N/A

-

活跃

MICROCHIP TECHNOLOGY INC

9A515.E

8542.39.00.01

compliant

现场可编程门阵列

N/A

-

YES

624

无

活跃

MICROCHIP TECHNOLOGY INC

LGA-624

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

LGA

LGA624,25X25,50

SQUARE

网格排列

1.575 V

1.425 V

1.5 V

9A515.E

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

BOTTOM

无铅

未说明

1.27 mm

compliant

未说明

S-CBGA-N624

684

不合格

MILITARY

684

21504 CLBS, 2000000 GATES

2.96 mm

现场可编程门阵列

MIL-STD-883 Class B

0.93 ns

21504

32256

2000000

32.5 mm

32.5 mm

N/A

-

YES

256

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-256

310 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK256,3SQ,20

SQUARE

FLATPACK, GUARD RING

2.75 V

2.25 V

2.5 V

e0

3A001.A.2.C

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F256

227

不合格

MILITARY

227

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

MIL-PRF-38535

1.2 ns

2880

2880

48000

36 mm

36 mm

N/A

-

YES

208

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-208

310 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK208,2.9SQ,20

SQUARE

FLATPACK, GUARD RING

2.75 V

2.25 V

2.5 V

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

未说明

0.5 mm

compliant

未说明

S-CQFP-F208

173

不合格

MILITARY

173

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

MIL-PRF-38535 Class V

1.4 ns

2880

2880

48000

100k Rad(Si) V

29.21 mm

29.21 mm

N/A

-

YES

352

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-352

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK352,2.9SQ,20

SQUARE

FLATPACK

1.575 V

1.425 V

1.5 V

e0

9A515.E

锡铅

125000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F352

198

不合格

MILITARY

198

12096 CLBS, 1000000 GATES

2.89 mm

现场可编程门阵列

MIL-STD-883 Class B

0.93 ns

12096

1000000

48 mm

48 mm

N/A

-

YES

352

HGQFF

SQUARE

FLATPACK, HEAT SINK/SLUG, GUARD RING

1.95 V

1.65 V

1.8 V

Obsolete

MICROCHIP TECHNOLOGY INC

CERAMIC, MQFP-352

CERAMIC, METAL-SEALED COFIRED

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F352

280000 GATES

3.5 mm

现场可编程门阵列

280000

48 mm

48 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

256

400.011771 mg

Compliant

138

70 °C

0 °C

649 MHz

1.5 V

1.575 V

1.425 V

2.3 kB

990 ps

990 ps

1344

125000

649 MHz

1344

1344

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

144

无

AGL250V2-FG144T

Microsemi Corporation

活跃

MICROSEMI CORP

5.79

97

Non-Compliant

3

20

e0

锡铅

70 °C

0 °C

8542.39.00.01

235

unknown

4.5 kB

现场可编程门阵列

6144

250000

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

微芯片技术

无

A42MX09-3PQ100

161 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

83

Tray

A42MX09

Obsolete

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

100

R-PQFP-G100

不合格

COMMERCIAL

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

1.6 ns

684

14000

20 mm

14 mm

29 In Stock

• 1: ¥137.722157
• 10: ¥129.926570
• 100: ¥122.572232
• 500: ¥115.634183
查看所有的价格

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

微芯片技术

100 °C

有

AGL125V5-FGG144I

108 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.26

97

Tray

AGL125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

-40°C ~ 85°C (TA)

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

13 mm

13 mm

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

100

80

Compliant

125 °C

-55 °C

150 MHz

5 V

5.5 V

4.5 V

2.6 ns

2.6 ns

200

1500

200

1

264

无

2479 In Stock

• 1: ¥1,502.715154
• 10: ¥1,417.655807
• 100: ¥1,337.411136
• 500: ¥1,261.708621
查看所有的价格

-

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

M7A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.425V ~ 1.575V

310 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

310 MHz

2

24576

1.2 mm

17 mm

17 mm

无

108 In Stock

• 1: ¥169.447576
• 10: ¥159.856204
• 100: ¥150.807742
• 500: ¥142.271453
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP

