N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

676-BGA

YES

324

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

AX1000-2FG676I

无

85 °C

1.425 V

30

1.5 V

-40 °C

BGA676,26X26,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA676,26X26,40

418

Compliant

Tray

AX1000

活跃

1.79

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

BGA

870 MHz

-40°C ~ 85°C (TA)

Axcelerator

e0

100.0000 ppm/°C

10 Ohm

锡铅

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

0.5 W

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

High Reliability, MIL-PRF-39017

unknown

870 MHz

S-PBGA-B676

516

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1e+06

870 MHz

18144

12096

2

1

12096

0.74 ns

12096

18144

1.575 V

1.425 V

1000000

11.43

1.73 mm

27 mm

27 mm

无

含铅

N/A

-

表面贴装

896-BGA

896

896-FBGA (31x31)

微芯片技术

Tray

562

47 to 63 Hz

3750 Vac

底座安装

2.5000 V

2.3 V

2.7 V

活跃

APA750

-40 to 90 °C

ProASICPLUS

Wire Leaded

2.3V ~ 2.7V

1

95 %

85 to 171 V

恒定电流

1400 to 2800 mA

479 W

147456

750000

STD

127 to 431/90 to 305 Vdc/Vac

N/A

-

表面贴装

80-TQFP

YES

80

80-VQFP (14x14)

80

微芯片技术

92 MHz

A40MX02-1VQ80

无

70 °C

3 V

30

3.3 V

PLASTIC/EPOXY

3

FLATPACK, THIN PROFILE

TQFP,

57

Tray

A40MX02

Obsolete

QFP

5.25

3.6 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

TQFP

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

S-PQFP-G80

不合格

COMMERCIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2.3 ns

295

3000

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100

100-VQFP (14x14)

100

微芯片技术

TFQFP

139 MHz

A42MX16-VQ100A

无

125 °C

4.75 V

30

5 V

-40 °C

PLASTIC/EPOXY

3

FLATPACK, THIN PROFILE, FINE PITCH

TFQFP,

83

Tray

A42MX16

Obsolete

QFP

5.53

5.25 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

-40°C ~ 125°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 3V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

AUTOMOTIVE

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

2.2 ns

1232

24000

14 mm

14 mm

N/A

-

表面贴装

100-BQFP

YES

100

100-PQFP (20x14)

100

微芯片技术

109 MHz

A40MX04-3PQ100

无

70 °C

3 V

30

3.3 V

PLASTIC/EPOXY

3

FLATPACK

QFP,

69

Tray

A40MX04

Obsolete

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

Microsemi Corporation

RECTANGULAR

QFP

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

R-PQFP-G100

不合格

COMMERCIAL

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

1.7 ns

547

6000

20 mm

14 mm

N/A

-

YES

176

176

146 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

LFQFP, QFP176,1.0SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

3.3 V

30

3 V

70 °C

无

A42MX09-2TQ176

e0

锡铅

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G176

104

不合格

3.3,3.3/5,5 V

COMMERCIAL

104

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

1.8 ns

684

684

14000

24 mm

24 mm

N/A

-

表面贴装

144

20

无

AGL250V2-FG144T

Microsemi Corporation

活跃

MICROSEMI CORP

5.79

97

Non-Compliant

3

e0

锡铅

70 °C

0 °C

8542.39.00.01

235

unknown

4.5 kB

现场可编程门阵列

6144

250000

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

微芯片技术

1.425 V

100 °C

有

AGL125V5-FGG144I

108 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.26

97

Tray

AGL125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

-40°C ~ 85°C (TA)

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

13 mm

13 mm

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

114

Tray

U1AFS600

0°C ~ 85°C (TJ)

Tray

U1AFS600

1.425V ~ 1.575V

36864

250000

STD

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

119

Tray

U1AFS1500

0°C ~ 85°C (TJ)

Tray

U1AFS1500

1.425V ~ 1.575V

276480

1500000

STD

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

N

有

90

Fusion

114

Tray

U1AFS600

-40°C ~ 100°C (TJ)

Tray

U1AFS600

1.425V ~ 1.575V

36864

250000

STD

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

256

微芯片技术

Tray

M1AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

1.14 V

100 °C

无

M1AGL1000V2-FG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

90

IGLOOe

177

-40°C ~ 85°C (TA)

Tray

M1AGL1000V2

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

有

60

Fusion

172

Tray

P1AFS600

-40°C ~ 100°C (TJ)

Tray

P1AFS600

1.425V ~ 1.575V

110592

600000

2

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

N

有

90

Fusion

119

Tray

P1AFS600

-40°C ~ 100°C (TJ)

Tray

P1AFS600

1.425V ~ 1.575V

110592

600000

2

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-144

YES

144

144-FPBGA (13x13)

144

微芯片技术

M1AGL1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

40

1.14 V

85 °C

有

M1AGL1000V2-FGG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

SMD/SMT

有

160

IGLOOe

97

Tray

0°C ~ 70°C (TA)

Tray

M1AGL1000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

有

60

Fusion

223

Tray

P1AFS1500

-40°C ~ 100°C (TJ)

Tray

P1AFS1500

1.425V ~ 1.575V

276480

1500000

2

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

1.425 V

100 °C

有

M1AGL600V5-CSG281I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

184

IGLOOe

215

Tray

M1AGL600

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

-40°C ~ 85°C (TA)

Tray

M1AGL600V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

0.5 mm

compliant

30

S-PBGA-B281

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

13824

600000

10 mm

10 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

1.5000 V

微芯片技术

1.475 V

1.575 V

215

Tray

M1AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.5 V

20

1.425 V

85 °C

无

M1AGL1000V5-CS281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

184

IGLOOe

0 to 70 °C

Tray

M1AGL1000V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1e+06

STD

24576

1000000

10 mm

10 mm

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

无

M1AFS1500-FG484K

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.84

N

有

60

Fusion

223

Tray

M1AFS1500

活跃

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

20

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

223

不合格

1.5,3.3 V

223

现场可编程门阵列

276480

1500000

38400

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

Tray

微芯片技术

M1A3P400

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P400-2FG256I

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

90

ProASIC3

178

-40°C ~ 100°C (TJ)

Tray

M1A3P400

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

M1A3PE3000

微芯片技术

活跃

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.5 V

40

1.425 V

70 °C

有

M1A3PE3000-2FGG324

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

84

ProASIC3

221

Tray

0°C ~ 85°C (TJ)

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.5/3.3 V

COMMERCIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

微芯片技术

M1AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

有

M1AGL1000V2-CSG281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

SMD/SMT

有

184

IGLOOe

215

Tray

0°C ~ 70°C (TA)

Tray

M1AGL1000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

0.5 mm

compliant

S-PBGA-B281

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

10 mm

10 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.8

Details

有

60

Fusion

223

Tray

M1AFS1500

活跃

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

有

M1AFS1500-1FGG484K

350 MHz

BGA

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

30

S-PBGA-B484

223

不合格

1.5,3.3 V

33.8 kB

223

现场可编程门阵列

276480

1.5e+06

38400

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

IGLOOe

1.5000 V

微芯片技术

1.475 V

1.575 V

215

Tray

M1AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

20

1.425 V

100 °C

无

M1AGL1000V5-CS281I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

184

-40 to 85 °C

Tray

M1AGL1000V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1e+06

STD

24576

1000000

10 mm

10 mm