N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

+ 70 C

SMD/SMT

296 MHz

有

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A42MX09

活跃

3.3 V

40

70 °C

有

A42MX09-3PQG100

161 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

PLASTIC/EPOXY

3

FLATPACK

QFP,

Details

83 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

1.6 ns

684

14000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

FCBGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

IGLOO2

176

有

1.2 V

Tray

M2GL090

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL090T

1.14V ~ 2.625V

1.2 V

86184

2648064

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

微芯片技术

40

Actel

5.25 V

Tray

A42MX16

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-3TQG176

129 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

140 I/O

3 V

0 C

+ 70 C

SMD/SMT

237 MHz

有

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

24000

1.4 mm

24 mm

24 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

103 MHz

有

微芯片技术

90

Actel

5.25 V

Tray

A42MX16

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-FVQG100

56 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

83 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

4 ns

1232

24000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

280 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE1500

活跃

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

A3PE1500

70 °C

0 °C

1.425V ~ 1.575V

272 MHz

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

272 MHz

1

38400

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

A3P400

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P400-1FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

272 MHz

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

6.8 kB

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

272 MHz

1

9216

9216

400000

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

0 C

+ 70 C

SMD/SMT

172 MHz

有

微芯片技术

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

30

70 °C

无

A54SX32A-FFG256

172 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

203 I/O

2.25 V

0°C ~ 70°C (TA)

Tray

A54SX32A

e0

TIN LEAD/TIN LEAD SILVER

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

203

不合格

2.5 V

2.5,2.5/5 V

COMMERCIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

1.7 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

+ 125 C

SMD/SMT

153 MHz

有

微芯片技术

24

Actel

0.196363 oz

5.25 V

Tray

A42MX16

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX16-PQG160A

QFP

SQUARE

活跃

MICROSEMI CORP

5.53

Details

140 I/O

4.75 V

- 40 C

-40°C ~ 125°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

5 V

AUTOMOTIVE

24000 GATES

4.1 mm

现场可编程门阵列

24000

STD

2.4 ns

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

有

M2GL150-FCSG536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

IGLOO2

90

有

Details

This product may require additional documentation to export from the United States.

293

Tray

M2GL150

活跃

0°C ~ 85°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B536

OTHER

现场可编程门阵列

146124

5120000

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

Details

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

40

70 °C

有

M1A3P600L-FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

0 to 70 °C

Tray

M1A3P600L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

+ 85 C

SMD/SMT

175 MHz

有

微芯片技术

90

Actel

5.5 V

Tray

A40MX04

活跃

有

A40MX04-2VQG80I

101 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.3

85 °C

40

3.3 V

-40 °C

PLASTIC/EPOXY

3

FLATPACK, THIN PROFILE

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

Details

69 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

表面贴装

TQFP-64

YES

64-TQFP (10x10)

64

+ 85 C

SMD/SMT

有

160

微芯片技术

Actel

0.012720 oz

Tray

EX64

活跃

2.7 V

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

2.5 V

40

85 °C

有

EX64-PTQG64I

357 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.6

Details

41 I/O

2.3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

eX64

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G64

2.5 V

INDUSTRIAL

3000 GATES

1.6 mm

现场可编程门阵列

128

3000

0.7 ns

3000

1.4 mm

10 mm

10 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

310 MHz

有

60

A3PE600

微芯片技术

3

A3PE600-2FG484

MICROSEMI CORP

This product may require additional documentation to export from the United States.

N

1.425 V

ProASIC3

0.014110 oz

Tray

活跃

1.575 V

BGA,

网格排列

PLASTIC/EPOXY

1.5 V

30

70 °C

无

BGA

SQUARE

活跃

5.3

270 I/O

0 C

+ 70 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

A3PE600

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

272 MHz

有

微芯片技术

90

ProASIC3

1.575 V

Tray

M1A3P250

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

5.24

MICROSEMI CORP

活跃

SQUARE

TFQFP

350 MHz

M1A3P250-1VQG100

Details

68 I/O

1.425 V

0 C

+ 70 C

0°C ~ 85°C (TJ)

Tray

M1A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

- 40 C

+ 100 C

SMD/SMT

微芯片技术

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL010T-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL010T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

233

2.44 mm

现场可编程门阵列

12084

933888

STD

4 Transceiver

12084

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

N

86184 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

0°C ~ 85°C (TJ)

Tray

M2GL090T

1.14V ~ 2.625V

1.2 V

86184

2648064

4 Transceiver

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

- 40 C

+ 100 C

SMD/SMT

微芯片技术

有

40

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

无

M2GL090TS-FG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

425

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

表面贴装

QFN-48

YES

48-QFN (6x6)

48

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

429

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

A3P030

活跃

1.575 V

8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, GREEN, QFN-48

CHIP CARRIER, HEAT SINK/SLUG

3

UNSPECIFIED

1.5 V

30

85 °C

有

A3P030-2QNG48

350 MHz

HQCCN

SQUARE

活跃

MICROSEMI CORP

5.24

Details

34 I/O

0 to 70 °C

Tray

A3P030

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

1.5 V

COMMERCIAL

2 mA

768 CLBS, 30000 GATES

现场可编程门阵列

30000

2

768

30000

0.88 mm

6 mm

6 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

5.24

MICROSEMI CORP

活跃

SQUARE

LBGA

350 MHz

M1A3P1000-2FGG144

有

85 °C

40

1.5 V

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE

LBGA,

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M1A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

0 C

+ 85 C

SMD/SMT

微芯片技术

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL010T-1FGG484

BGA

SQUARE

活跃

FPGA - Field Programmable Gate Array IGLOO 2

MICROSEMI CORP

1.57

This product may require additional documentation to export from the United States.

Details

12084 LE

233 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

OTHER

1.26 V

1.14 V

114 kB

233

2.44 mm

现场可编程门阵列

12084

933888

1

4 Transceiver

12084

23 mm

23 mm

无

无铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

1.425 V

280 I/O

N

This product may require additional documentation to export from the United States.

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3PE1500

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PE1500-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

272 MHz

SMD/SMT

+ 85 C

- 40 C

-40 to 85 °C

Tray

A3PE1500

e0

锡铅

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

272 MHz

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

272 MHz

1

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

11000 LE

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

310 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P1000-2FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

SMD/SMT

有

90

微芯片技术

Actel

0.023175 oz

2.7 V

Tray

EX256

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

40

70 °C

有

EX256-PTQG100

357 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

81 I/O

2.3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

eX256

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

2.5 V

COMMERCIAL

12000 GATES

1.6 mm

现场可编程门阵列

512

12000

0.7 ns

12000

1.4 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3P600

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

30

85 °C

无

A3P600L-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

-40 to 85 °C

Tray

A3P600L

e0

锡铅银

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

1.26 V

1.14 V

5 mA

13.5 kB

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

892.86 MHz

1

13824

13824

13824

600000

1.05 mm

13 mm

13 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

SMD/SMT

有

微芯片技术

90

IGLOOe

0.014110 oz

1.5000 V

1.575 V

Tray

M1AGL600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1AGL600V5-FG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

- 40 C

+ 85 C

-40 to 85 °C

Tray

M1AGL600V5

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm