品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 材料 | 质量 | 终端数量 | 型芯材料 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 终止次数 | ECCN 代码 | 温度系数 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 功率(瓦特) | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 额定电流 | 频率 | JESD-30代码 | 输出的数量 | 资历状况 | 输出类型 | 失败率 | 电源 | 温度等级 | 终端类型 | 内存大小 | 传播延迟 | 输入类型 | 接通延迟时间 | 电流源 | 数据率 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 屏蔽的 | 传感器类型 | 总 RAM 位数 | 阀门数量 | 显示类型 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 收发器数量 | 外径 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 专用输入数量 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 等效门数 | 产品条款数量 | 套管类型 | 特征 | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 无铅 | 评级结果 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | APA750-FGG896 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | 微芯片技术 | 180 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.26 | 2.5000 V | 562 | Compliant | Tray | APA750 | 活跃 | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | 2.5 V | 40 | 2.3 V | 70 °C | 有 | APA750-FGG896 | 0 to 70 °C | ProASICPLUS | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.5 V | BOTTOM | BALL | 250 | 1 mm | compliant | 180 MHz | S-PBGA-B896 | 562 | 不合格 | 2.5,2.5/3.3 V | COMMERCIAL | 18 kB | 562 | 750000 GATES | 2.44 mm | 现场可编程门阵列 | 147456 | 750000 | 180 MHz | STD | 32768 | 32768 | 2.7 V | 2.3 V | 750000 | 1.73 mm | 31 mm | 31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA1000-FG1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 0603 (1608 Metric) | YES | 1152 | 0603 | 400.011771 mg | 1152 | KOA Speer Electronics, Inc. | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.26 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | RN73R1J | 活跃 | 712 | Compliant | BGA, BGA1152,34X34,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA1152,34X34,40 | 2.5 V | 20 | 2.3 V | 70 °C | 无 | APA1000-FG1152 | 180 MHz | BGA | -55°C ~ 155°C | RN73R | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.25% | 2 | ±50ppm/°C | 94.2 kOhms | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.5 V | BOTTOM | BALL | 225 | 1 mm | unknown | 180 MHz | S-PBGA-B1152 | 712 | 不合格 | - | 2.5,2.5/3.3 V | COMMERCIAL | 24.8 kB | 712 | 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 202752 | 1e+06 | 180 MHz | 56320 | 56320 | 2.7 V | 2.3 V | 1000000 | Automotive AEC-Q200, Moisture Resistant | 1.73 mm | 0.022 (0.55mm) | 35 mm | 35 mm | 无 | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-2PQ160I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160 | 160-PQFP (28x28) | 160 | 微芯片技术 | 117 MHz | QFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | QFP | 125 | Tray | A42MX16 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX16-2PQ160I | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | INDUSTRIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.1 ns | 1232 | 24000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-PL84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | Lead, Tin | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | YES | 84 | 84-PLCC (29.31x29.31) | 6.777889 g | 84 | 微芯片技术 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | LCC | 72 | Compliant | Tray | A42MX24 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX24-PL84I | 91.8 MHz | QCCJ | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 5 V | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | INDUSTRIAL | 1890 CLBS, 36000 GATES | 4.572 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 5.5 V | 3 V | 36000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL125V5-CSG196I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CSP-196 | YES | 196-CSP (8x8) | 196 | 1.575 V | 有 | 1500 LE | 133 I/O | + 100 C | 1.575 V | - 40 C | 348 | 1.425 V | SMD/SMT | 微芯片技术 | Microchip | Microchip Technology / Atmel | 892.86 MHz | IGLOOe | Details | Tray | AGL125 | 活跃 | TFBGA, | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 未说明 | 100 °C | 有 | AGL125V5-CSG196I | 108 MHz | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 1.5000 V | 1.425 V | -40 to 85 °C | Tray | AGL125V5 | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.5 V | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | S-PBGA-B196 | 不合格 | INDUSTRIAL | - | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3072 | FPGA - Field Programmable Gate Array | 36864 | 125000 | STD | - | 3072 | 125000 | FPGA - Field Programmable Gate Array | 0.7 mm | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX72A-PQ208A | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 微芯片技术 | Compliant | Tray | A54SX72A | Obsolete | 171 | -40°C ~ 125°C (TA) | SX-A | 125 °C | -40 °C | 2.5 V | 1.5 ns | 108000 | 217 MHz | 6036 | 6036 | 4024 | 2.75 V | 2.25 V | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN250V5-VQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | 有 | 3000 LE | 68 I/O | + 100 C | 1.575 V | - 40 C | 90 | 1.425 V | SMD/SMT | 微芯片技术 | Microchip | Microchip Technology / Atmel | 250 MHz | IGLOO nano | N | 活跃 | Tray | AGLN250 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 85 °C | 无 | AGLN250V5-VQ100I | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.59 | 1.5000 V | 1.425 V | 1.575 V | -40 to 85 °C | Tray | AGLN250V5 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.5 V | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090T-1FGG676I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 676-BGA | YES | 676 | 676-FBGA (27x27) | 676 | - 40 C | 微芯片技术 | 1.2 V | SMD/SMT | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 30 | 有 | M2GL090T-1FGG676I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.27 | 1.2000 V | 1.14 V | 1.26 V | 425 | Compliant | Tray | M2GL090 | 活跃 | 86184 LE | + 100 C | 1.2 V | -40 to 100 °C | IGLOO2 | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.2 V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | 323.3 kB | 425 | 2.44 mm | 现场可编程门阵列 | 86316 | 2648064 | 1 | 4 Transceiver | 86316 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1010B-2PL68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 68 | 68 | SQUARE | Obsolete | MICROSEMI CORP | 5.5 V | 5.84 | LCC | Cutler Hammer, Div of Eaton Corp | STS366FW3 | 57 | Compliant | PLASTIC, LCC-68 | CHIP CARRIER | PLASTIC/EPOXY | LDCC68,1.0SQ | -40 °C | 5 V | 4.5 V | 85 °C | 无 | 54.1 MHz | QCCJ | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J68 | 57 | 不合格 | 5 V | INDUSTRIAL | 3.4 ns | 3.4 ns | 57 | 547 CLBS, 2000 GATES | 4.572 mm | 现场可编程门阵列 | 1200 | 295 | 2 | 147 | 547 | 295 | 2000 | 24.2316 mm | 24.2316 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1280A-1PG176M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Through Hole | NO | 176 | 176 | 5 V | 未说明 | 4.5 V | 125 °C | 无 | 75 MHz | PGA | SQUARE | Obsolete | MICROSEMI CORP | 5.5 V | 5.84 | PDG23K0150E3WL | CE, CSA, UL | Cutler Hammer, Div of Eaton Corp | Panel | 140 | Compliant | PGA, PGA176,15X15 | 网格排列 | 3 | CERAMIC, METAL-SEALED COFIRED | PGA176,15X15 | -55 °C | e0 | EAR99 | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | MAX 140 I/OS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | PERPENDICULAR | PIN/PEG | 未说明 | 2.54 mm | unknown | 150 A | 90 MHz | S-CPGA-P176 | 140 | 不合格 | 5 V | MILITARY | 4.3 ns | 140 | 1232 CLBS, 8000 GATES | 7.874 mm | 现场可编程门阵列 | 1232 | 8000 | 1232 | 1 | 998 | 4.3 ns | 1232 | 1232 | 5.5 V | 4.5 V | 8000 | 39.878 mm | 39.878 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-1PQ160M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160 | 160-PQFP (28x28) | 160 | ams欧司朗 | 135 MHz | QFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | Bulk | 活跃 | 101 | A42MX09 | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX09-1PQ160M | - | - | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | - | MILITARY | 684 CLBS, 14000 GATES | 4.1 mm | 现场可编程门阵列 | - | 14000 | 2.1 ns | 684 | 14000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-3PL84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 84 | 84-PLCC (29.31x29.31) | 84 | PEI-Genesis | 129 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | LCC | Bulk | 活跃 | 72 | A42MX16 | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX16-3PL84I | -40°C ~ 85°C (TA) | * | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | INDUSTRIAL | 1232 CLBS, 24000 GATES | 4.572 mm | 现场可编程门阵列 | 24000 | 1.9 ns | 1232 | 24000 | 29.3116 mm | 29.3116 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1425A-1PQG160C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 160 | 160 | Obsolete | MICROSEMI CORP | 5.25 V | 5.82 | RK30-619/12F | Lumberg | 100 | Compliant | ROHS COMPLIANT, PLASTIC, QFP-160 | FLATPACK | 3 | PLASTIC/EPOXY | 5 V | 40 | 4.75 V | 70 °C | 有 | 150 MHz | QFP | SQUARE | e3 | 哑光锡 | 70 °C | 0 °C | MAX 100 I/OS | CMOS | 5 V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | 150 MHz | S-PQFP-G160 | 不合格 | COMMERCIAL | 2.6 ns | 310 CLBS, 2500 GATES | 4.1 mm | 现场可编程门阵列 | 310 | 2500 | 310 | 2.6 ns | 310 | 5.25 V | 4.75 V | 2500 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1240A-1PQG144C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 144 | 144 | QFP | SQUARE | Obsolete | MICROSEMI CORP | 5.25 V | 5.8 | A66-1A9G | Miscellaneous | 104 | Compliant | QFP, QFP144,1.2SQ | FLATPACK | 3 | PLASTIC/EPOXY | QFP144,1.2SQ | 5 V | 40 | 4.75 V | 70 °C | 有 | 80 MHz | e3 | 哑光锡 | 70 °C | 0 °C | MAX 104 I/OS | 现场可编程门阵列 | CMOS | 5 V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | 110 MHz | S-PQFP-G144 | 104 | 不合格 | 5 V | COMMERCIAL | 4.3 ns | 104 | 684 CLBS, 4000 GATES | 4.1 mm | 现场可编程门阵列 | 684 | 4000 | 684 | 1 | 568 | 4.3 ns | 684 | 684 | 5.25 V | 4.75 V | 4000 | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1280A-1PQ160M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 160 | 160 | PLASTIC/EPOXY | 3 | FLATPACK | QFP, | 125 | Non-Compliant | 5.79 | 5.5 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | SQUARE | QFP | A1280A-1PQ160M | 无 | 125 °C | 4.5 V | 30 | 5 V | -55 °C | e0 | 3A001.A.2.C | 锡铅 | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 5 V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 90 MHz | S-PQFP-G160 | 不合格 | MILITARY | 4.3 ns | 1232 CLBS, 8000 GATES | 4.1 mm | 现场可编程门阵列 | 1232 | 8000 | 1232 | 1 | 998 | 1232 | 5.5 V | 4.5 V | 8000 | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-PLG68C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 68 | 68 | QCCJ | SQUARE | Obsolete | MICROSEMI CORP | 5.25 V | 5.81 | ACH580-BCR-124A-4+K452+L501 | ABB | 8542390000/8542390000/8542390000/8542390000/8542390000 | 57 | Compliant | PLASTIC, MS-007-AD, LCC-68 | CHIP CARRIER | 3 | PLASTIC/EPOXY | 5 V | 40 | 4.75 V | 70 °C | 有 | 45 MHz | e3 | Matte Tin (Sn) | 70 °C | 0 °C | MAX 57 I/OS | 8542.39.00.01 | CMOS | 5 V | QUAD | J BEND | 245 | 1.27 mm | compliant | 48 MHz | S-PQCC-J68 | 不合格 | COMMERCIAL | 4.5 ns | 4.5 ns | 547 CLBS, 2000 GATES | 4.445 mm | 现场可编程门阵列 | 547 | 2000 | 547 | 273 | 4.5 ns | 547 | 5.25 V | 4.75 V | 2000 | 24.13 mm | 24.13 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1225A-1PQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 100 | 100 | Ferrite | A1225A-1PQ100I | 90 MHz | QFP | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.84 | Thru-Hole | 83 | Non-Compliant | PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | QFP100,.7X.9 | -40 °C | 5 V | 30 | 4.5 V | 85 °C | 无 | -55°C to +125°C | 0.1 | e0 | 锡铅 | 85 °C | -40 °C | PLD EQUIVALENT GATES=6250 | 现场可编程门阵列 | CMOS | 5 V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 120 MHz | R-PQFP-G100 | 83 | 不合格 | 5 V | INDUSTRIAL | RoHS | 4.3 ns | 83 | 451 CLBS, 2500 GATES | 3.4 mm | 现场可编程门阵列 | 451 | 无 | 2500 | 451 | 4.3 ns | 451 | 451 | 5.5 V | 4.5 V | 2500 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600L-FG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 256 | 400.011771 mg | 256 | Ferrite | 1.2 V | -40 °C | BGA256,16X16,40 | PLASTIC/EPOXY | 3 | 网格排列 | BGA, BGA256,16X16,40 | Thru-Hole | Compliant | 177 | 5.28 | 1.575 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | SQUARE | BGA | 350 MHz | A3P600L-FG256I | 无 | 85 °C | 1.14 V | 30 | -55°C to +125°C | 0.15 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.2 V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | 不合格 | 1.5/3.3 V | INDUSTRIAL | RoHS | 13.5 kB | 5 mA | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | 现场可编程门阵列 | 无 | 600000 | 781.25 MHz | 13824 | 13824 | 13824 | 1.26 V | 1.14 V | 600000 | 1.2 mm | 17 mm | 17 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-1VQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100 | 100-VQFP (14x14) | 100 | 微芯片技术 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | QFP | 83 | Tray | A42MX16 | Obsolete | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX16-1VQ100 | 108 MHz | TFQFP | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | COMMERCIAL | 1232 CLBS, 24000 GATES | 1.2 mm | 现场可编程门阵列 | 24000 | 2.4 ns | 1232 | 24000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-3PQ160 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160 | 160-PQFP (28x28) | Cast Iron | 160 | 微芯片技术 | SQUARE | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | QFP | 3TB52 | Maurey Power Transmission | A42MX16 | Obsolete | 125 | Tray | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | 129 MHz | QFP | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | COMMERCIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 5.55 Inches | 1.9 ns | 1232 | 24000 | P1 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATF22V10B-15SI | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | 24 | 4.5 V | 85 °C | 无 | 55.5 MHz | SOP | RECTANGULAR | Obsolete | 10 | ATMEL CORP | 5.5 V | 5.67 | SOIC | 1/4 DIN | 100-240 VAC | DTB9696CVE | Delta Products | 无 | SOP, SOP24,.4 | 小概要 | PLASTIC/EPOXY | SOP24,.4 | -40 °C | 5 V | 未说明 | e0 | Tin/Lead (Sn/Pb) | 10 MACROCELLS; 1 EXTERNAL CLOCK; REGISTER PRELOAD; POWER-UP RESET; SHARED INPUT/CLOCK | 8542.39.00.01 | 可编程逻辑器件 | CMOS | DUAL | 鸥翼 | 未说明 | 1.27 mm | unknown | R-PDSO-G24 | 2 | 不合格 | Analog Current, Voltage Pulse | 5 V | INDUSTRIAL | 15 ns | Milliamps AC, RTD, Thermocouple | PAL-TYPE | 22 | 11 DEDICATED INPUTS, 10 I/O | 2.65 mm | 闪存 PLD | LED | MACROCELL | 11 | 132 | 15.4 mm | 7.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-1FG324I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 324-BGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | 微芯片技术 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | A3PE3000L-1FG324I | 250 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | 1.2000 V | 1.14 V | 1.26 V | 221 | Compliant | Tray | A3PE3000 | 活跃 | BGA, BGA324,18X18,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | -40 °C | -40 to 85 °C | ProASIC3L | e0 | 3A001.A.7.A | 锡铅银 | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.2 V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B324 | 221 | 不合格 | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | 现场可编程门阵列 | 516096 | 3e+06 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 1.26 V | 1.14 V | 3000000 | 1.25 mm | 19 mm | 19 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS090-2FGG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 256 | 400.011771 mg | 256 | 1.575 V | 5.83 | 75 | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | AFS090-2FGG256I | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | e1 | 锡银铜 | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 不合格 | INDUSTRIAL | 3.4 kB | 2304 CLBS, 90000 GATES | 1.68 mm | 现场可编程门阵列 | 90000 | 1.47059 GHz | 2 | 2304 | 2304 | 1.575 V | 1.425 V | 90000 | 1.2 mm | 17 mm | 17 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-1PQ208M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | 83 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | 176 | Compliant | Tray | A42MX36 | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX36-1PQ208M | -55°C ~ 125°C (TC) | MX | 3A001.A.2.C | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 5 V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | MILITARY | 320 B | 2438 CLBS, 54000 GATES | 4.1 mm | 现场可编程门阵列 | 1184 | 2560 | 54000 | 151 MHz | 1184 | 1 | 1822 | 2.3 ns | 2438 | 2414 | 5.5 V | 3 V | 54000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-1BGG729M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 729-BBGA | YES | 729 | 729-PBGA (35x35) | 729 | 微芯片技术 | 有 | AX1000-1BGG729M | 763 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.26 | Military grade | 516 | Compliant | 活跃 | AX1000 | Tray | BGA, BGA729,27X27,50 | 网格排列 | 3 | PLASTIC/EPOXY | BGA729,27X27,50 | -55 °C | 1.5 V | 40 | 1.425 V | 125 °C | -55°C ~ 125°C (TA) | Axcelerator | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.5 V | BOTTOM | BALL | 245 | 1.27 mm | compliant | S-PBGA-B729 | 516 | 不合格 | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 20.3 kB | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.54 mm | 现场可编程门阵列 | 12096 | 165888 | 1e+06 | 763 MHz | 18144 | MIL-STD-883 Class B | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1.575 V | 1.425 V | 1000000 | 1.73 mm | 35 mm | 35 mm | 无 |
APA750-FGG896
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA1000-FG1152
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-2PQ160I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX24-PL84I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL125V5-CSG196I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX72A-PQ208A
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN250V5-VQ100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL090T-1FGG676I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1010B-2PL68I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1280A-1PG176M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX09-1PQ160M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-3PL84I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1425A-1PQG160C
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1240A-1PQG144C
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1280A-1PQ160M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1020B-PLG68C
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1225A-1PQ100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600L-FG256I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-1VQ100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-3PQ160
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
ATF22V10B-15SI
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE3000L-1FG324I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS090-2FGG256I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX36-1PQ208M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX1000-1BGG729M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