YES

100

100-VQFP (14x14)

100

有

微芯片技术

90

IGLOOe

1.575 V

Tray

M1AGL250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

M1AGL250V2-VQ100

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

3000 LE

68 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

M1AGL250V2

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.2 V to 1.5 V

OTHER

1.575 V

1.14 V

4.5 kB

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

19 In Stock

• 1: ¥195.613986
• 10: ¥184.541494
• 100: ¥174.095752
• 500: ¥164.241275
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

272 MHz

有

90

微芯片技术

ProASIC3

1.575 V

Tray

M1A3P250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P250-1VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

68 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M1A3P250

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

49 In Stock

• 1: ¥219.484856
• 10: ¥207.061185
• 100: ¥195.340742
• 500: ¥184.283718
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP

YES

100

100-VQFP (14x14)

100

1.425 V

- 40 C

+ 85 C

SMD/SMT

有

微芯片技术

90

IGLOOe

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1AGL250

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1AGL250V5-VQG100I

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

3000 LE

68 I/O

-40 to 85 °C

Tray

M1AGL250V5

e3

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

4.5 kB

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

19 In Stock

• 1: ¥205.511625
• 10: ¥193.878889
• 100: ¥182.904614
• 500: ¥172.551526
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3P250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P250-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

97 I/O

0 to 70 °C

Tray

M1A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.05 mm

13 mm

13 mm

49 In Stock

• 1: ¥227.498539
• 10: ¥214.621264
• 100: ¥202.472887
• 500: ¥191.012158
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P250-FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

97 I/O

0 to 70 °C

Tray

M1A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1.05 mm

13 mm

13 mm

36 In Stock

• 1: ¥601.606239
• 10: ¥567.553061
• 100: ¥535.427412
• 500: ¥505.120202
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

Details

235 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-1FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.73 mm

23 mm

23 mm

2831 In Stock

• 1: ¥2,257.526840
• 10: ¥2,129.742302
• 100: ¥2,009.190852
• 500: ¥1,895.463067
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

微芯片技术

90

ProASIC3

0.014110 oz

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

M1A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

30

85 °C

无

M1A3P1000L-1FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

M1A3P1000L

e0

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

8 mA

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.2 mm

17 mm

17 mm

19 In Stock

• 1: ¥683.946895
• 10: ¥645.232919
• 100: ¥608.710301
• 500: ¥574.255002
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

Tray

A3P600

活跃

1.26 V

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

A3P600L-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

A3P600L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

5 mA

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.05 mm

13 mm

13 mm

2975 In Stock

• 1: ¥1,407.261233
• 10: ¥1,327.604937
• 100: ¥1,252.457492
• 500: ¥1,181.563664
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

+ 70 C

SMD/SMT

1282.05 MHz

有

微芯片技术

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS250

活跃

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS250-1FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

114 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

M1AFS250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.2 mm

17 mm

17 mm

594 In Stock

• 1: ¥4,011.713985
• 10: ¥3,784.635831
• 100: ¥3,570.411165
• 500: ¥3,368.312419
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

N

35000 LE

341 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3PE3000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE3000-2FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.76

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

-

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

2

-

75264

75264

3000000

1.73 mm

23 mm

23 mm

810 In Stock

• 1: ¥4,408.209481
• 10: ¥4,158.688186
• 100: ¥3,923.290744
• 500: ¥3,701.217682
查看所有的价格

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

27

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

30

70 °C

无

M1A3PE3000-1FG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

959 In Stock

• 1: ¥8,471.792484
• 10: ¥8,193.222905
• 25: ¥8,136.269024
• 50: ¥8,079.711048
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

+ 85 C

SMD/SMT

892.86 MHz

有

微芯片技术

60

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1AGLE3000

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

20

85 °C

无

M1AGLE3000V5-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

M1AGLE3000V5

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

892.86 MHz

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

无