对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

终端数量

厂商

操作温度

包装

系列

无铅代码

最高工作温度

最小工作温度

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

内存大小

数据率

输入数量

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

速度等级

收发器数量

逻辑单元数

长度

宽度

M2GL010-1VF256
M2GL010-1VF256
Microchip Technology 数据表

49 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

N

12084 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

119

IGLOO2

Tray

M2GL010

活跃

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL010

1.14V ~ 2.625V

1.2 V

12084

933888

M2GL050TS-FG484I
M2GL050TS-FG484I
Microchip Technology 数据表

2820 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

60

IGLOO2

267

Tray

M2GL050

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

M2GL090-1FCSG325
M2GL090-1FCSG325
Microchip Technology 数据表

2909 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

, BGA325,21X21,20

3

PLASTIC

BGA325,21X21,20

1.2 V

M2GL090-1FCSG325

活跃

MICROSEMI CORP

5.82

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.14V ~ 2.625V

compliant

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

86316

M2GL010-VF400I
M2GL010-VF400I
Microchip Technology 数据表

19 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

+ 100 C

SMD/SMT

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

M2GL010-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

195 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

195

1.51 mm

现场可编程门阵列

12084

933888

STD

12084

17 mm

17 mm

M2GL050T-FGG896
M2GL050T-FGG896
Microchip Technology 数据表

2927 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA-896

YES

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

Details

56340 LE

377 I/O

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

27

IGLOO2

1.2000 V

1.14 V

1.26 V

1.2 V

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

85 °C

M2GL050T-FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

0 to 85 °C

Tray

M2GL050T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

1.2 V

OTHER

667 Mb/s

377

2.44 mm

现场可编程门阵列

56340

1869824

STD

8 Transceiver

56340

31 mm

31 mm

M2GL010T-VFG256
M2GL010T-VFG256
Microchip Technology 数据表

36 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

119

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

M2GL010T-VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

12084 LE

138 I/O

0°C ~ 85°C (TJ)

Tray

M2GL010T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

M2GL090TS-1FGG484
M2GL090TS-1FGG484
Microchip Technology 数据表

2612 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

85 °C

M2GL090TS-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

86184 LE

267 I/O

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

23 mm

23 mm

M2GL150T-FCVG484I
M2GL150T-FCVG484I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

484-BFBGA

484-BGA

微芯片技术

This product may require additional documentation to export from the United States.

Details

84

IGLOO2

248

Tray

M2GL150

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

M2GL025T-1FGG484M
M2GL025T-1FGG484M
Microchip Technology 数据表

2515 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

-55°C ~ 125°C (TJ)

Tray

M2GL025T

1.14V ~ 2.625V

1.2 V

27696

1130496

4 Transceiver

M2GL005-FG484I
M2GL005-FG484I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

M2GL005

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.2 V

20

M2GL005-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

60

IGLOO2

1.26 V

209

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL005

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

2.44 mm

现场可编程门阵列

6060

719872

STD

23 mm

23 mm

M2GL050-1FGG484I
M2GL050-1FGG484I
Microchip Technology 数据表

2560 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

484

484-FPBGA (23x23)

微芯片技术

60

IGLOO2

267

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M2GL050

100 °C

-40 °C

1.14V ~ 2.625V

1.2 V

228.3 kB

56340

1869824

1

M2GL150T-1FCV484
M2GL150T-1FCV484
Microchip Technology 数据表

2184 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

N

84

IGLOO2

活跃

M2GL150

Tray

248

0°C ~ 85°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

M2GL010-1FGG484I
M2GL010-1FGG484I
Microchip Technology 数据表

18 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484

484-FPBGA (23x23)

微芯片技术

Details

12084 LE

233 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL010

100 °C

-40 °C

1.14V ~ 2.625V

1.2 V

114 kB

12084

933888

1

M2GL060T-VFG400I
M2GL060T-VFG400I
Microchip Technology 数据表

2902 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

- 40 C

微芯片技术

+ 100 C

SMD/SMT

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

M2GL060T-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.2 V

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

M2GL060TS-1FCS325I
M2GL060TS-1FCS325I
Microchip Technology 数据表

2673 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

+ 100 C

SMD/SMT

176

IGLOO2

1.2 V

活跃

M2GL060

Tray

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

M2GL060TS-1FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

200 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

1.2 V

现场可编程门阵列

56520

1869824

2 Transceiver

M2GL060T-1VFG400I
M2GL060T-1VFG400I
Microchip Technology 数据表

2162 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

- 40 C

微芯片技术

1.2 V

207 I/O

56520 LE

Details

This product may require additional documentation to export from the United States.

1.2 V

活跃

M2GL060

Tray

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

M2GL060T-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

90

IGLOO2

SMD/SMT

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.2 V

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

M2GL090TS-FG676
M2GL090TS-FG676
Microchip Technology 数据表

2988 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

425 I/O

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

40

IGLOO2

Tray

M2GL090

活跃

1.2 V

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

85 °C

M2GL090TS-FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

OTHER

425

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

27 mm

27 mm

M2GL025-VFG400
M2GL025-VFG400
Microchip Technology 数据表

28 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

207 I/O

1.14 V

0 C

微芯片技术

+ 85 C

SMD/SMT

90

IGLOO2

Tray

M2GL025

活跃

8542390000

1.26 V

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

未说明

85 °C

M2GL025-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.52

BGA

This product may require additional documentation to export from the United States.

Details

27696 LE

0°C ~ 85°C (TJ)

Tray

M2GL025

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

未说明

0.8 mm

compliant

400

S-PBGA-B400

207

不合格

1.2 V

1.2 V

OTHER

138 kB

667 Mb/s

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm

M2GL060TS-FCS325
M2GL060TS-FCS325
Microchip Technology 数据表

2220 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

0 C

微芯片技术

+ 85 C

SMD/SMT

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

85 °C

M2GL060TS-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

200 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

1.2 V

OTHER

现场可编程门阵列

56520

1869824

2 Transceiver

M2GL150TS-1FC1152
M2GL150TS-1FC1152
Microchip Technology 数据表

2951 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

1.2000 V

微芯片技术

1.14 V

1.26 V

574

Tray

M2GL150

活跃

35 X 35 MM, 1 MM PITCH, FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

20

1.14 V

85 °C

M2GL150TS-1FC1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

24

IGLOO2

0 to 85 °C

Tray

M2GL150TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

1152

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

1

146124

35 mm

35 mm

M2GL090-FCS325I
M2GL090-FCS325I
Microchip Technology 数据表

2473 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

- 40 C

微芯片技术

+ 100 C

SMD/SMT

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

M2GL090-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

180 I/O

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

86316

M2GL150T-FCV484
M2GL150T-FCV484
Microchip Technology 数据表

2816 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

M2GL150T-FCV484

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

M2GL060T-1VF400I
M2GL060T-1VF400I
Microchip Technology 数据表

2502 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

+ 100 C

SMD/SMT

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

M2GL060T-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.7

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.2 V

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

M2GL010T-1FG484
M2GL010T-1FG484
Microchip Technology 数据表

49 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

M2GL010T-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

OTHER

114 kB

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

M2GL060TS-FGG676I
M2GL060TS-FGG676I
Microchip Technology 数据表

2216 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver