N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

无

M2GL025-VF400I

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.27

207

Tray

M2GL025

活跃

27696 LE

+ 100 C

1.2 V

- 40 C

1.2 V

SMD/SMT

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

207

1.51 mm

现场可编程门阵列

27696

1130496

STD

27696

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

SMD/SMT

5.29

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

BGA

M2GL025-1FG484

无

85 °C

20

1.2 V

BGA484,22X22,40

PLASTIC/EPOXY

3

网格排列

23 X 23 MM, 1 MM PITCH, FBGA-484

267

Non-Compliant

Tray

M2GL025

活跃

27696 LE

+ 85 C

1.2 V

0 C

1.2 V

0°C ~ 85°C (TJ)

IGLOO2

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

138 kB

267

2.44 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

YES

240

240

Molex

-55 °C

3.3 V

40

3 V

125 °C

有

A42MX36-PQG240M

73 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.81

Bulk

085372

活跃

202

Compliant

FQFP, QFP240,1.3SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP240,1.3SQ,20

*

e3

3A001.A.2.C

哑光锡

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G240

202

不合格

3.3,3.3/5,5 V

MILITARY

320 B

202

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

54000

131 MHz

1184

1822

2.7 ns

2438

2438

5.5 V

3 V

54000

3.4 mm

32 mm

32 mm

无

N/A

-

表面贴装

100-BQFP

YES

100

100-PQFP (20x14)

100

Panduit Corp

92 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

Bulk

Obsolete

57

A40MX02

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A40MX02-1PQ100

0°C ~ 70°C (TA)

-

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

R-PQFP-G100

不合格

COMMERCIAL

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

2.3 ns

295

3000

20 mm

14 mm

N/A

-

表面贴装

Radial

YES

84

-

84

Vishay Foil Resistors (Division of Vishay Precision Group)

108 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

LCC

Bulk

活跃

72

A42MX16

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A42MX16-1PL84

-55°C ~ 125°C

S

0.300 L x 0.105 W (7.62mm x 2.67mm)

±0.5%

e0

2

±2ppm/°C

2.304 Ohms

Tin/Lead (Sn/Pb)

金属箔

0.6W

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J84

不合格

-

COMMERCIAL

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

Moisture Resistant, Non-Inductive

0.336 (8.53mm)

29.3116 mm

29.3116 mm

N/A

-

表面贴装

YES

84

84

Phoenix Contact

A14V25A-PL84C

100 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.88

Bulk

Obsolete

70

Non-Compliant

PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

-

e0

锡铅

70 °C

0 °C

MAX 70 I/OS

CMOS

3.3 V

QUAD

J BEND

225

1.27 mm

compliant

100 MHz

S-PQCC-J84

不合格

COMMERCIAL

3.9 ns

310 CLBS, 2500 GATES

4.572 mm

现场可编程门阵列

310

2500

310

3.9 ns

310

3.6 V

3 V

2500

29.3116 mm

29.3116 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

无

A42MX36-1PQ208I

83 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

176

Tray

A42MX36

Obsolete

Compliant

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

151 MHz

1184

1

1822

2.3 ns

2438

5.5 V

3 V

54000

3.4 mm

28 mm

28 mm

无

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

LAPP

1.2 V

20

1.14 V

85 °C

无

M2GL090T-FG484

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.3

86184 LE

+ 85 C

0 C

SMD/SMT

活跃

Spool

267

Non-Compliant

M2GL090

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

0°C ~ 85°C (TJ)

-

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

323.3 kB

267

2.44 mm

现场可编程门阵列

86316

2648064

4 Transceiver

86316

23 mm

23 mm

N/A

-

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

AIRPAX

3.174657 oz

3

面板安装

Sensata

不发光

AIRPAX

176

Tray

活跃

48000 LE

+ 100 C

1.03 V/1.08 V

- 40 C

970 mV/1.02 V

-40°C ~ 100°C (TJ)

LEL/LML

Hydraulic-Magnetic

断路器

0.97V ~ 1.08V

Bullet

Handle

1 Pole

3774874

断路器

48000

电路保护器

断路器

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44

44-PLCC (16.59x16.59)

44

微芯片技术

无

A40MX02-2PL44I

101 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

LCC

34

Tray

A40MX02

Obsolete

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J44

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2 ns

295

3000

16.5862 mm

16.5862 mm

N/A

-

表面贴装

100

Non-Compliant

57

85 °C

-40 °C

5 V

57 MHz

3.8 ns

295

1200

295

1

147

5.5 V

4.5 V

无

N/A

-

表面贴装

YES

100

100

Obsolete

MICROSEMI CORP

5.5 V

5.88

80

Compliant

PLASTIC, QFP-100

FLATPACK

PLASTIC/EPOXY

-40 °C

5 V

4.5 V

85 °C

无

A1415A-PQ100I

125 MHz

QFP

RECTANGULAR

Microsemi Corporation

85 °C

-40 °C

CMOS

5 V

QUAD

鸥翼

0.65 mm

compliant

125 MHz

R-PQFP-G100

INDUSTRIAL

3 ns

3 ns

200 CLBS, 1500 GATES

3.4 mm

现场可编程门阵列

200

1500

200

264

3 ns

200

5.5 V

4.5 V

1500

20 mm

14 mm

无

N/A

-

表面贴装

80

Compliant

69

85 °C

-40 °C

5 V

48 MHz

4.5 ns

547

2000

547

273

5.5 V

4.5 V

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

84-LCC (J-Lead)

