N/A

-

YES

144

QFP, QFP144,.87SQ,20

FLATPACK

PLASTIC/EPOXY

QFP144,.87SQ,20

-40 °C

85 °C

无

A54SX16P-TQ144I

230 MHz

QFP

SQUARE

Microsemi Corporation

终身购买

MICROSEMI CORP

5.84

现场可编程门阵列

CMOS

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G144

113

不合格

3.3,3.3/5 V

INDUSTRIAL

113

现场可编程门阵列

1452

N/A

-

Gold Over Nickel

19

Straight

850VDC/600VAC

19Signal

无

Copper Alloy

Wall

Not Required(mm)

Crimp

-65C to 175C

25-19

46.4(mm)

Circular

RCP

19(POS)

PIN

1(Port)

TVP

STD

Nickel

无

32.77(mm)

46.4(mm)

N/A

-

N/A

-

表面贴装

4-SMD, No Lead

100-VQFP (14x14)

Suntsu Electronics, Inc.

Bulk

活跃

71

AGLN125

-10°C ~ 70°C

SXT214

0.079 L x 0.063 W (2.00mm x 1.60mm)

兆赫晶体

1.425V ~ 1.575V

27.12 MHz

±50ppm

100 Ohms

8pF

Fundamental

±20ppm

3072

36864

125000

STD

0.020 (0.50mm)

N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

PEI-Genesis

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.26

12084 LE

+ 100 C

- 40 C

SMD/SMT

活跃

Bulk

138

M2GL010

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

有

M2GL010T-VFG256I

LFBGA

-40°C ~ 100°C (TJ)

*

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

667 Mb/s

1.56 mm

现场可编程门阵列

12084

933888

STD

2 Transceiver

14 mm

14 mm

N/A

-

1210 (3225 Metric)

1210

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73H2E

活跃

-55°C ~ 155°C

RN73H

0.126 L x 0.098 W (3.20mm x 2.50mm)

±0.5%

2

±100ppm/°C

82.5 kOhms

Metal Film

0.25W, 1/4W

-

Automotive AEC-Q200, Moisture Resistant

0.028 (0.70mm)

AEC-Q200

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

Reliance North America

Tape & Box (TB)

活跃

180

M2GL090

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090TS-FCSG325I

Microsemi Corporation

活跃

MICROSEMI CORP

5.79

-40°C ~ 100°C (TJ)

*

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

compliant

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

86316

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

1.14 V

LAPP

85 °C

无

M2GL090T-FG484

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.3

86184 LE

+ 85 C

0 C

SMD/SMT

Spool

活跃

267

Non-Compliant

M2GL090

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

0°C ~ 85°C (TJ)

-

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

323.3 kB

267

2.44 mm

现场可编程门阵列

86316

2648064

4 Transceiver

86316

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

PEI-Genesis

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.3

Bulk

活跃

267

Compliant

M2GL025

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

1.14 V

85 °C

有

M2GL025T-1FGG484

BGA

SQUARE

0°C ~ 85°C (TJ)

*

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

OTHER

138 kB

267

2.44 mm

现场可编程门阵列

27696

1130496

27696

23 mm

23 mm

N/A

-

表面贴装

4-SMD, No Lead

Suntsu Electronics, Inc.

Bulk

活跃

-40°C ~ 85°C

SXT224

0.098 L x 0.079 W (2.50mm x 2.00mm)

兆赫晶体

27.12 MHz

±50ppm

80 Ohms

8pF

Fundamental

±30ppm

0.026 (0.65mm)

N/A

-

面板安装

Flange

Aluminum

Thermoplastic

-

Amphenol Aerospace Operations

-

Bulk

Metal

TVP00RW

活跃

Copper Alloy

Gold

-65°C ~ 175°C

MIL-DTL-38999 Series III, Tri-Start™ TV

Crimp

Receptacle, Male Pins

43

橄榄色

Aviation, Marine, Military

Threaded

-

E

Shielded

抗环境干扰

橄榄色镉

25-43

-

-

-

50.0µin (1.27µm)

-

N/A

-

Free Hanging (In-Line)

68-VFQFN Exposed Pad

YES

-

Thermoplastic

68-QFN (8x8)

68

ITT Cannon, LLC

70 °C

有

AGLN015V5-QNG68

HVQCCN

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.51

1000VAC, 1500VDC

Bulk

Plastic

NLDFT

活跃

Silver

49

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-20 °C

1.5 V

未说明

1.425 V

-30°C ~ 125°C

Powerlock

固定螺钉

Line Drain, Female Sockets

1

-

8542.39.00.01

卡口锁

400A

CMOS

1.425V ~ 1.575V

QUAD

Keyed

无铅

-

未说明

IP67 - Dust Tight, Waterproof

0.4 mm

compliant

-

-

S-XQCC-N68

不合格

OTHER

-

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

STD

384

15000

Hand Grip, Locking Pin

8 mm

8 mm

-

N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

84-LCC (J-Lead)

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

85 °C

无

114.75 MHz

QCCJ

SQUARE

Obsolete

MICROSEMI CORP

3.6 V

5.25

LCC

11897095

Cooper

无

Flextray

72

Tray

A42MX24

Obsolete

PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

-40°C ~ 85°C (TA)

MX

e0

Blind End

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

84

S-PQCC-J84

不合格

5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

PEI-Genesis

Bulk

活跃

*

N/A

-

PEI-Genesis

Bulk

活跃

*

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

Glenair

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

零售包装

活跃

83

A42MX09

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A42MX09-VQ100

117 MHz

0°C ~ 70°C (TA)

*

e0

无

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

100

S-PQFP-G100

不合格

COMMERCIAL

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

2.5 ns

684

14000

14 mm

14 mm

N/A

-

表面贴装

68-VFQFN Exposed Pad

YES

68-QFN (8x8)

68

PEI-Genesis

Obsolete

MICROSEMI CORP

5.8

1.5 V

1.425 V

1.575 V

Bulk

活跃

49

A3PN030

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-20 °C

30

70 °C

有

A3PN030-Z2QNG68

HVQCCN

SQUARE

Microsemi Corporation

-20°C ~ 85°C (TJ)

*

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

OTHER

768 CLBS, 30000 GATES

1 mm

现场可编程门阵列

30000

768

30000

8 mm

8 mm

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

Analog Devices Inc.

无

125 °C

1.425 V

20

1.5 V

-40 °C

BGA144,12X12,40

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE

LBGA, BGA144,12X12,40

Automotive grade

Tray

活跃

97

A3P250

5.23

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

LBGA

350 MHz

A3P250-1FG144T

-40°C ~ 125°C (TA)

-

e0

锡铅银

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

235

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

AUTOMOTIVE

97

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

AEC-Q100

1

6144

6144

250000

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

Surface Mount, Wettable Flank

13-PowerLFDFN Module

YES

896

DFN3625-11A

400.011771 mg

896

Torex Semiconductor Ltd

1.14 V

85 °C

无

A3PE3000L-1FG896I

250 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.29

Tape & Reel (TR)

XDL602

1.25V

Obsolete

620

8542310000/8542310000/8542310000/8542310000/8542310000

Compliant

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.2 V

30

-40°C ~ 105°C

Automotive, AEC-Q100, XDL602

0.14 L x 0.10 W x 0.06 H (3.6mm x 2.5mm x 1.6mm)

e0

Non-Isolated PoL Module

锡铅

85 °C

-40 °C

ITE (Commercial)

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

1

不合格

-

93%

5.5V

1.2 V

2.5V

1.2/1.5,1.2/3.3 V

INDUSTRIAL

1.26 V

1.14 V

1.5A

63 kB

-

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

-

516096

3000000

892.86 MHz

-

1

75264

75264

75264

3000000

OCP, OTP, SCP, UVLO

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

81-WFBGA, CSBGA

81-CSP (5x5)

Infineon Technologies

Box

Obsolete

60

AGLN060

-20°C ~ 85°C (TJ)

-

-

1.14V ~ 1.575V

-

-

Board(s)

1536

18432

60000

STD

-

-

-

N/A

-

表面贴装

281-TFBGA, CSBGA

YES

281-CSP (10x10)

281

Glenair

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.26

零售包装

活跃

215

AGL600

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

1.425 V

100 °C

无

AGL600V5-CS281I

108 MHz

TFBGA

-40°C ~ 85°C (TA)

*

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B281

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

10 mm

10 mm

N/A

-

表面贴装

4-SMD, No Lead

YES

325-FCBGA (11x11)

325

SiTime

M2GL025T-1FCS325

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.2

27696 LE

+ 85 C

0 C

SMD/SMT

Strip

活跃

180

M2GL025

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

85 °C

无

-40°C ~ 85°C

SiT1602B

0.276 L x 0.197 W (7.00mm x 5.00mm)

XO (Standard)

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 3.63V

BOTTOM

BALL

240

compliant

3.57 MHz

±50ppm

HCMOS, LVCMOS

S-PBGA-B325

-

MEMS

4.5mA

180

不合格

1.2 V

1.2 V

OTHER

-

180

现场可编程门阵列

27696

1130496

2 Transceiver

-

27696

0.039 (1.00mm)

-