活跃

This product may require additional documentation to export from the United States.

Details

-

158 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

-

24

73728 bit

ProASICPLUS

2.5000 V

2.3 V

2.7 V

PROASICPLUS

70C

Commercial

PQFP

300000

0 to 70 °C

Tray

APA300

2.3V ~ 2.7V

180(MHz)

208

2.5 V

5 mA

73728

300000

STD

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

This product may require additional documentation to export from the United States.

N

100 I/O

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

有

160

Actel

0.014110 oz

Tray

APA300

活跃

2.7 V

-55°C ~ 125°C (TC)

Tray

APA300

2.3V ~ 2.7V

2.5 V

73728

300000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA-256

YES

256

256-FPBGA (17x17)

256

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

1.31

This product may require additional documentation to export from the United States.

Details

6500 LE

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

-

90

110592 bit

ProASIC3

1.5000 V

1.575 V

Tray

A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P600-FGG256I

350 MHz

-40 to 85 °C

Tray

A3P600

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

231 MHz

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

45 mA

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

6500

110592

600000

231 MHz

STD

13824

13824

600000

1.2 mm

17 mm

17 mm

无

无铅

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P600-FGG256

350 MHz

BGA

SQUARE

活跃

0 to 70 °C

Tray

A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

231 MHz

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

231 MHz

STD

13824

13824

600000

1.2 mm

17 mm

17 mm

无

无铅

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P1000-PQG208

350 MHz

FQFP

0 to 70 °C

Tray

M1A3P1000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

90

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

AGL600V5-FGG256

0 to 70 °C

Tray

AGL600V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

未说明

85 °C

有

A40MX04-PLG84I

80 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

Details

547 LE

69 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

139 MHz

有

-

16

Actel

0.239083 oz

3.3, 5 V

3 V

5.5 V

5.5 V

Tray

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

-40 to 85 °C

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

未说明

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

STD

2.7 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

CSP-281

YES

281-CSP (10x10)

281

微芯片技术

Details

212 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

184

IGLOO PLUS

1.575 V

Tray

AGLP125

Obsolete

TFBGA, BGA281,19X19,20

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA281,19X19,20

1.5 V

未说明

70 °C

有

AGLP125V2-CSG281

160 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.25

0°C ~ 85°C (TJ)

Tray

AGLP125V2

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B281

212

不合格

1.2 V to 1.5 V

1.2/1.5 V

COMMERCIAL

212

3120 CLBS, 125000 GATES

1.05 mm

现场可编程门阵列

3120

36864

125000

STD

3120

3120

125000

0.71 mm

10 mm

10 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

无

A3P1000-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.47

This product may require additional documentation to export from the United States.

N

11000 LE

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

0 to 70 °C

Tray

A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

40

85 °C

有

A3PE600-FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

270 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

350 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE600

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

-40 to 85 °C

Tray

A3PE600

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

270

不合格

1.425 V to 1.575 V

1.5/3.3 V

INDUSTRIAL

270

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.73 mm

23 mm

23 mm