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

LCC

72

Compliant

Tray

A42MX24

Obsolete

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A42MX24-3PL84

QCCJ

SQUARE

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

5 V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

36000

3

1410

2 ns

1890

5.25 V

3 V

36000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

表面贴装

YES

240

240

83 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.81

202

Compliant

FQFP, QFP240,1.3SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP240,1.3SQ,20

3.3 V

40

3 V

70 °C

有

A42MX36-1PQG240

e3

哑光锡

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G240

202

不合格

3.3,3.3/5,5 V

COMMERCIAL

320 B

202

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

54000

151 MHz

1184

1

1822

2.3 ns

2438

2438

5.25 V

3 V

54000

3.4 mm

32 mm

32 mm

无

N/A

-

144

20

无

AGL600V2-FG144T

Microsemi Corporation

活跃

MICROSEMI CORP

5.25

97

Non-Compliant

3

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

1.5 V

235

unknown

13.5 kB

现场可编程门阵列

13824

600000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

352-BFCQFP with Tie Bar

YES

352

352-CQFP (75x75)

10.567001 g

352

微芯片技术

AX1000-1CQ352M

763 MHz

GQFF

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.29

Military grade

198

Tray

AX1000

活跃

Compliant

GQFF, TPAK352,2.9SQ,20

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

TPAK352,2.9SQ,20

-55 °C

1.5 V

20

1.425 V

125 °C

无

-55°C ~ 125°C (TA)

Axcelerator

e0

3A001.A.2.C

锡铅

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F352

516

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

20.3 kB

850 ps

516

12096 CLBS, 1000000 GATES

2.89 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

MIL-STD-883 Class B

1

12096

0.84 ns

12096

18144

1.575 V

1.425 V

1000000

2.66 mm

48 mm

48 mm

无

N/A

-

表面贴装

80

Compliant

69

70 °C

0 °C

5 V

48 MHz

4.5 ns

547

2000

547

273

5.25 V

4.75 V

无

N/A

-

Production (Last Updated: 2 months ago)

通孔

通孔

624-BCCGA

624

624-CCGA (32.5x32.5)

微芯片技术

Compliant

418

Tray

AX2000

活跃

-55°C ~ 125°C (TA)

Axcelerator

125 °C

-55 °C

1.5 V

763 MHz

36 kB

850 ps

850 ps

21504

294912

2e+06

763 MHz

32256

21504

1

21504

1.575 V

1.425 V

2.73 mm

32.5 mm

32.5 mm

无

N/A

-

表面贴装

YES

144

1.319103 g

144

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.31

113

Compliant

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A54SX08-1TQ144

280 MHz

LFQFP

SQUARE

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

225

0.5 mm

compliant

280 MHz

S-PQFP-G144

不合格

COMMERCIAL

800 ps

800 ps

768 CLBS, 8000 GATES

1.6 mm

现场可编程门阵列

768

12000

280 MHz

768

1

256

0.8 ns

768

5.25 V

4.75 V

8000

1.4 mm

20 mm

20 mm

无

N/A

-

表面贴装

YES

208

208

280 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.31

Compliant

130

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A54SX08-1PQ208I

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

225

0.5 mm

compliant

280 MHz

S-PQFP-G208

不合格

INDUSTRIAL

800 ps

800 ps

768 CLBS, 8000 GATES

4.1 mm

现场可编程门阵列

768

12000

280 MHz

768

1

256

0.8 ns

768

5.5 V

4.5 V

8000

3.4 mm

28 mm

28 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

A3PE1500-2PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.61

147

Tray

A3PE1500

Obsolete

Compliant

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

1.425 V

70 °C

无

0°C ~ 85°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

310 MHz

2

38400

38400

38400

1.575 V

1.425 V

1500000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

84

Compliant

70

125 °C

-55 °C

5 V

125 MHz

3 ns

3 ns

200

1500

200

264

5.5 V

4.5 V

无

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

0.014110 oz

1.575 V

Tray

AFS600

活跃

LBGA,

有

AFS600-2FGG256I

活跃

MICROSEMI CORP

This product may require additional documentation to export from the United States.

Details

7000 LE

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

90

Fusion

-40°C ~ 100°C (TJ)

Tray

AFS600

1.5 V

110592

600000

2

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FCS-325

325-BGA (11x11)

微芯片技术

+ 100 C

SMD/SMT

500 MHz

1

3.6 MB

Tray

活跃

1.03 V/1.08 V

48000 LE

176 I/O

970 mV/1.02 V

0 C

0°C ~ 100°C (TJ)

Tray

-

1 V, 1.05 V

3774874

48000