N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

85 °C

有

M2GL090TS-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

23 mm

23 mm

N/A

-

表面贴装

484-BFBGA

484-BGA

微芯片技术

有

84

IGLOO2

248

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

- 55 C

+ 125 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

-55°C ~ 125°C (TJ)

Tray

M2GL025T

1.14V ~ 2.625V

1.2 V

27696

1130496

4 Transceiver

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

60

IGLOO2

1.26 V

209

Tray

M2GL005

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.2 V

20

无

M2GL005-FG484I

-40°C ~ 100°C (TJ)

Tray

M2GL005

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

2.44 mm

现场可编程门阵列

6060

719872

STD

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

484

484-FPBGA (23x23)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

有

60

IGLOO2

267

Tray

M2GL050

-40°C ~ 100°C (TJ)

Tray

M2GL050

100 °C

-40 °C

1.14V ~ 2.625V

1.2 V

228.3 kB

56340

1869824

1

N/A

-

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

有

84

IGLOO2

活跃

M2GL150

Tray

248

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484

484-FPBGA (23x23)

微芯片技术

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

This product may require additional documentation to export from the United States.

Details

12084 LE

233 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

-40°C ~ 100°C (TJ)

Tray

M2GL010

100 °C

-40 °C

1.14V ~ 2.625V

1.2 V

114 kB

12084

933888

1

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060T-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.2 V

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

网格排列

PLASTIC/EPOXY

1.2 V

20

无

M2GL060TS-1FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

200 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

活跃

M2GL060

Tray

BGA,

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

1.2 V

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060T-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

90

IGLOO2

有

SMD/SMT

+ 100 C

- 40 C

1.2 V

207 I/O

56520 LE

Details

This product may require additional documentation to export from the United States.

1.2 V

活跃

M2GL060

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.2 V

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

微芯片技术

活跃

1.2 V

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

85 °C

无

M2GL090TS-FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

Tray

M2GL090

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

OTHER

425

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

活跃

8542390000

1.26 V

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

未说明

85 °C

有

M2GL025-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.52

BGA

This product may require additional documentation to export from the United States.

Details

27696 LE

207 I/O

1.14 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

Tray

M2GL025

0°C ~ 85°C (TJ)

Tray

M2GL025

有

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

未说明

0.8 mm

compliant

400

S-PBGA-B400

207

不合格

1.2 V

1.2 V

OTHER

138 kB

667 Mb/s

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060TS-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

200 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

1.2 V

OTHER

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

BGA1152,34X34,40

1.2 V

20

1.14 V

85 °C

无

M2GL150TS-1FC1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

24

IGLOO2

1.2000 V

1.14 V

1.26 V

574

Tray

M2GL150

活跃

35 X 35 MM, 1 MM PITCH, FBGA-1152

网格排列

PLASTIC/EPOXY

0 to 85 °C

Tray

M2GL150TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

1152

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

1

146124

35 mm

35 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL090-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

86316

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

0.014110 oz

1.575 V

Tray

AFS1500

活跃

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0°C ~ 85°C (TJ)

Tray

AFS1500

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.47059 GHz

2

38400

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

2.25 V

- 40 C

+ 85 C

SMD/SMT

238 MHz

有

-

24

Actel

2.75 V

Tray

A54SX32

活跃

Details

2880 LE

174 I/O

-40°C ~ 85°C (TA)

Tray

A54SX32A

2.25V ~ 5.25V

2.5 V

900 uA

48000

2880

STD

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

A54SX16

活跃

2.75 V

5.25

MICROSEMI CORP

活跃

SQUARE

LFQFP

167 MHz

A54SX16A-FTQG100

有

70 °C

40

2.5 V

TQFP100,.63SQ

PLASTIC/EPOXY

3

FLATPACK, LOW PROFILE, FINE PITCH

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-100

Details

81 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

167 MHz

有

90

Actel

0.023175 oz

Tray

0°C ~ 70°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

180

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

180

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.9 ns

1452

1452

24000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

Actel

0.014110 oz

微芯片技术

2.7 V

Tray

APA300

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

30

85 °C

有

APA300-FGG256I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

186 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

90

-40°C ~ 85°C (TA)

Tray

APA300

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B256

186

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

186

300000 GATES

1.8 mm

现场可编程门阵列

73728

300000

STD

8192

300000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

活跃

2.7 V

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

2.5 V

30

85 °C

有

APA1000-FGG896I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

642 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

27

Actel

0.014110 oz

Tray

APA1000

-40°C ~ 85°C (TA)

Tray

APA1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

245

1 mm

compliant

180 MHz

S-PBGA-B896

642

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

2.7 V

2.3 V

24.8 kB

642

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1000000

180 MHz

STD

56320

56320

1000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

272 MHz

有

90

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P1000

活跃

1.575 V

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P1000-1FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0 to 70 °C

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

微芯片技术

A54SX16

活跃

5.24

MICROSEMI CORP

活跃

SQUARE

LFQFP

320 MHz

A54SX16P-2TQG176I

有

85 °C

40

3.3 V

-40 °C

QFP176,1.0SQ,20

PLASTIC/EPOXY

3

FLATPACK, LOW PROFILE, FINE PITCH

LFQFP, QFP176,1.0SQ,20

Details

147 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

320 MHz

有

40

Actel

3.6 V

Tray

-40°C ~ 85°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

3.3 V, 5 V

3.3,3.3/5 V

INDUSTRIAL

147

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

24000

1452

0.7 ns

1452

1452

16000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

A3P400

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P400-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.23

Details

5000 LE

151 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

350 MHz

有

24

ProASIC3

1.575 V

Tray

0°C ~ 85°C (TJ)

Tray

A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

-

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

-

9216

400000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

3 V

0 C

+ 70 C

SMD/SMT

有

16

Actel

0.239863 oz

336

微芯片技术

PLCC

3.3, 5 V

3 V

14000

72

14000

5.25 V

表面贴装

5.25 V

Tube

A42MX09

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-PLG84

117 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

1.54

Commercial grade

Details

336 LE

72 I/O

0 to 70 °C

Tube

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

84

S-PQCC-J84

不合格

3.3 V, 5 V

COMMERCIAL

-

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

Commercial

STD

-

516

2.5 ns

684

14000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (27X27)

484

微芯片技术

Tray

A54SX72

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

2.5 V

40

70 °C

有

A54SX72A-FFGG484

156 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

360 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

156 MHz

有

40

Actel

0.014110 oz

2.75 V

0°C ~ 70°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

360

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

2 ns

6036

6036

108000

1.73 mm

23 mm

23 mm