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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 引脚数 | 触点形状 | 外壳材料 | 供应商器件包装 | 材料 | 介电材料 | 质量 | 插入材料 | 终端数量 | 后壳材料，电镀 | 厂商 | Propagation Delay Time | Voltage Rating AC | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 温度系数 | 连接器类型 | 类型 | 电阻 | 定位的数量 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 颜色 | 应用 | 功率(瓦特) | 附加功能 | HTS代码 | 电容量 | 紧固类型 | 子类别 | 触点类型 | 额定电流 | 技术 | 电压 - 供电 | 端子位置 | 方向 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度（摄氏度） | 入口保护 | 端子间距 | 样式 | Reach合规守则 | 额定电流 | 频率 | 频率稳定性 | 外壳完成 | 外壳尺寸-插入 | JESD-30代码 | 输出的数量 | 资历状况 | 执行器类型 | 房屋颜色 | ESR（等效串联电阻） | 引线间距 | 电源 | 温度等级 | 配置 | 注意 | 照明电压（标称） | 负载电容 | 内存大小 | 操作模式 | 外壳尺寸，MIL | 电压 - 正向 (Vf) (类型) | 极数 | 视角 | 照明 | 频率容差 | 传播延迟 | 断路器类型 | 电缆开口 | 测试电流 | 镜头风格 | 数据率 | 输入数量 | 组织结构 | 镜头尺寸 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | Millicandela评级 | 镜头透明度 | 波长 - 峰值 | 包括 | 第一个连接器 | 第二个连接器 | 总 RAM 位数 | 镜头颜色 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 等效门数 | 特征 | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | 触点表面处理厚度 - 配套 | 高度(最大) | 材料可燃性等级 | 辐射硬化 | 无铅 | 评级结果 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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 | MPF300TS-FC484M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 484-BFCPGA | 484-CCGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | 300000 LE | 970 mV/1.02 V | 1 | 1.03 V/1.08 V | 284 | Tray | 活跃 | -55°C ~ 125°C (TJ) | Tray | MPF300TS | 1.05 V | 300000 | 21600666 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P250-PQ208 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | PQFP-208 | This product may require additional documentation to export from the United States. | N | 151 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 231 MHz | 有 | 24 | ProASIC3 | 0.198628 oz | 1.575 V | Tray | A3P250 | 1.5 V | 250000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AFS1500-2FG256 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 119 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 1470.59 MHz | 有 | 90 | Fusion | 0.014110 oz | 1.575 V | Tray | AFS1500 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 85 °C | 无 | AFS1500-2FG256 | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 0°C ~ 85°C (TJ) | Tray | AFS1500 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 不合格 | OTHER | 38400 CLBS, 1500000 GATES | 1.68 mm | 现场可编程门阵列 | 276480 | 1500000 | 2 | 38400 | 1500000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AX1000-1FGG676 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 676-FBGA (27x27) | 676 | 微芯片技术 | 5.25 | This product may require additional documentation to export from the United States. | Details | 418 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 763 MHz | 有 | 40 | Actel | 0.014110 oz | 1.575 V | Tray | AX1000 | 活跃 | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.5 V | 40 | 70 °C | 有 | AX1000-1FGG676 | 763 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 0°C ~ 70°C (TA) | Tray | AX1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 516 | 不合格 | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AFS600-2FGG484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | 484-FPBGA (23x23) | 微芯片技术 | Tray | AFS600 | 活跃 | This product may require additional documentation to export from the United States. | Details | 7000 LE | 172 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 1470.59 MHz | 有 | 60 | Fusion | 0.014110 oz | 1.575 V | 0°C ~ 85°C (TJ) | Tray | AFS600 | 1.5 V | 110592 | 600000 | 2 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGL1000V5-FGG256I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | 100 °C | 有 | AGL1000V5-FGG256I | 108 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | Details | 11000 LE | 177 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 892.86 MHz | 有 | 90 | IGLOOe | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | 活跃 | AGL1000 | Tray | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | -40 to 85 °C | Tray | AGL1000V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 不合格 | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | 现场可编程门阵列 | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A40MX02-VQ80I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | 80-TQFP | YES | - | 80 | Aluminum | 80-VQFP (14x14) | Thermoplastic | 80 | - | TE Connectivity Deutsch 连接器 | Gold | 57 | TQFP, | FLATPACK, THIN PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A40MX02-VQ80I | QFP | 5.25 | 3.6 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | SQUARE | TQFP | 80 MHz | - | Bulk | Metal | D38999/26FC | Discontinued at Digi-Key | Copper Alloy | -65°C ~ 200°C | Military, MIL-DTL-38999 Series III, DTS | e0 | Crimp | Plug, Female Sockets | 4 | Tin/Lead (Sn/Pb) | Silver | Military | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | Threaded | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | B | 鸥翼 | Shielded | 225 | 抗环境干扰 | 0.65 mm | compliant | 13A | Nickel | 13-4 | S-PQFP-G80 | 不合格 | INDUSTRIAL | C | - | 295 CLBS, 3000 GATES | 1.2 mm | 现场可编程门阵列 | 3000 | 2.7 ns | 295 | 3000 | 自锁 | 14 mm | 14 mm | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX24-2PQ160I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 160-BQFP | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | 微芯片技术 | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX24-2PQ160I | 114.75 MHz | QFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | QFP | 125 | Compliant | Tray | A42MX24 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 5 V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | INDUSTRIAL | 1890 CLBS, 36000 GATES | 4.1 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 2 | 1410 | 1.8 ns | 1890 | 5.5 V | 3 V | 36000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A1415A-2PQG100C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | Bulkhead - Front Side Nut | Brass, Zinc Alloy | - | - | Hirose Electric Co Ltd | Metal | 活跃 | - | - | Compliant | 500VAC, 700VDC | Bulk | -25°C ~ 85°C | RM-W | 焊杯 | Receptacle, Male Pins | 4 | 70 °C | 0 °C | Silver | - | Threaded | 5 V | Keyed | Unshielded | IP67/IP68 - Dust Tight, Waterproof | 10A | - | 15 | - | 2.3 ns | - | 2 | 264 | Backshell, Coupling Nut | - | UL94 V-0 | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AFS250-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | AFS250-PQ208 | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | 93 | Compliant | QFP-208 | FLATPACK | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 无 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.5 V | QUAD | FLAT | 225 | 0.5 mm | unknown | R-PQFP-F208 | 不合格 | OTHER | 4.5 kB | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 250000 | 1.0989 GHz | 6144 | 6144 | 1.575 V | 1.425 V | 250000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX16-2PQ160 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160 | 160-PQFP (28x28) | 160 | 微芯片技术 | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX16-2PQ160 | 117 MHz | QFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | QFP | 125 | Tray | A42MX16 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | COMMERCIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.1 ns | 1232 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3PE3000L-PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 面板安装 | 208-BFQFP | YES | Flange | 208 | Circular | Composite | 208-PQFP (28x28) | Plastic | 208 | 微芯片技术 | 1.14 V | 70 °C | 有 | A3PE3000L-PQG208 | 250 MHz | FQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.59 | -- | 20 | 147 | Compliant | Tray | A3PE3000 | 活跃 | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 1.2 V | 40 | -65°C ~ 175°C | Bulk | MIL-DTL-38999 Series III, ACT | e3 | 活跃 | -- | 插座外壳 | 用于公引脚 | 32 | Matte Tin (Sn) | 70 °C | 0 °C | 8542.39.00.01 | Threaded | 现场可编程门阵列 | Crimp | CMOS | 1.2 V | QUAD | A | 鸥翼 | Shielded | 245 | 抗环境干扰 | 0.5 mm | compliant | Chromate over Cadmium | 19-32 | S-PQFP-G208 | 147 | 不合格 | 橄榄色 | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 不包括触点 | 63 kB | F | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | -- | 516096 | 3e+06 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 1.26 V | 1.14 V | 3000000 | -- | 3.4 mm | 28 mm | 28 mm | -- | 无 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL025-VFG400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | VFBGA-400 | YES | Flange | Circular | Composite | 400-VFBGA (17x17) | Plastic | 400 | 微芯片技术 | -- | 20 | 有 | 27696 LE | 207 I/O | + 100 C | 1.26 V | 0.270728 oz | - 40 C | 90 | 1.14 V | SMD/SMT | Microchip | Microchip Technology / Atmel | IGLOO2 | Details | Tray | M2GL025 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 有 | M2GL025-VFG400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.52 | -65°C ~ 175°C | Bulk | MIL-DTL-38999 Series III, ACT | 活跃 | -- | 插座外壳 | 用于内螺纹插座 | 7 | 8542.39.00.01 | Threaded | 可编程逻辑集成电路 | Crimp | CMOS | 1.2 V | BOTTOM | N (Normal) | BALL | Shielded | 260 | 抗环境干扰 | 0.8 mm | compliant | Chromate over Cadmium | 11-99 | S-PBGA-B400 | 207 | 不合格 | 橄榄色 | 1.2 V | 不包括触点 | B | 667 Mb/s | 207 | 1.51 mm | 现场可编程门阵列 | 27696 | FPGA - Field Programmable Gate Array | -- | 1130496 | STD | 4 Transceiver | 27696 | -- | FPGA - Field Programmable Gate Array | 17 mm | 17 mm | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL010T-1VF400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 面板安装 | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | 微芯片技术 | M2GL010 | 活跃 | 12084 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 20 | 无 | M2GL010T-1VF400I | LFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.3 | -- | 195 | Non-Compliant | Tray | -40°C ~ 100°C (TJ) | APL | Obsolete | -- | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | -- | S-PBGA-B400 | 195 | 不合格 | Lever | 1.2 V | -- | 114 kB | 3 | -- | Magnetic (Hydraulic Delay) | 195 | 1.51 mm | 现场可编程门阵列 | 12084 | 933888 | 4 Transceiver | 12084 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3PE3000-PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | PEI-Genesis | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 1.5 V | 40 | 1.425 V | 70 °C | 有 | A3PE3000-PQG208 | 350 MHz | FQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 2.07 | Bulk | 活跃 | 8542390000/8542390000/8542390000/8542390000/8542390000 | 147 | Compliant | A3PE3000 | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 0°C ~ 85°C (TJ) | * | e3 | Matte Tin (Sn) | 70 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.5 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 231 MHz | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | COMMERCIAL | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3e+06 | 231 MHz | STD | 75264 | 75264 | 75264 | 1.575 V | 1.425 V | 3000000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX36-2BG272I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 通孔 | Radial | YES | 272 | 272-PBGA (27x27) | Polyester, Metallized | 272 | 微芯片技术 | Obsolete | PLASTIC, BGA-272 | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX36-2BG272I | 91 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 5.2 | BGA | -- | 630V | 202 | 160V | Compliant | Tray | A42MX36 | -55°C ~ 105°C | Bulk | MKT303 | 0.689 L x 0.248 W (17.50mm x 6.30mm) | ±5% | e0 | 活跃 | -- | PC引脚 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 通用型 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 0.15µF | CMOS | 5 V | BOTTOM | BALL | 225 | 1.27 mm | compliant | S-PBGA-B272 | 不合格 | 0.591 (15.00mm) | INDUSTRIAL | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | 现场可编程门阵列 | 1184 | 2560 | 54000 | 164 MHz | 1184 | 2 | 1822 | 2.1 ns | 2438 | 5.5 V | 3 V | 54000 | 长寿命 | 1.73 mm | 0.433 (11.00mm) | 27 mm | 27 mm | 无 | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX09-PQ160 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160 | 160-PQFP (28x28) | 160 | PEI-Genesis | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX09-PQ160 | 117 MHz | QFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | Bulk | 活跃 | 101 | A42MX09 | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 0°C ~ 70°C (TA) | * | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | COMMERCIAL | 684 CLBS, 14000 GATES | 4.1 mm | 现场可编程门阵列 | 14000 | 2.5 ns | 684 | 14000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A40MX04-PLG84 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 2-PLCC | YES | 84 | 2-PLCC | 84 | 69 | 6000 | 547 | 0.45UM | 5.25(V) | 3.3/5(V) | 无 | 3(V) | 0C | 有 | 547 | 273 | 表面贴装 | OSRAM Opto (ams OSRAM) | 69 | 有 | 547 LE | + 70 C | 5.25 V | 0.239083 oz | 0 C | 16 | 3 V | SMD/SMT | 547 LAB | Microchip | Microchip Technology / Atmel | 139 MHz | Actel | Details | ROHS COMPLIANT, PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A40MX04-PLG84 | 80 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 1.52 | Tape & Reel (TR) | LST67B | 活跃 | 633nm | 40MX | 70C | Commercial | PLCC | 6000 | 0C to 70C | 0°C ~ 70°C (TA) | Box | TOPLED® | 3.20mm L x 2.80mm W | e3 | Matte Tin (Sn) | Red | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | 83/139(MHz) | S-PQCC-J84 | 不合格 | COMMERCIAL | Standard | 2.1V | 120° | 30mA | 圆形，带平顶 | - | 547 CLBS, 6000 GATES | 2.40mm Dia | 4.572 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 315mcd | Clear | 645nm | Colorless | 6000 | - | 2.7 ns | 547 | 6000 | - | FPGA - Field Programmable Gate Array | 3.68 mm | 29.31 mm | 29.31 mm | 2.10mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A40MX04-3PL68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 0603 (1608 Metric) | YES | 68 | 0603 | 68 | KOA Speer Electronics, Inc. | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A40MX04-3PL68I | 109 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | LCC | RN731J | Obsolete | Tape & Reel (TR) | 57 | QCCJ, | CHIP CARRIER | -55°C ~ 155°C | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.05% | e0 | 2 | ±25ppm/°C | 14.5 kOhms | Tin/Lead (Sn/Pb) | Thin Film | 0.063W, 1/16W | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J68 | 不合格 | INDUSTRIAL | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 1.7 ns | 547 | 6000 | Moisture Resistant | 0.022 (0.55mm) | 24.2316 mm | 24.2316 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX09-TQ176M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 176 | 176 | Amphenol Custom Cable | Male | 4 GHz | RG-316 | Male | Bag | 50 Ohms | Q-0D0520 | 活跃 | LFQFP, QFP176,1.0SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX09-TQ176M | 117 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | - | - | e0 | 3A001.A.2.C | 锡铅 | Copper | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | - | 0.5 mm | BNC 转 TNC | compliant | S-PQFP-G176 | 104 | 不合格 | 3.3,3.3/5,5 V | MILITARY | 104 | 684 CLBS, 14000 GATES | 1.6 mm | 现场可编程门阵列 | BNC Plug, Right Angle | TNC Plug | 2.5 ns | 684 | 684 | 14000 | Shielded | 39.4 (1.0m) 3.3 | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX36-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | Free Hanging (In-Line) | 208-BFQFP | YES | - | 208 | Aluminum | 208-PQFP (28x28) | - | 208 | - | Amphenol Aerospace Operations | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX36-1PQ208 | 83 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | - | Bulk | Metal | D38999/26FE | 活跃 | Copper Alloy | Gold | 176 | Compliant | FQFP, | -65°C ~ 200°C | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | e0 | Crimp | Plug, Female Sockets | 55 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | Silver | Aerospace, Aviation, Military | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | Threaded | CMOS | 5 V | QUAD | N (Normal) | 鸥翼 | Shielded | 225 | 抗环境干扰 | 0.5 mm | compliant | - | 化学镍 | 17-35 | S-PQFP-G208 | 不合格 | COMMERCIAL | 320 B | E | - | 2438 CLBS, 54000 GATES | 4.1 mm | 现场可编程门阵列 | 1184 | 2560 | 54000 | 151 MHz | 1184 | 1 | 1822 | 2.3 ns | 2438 | 5.25 V | 3 V | 54000 | 联接螺母 | 3.4 mm | 28 mm | 28 mm | 100.0µin (2.54µm) | - | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL090-1FCSG325I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | YES | 325-FCBGA (11x11) | 325 | Suntsu Electronics, Inc. | M2GL090-1FCSG325I | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.3 | 86184 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | Bulk | 活跃 | 180 | M2GL090 | , BGA325,21X21,20 | 3 | PLASTIC | BGA325,21X21,20 | 1.2 V | 有 | -10°C ~ 70°C | SXT324 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | 兆赫晶体 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 2.625V | compliant | 48 MHz | ±50ppm | 180 | 不合格 | 40 Ohms | 1.2 V | 13pF | Fundamental | ±30ppm | 180 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | 0.031 (0.80mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A40MX04-2PL68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-LCC (J-Lead) | YES | 68 | 68-PLCC (24.23x24.23) | 68 | 微芯片技术 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A40MX04-2PL68I | 101 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | LCC | Non-Compliant | 57 | Tray | A40MX04 | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J68 | 不合格 | INDUSTRIAL | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 2 ns | 547 | 6000 | 24.2316 mm | 24.2316 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A10V20B-PL84C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | Brass | 84 | LDCC84,1.2SQ | 3.3 V | 30 | 3 V | 70 °C | 无 | A10V20B-PL84C | 50 MHz | QCCJ | SQUARE | Obsolete | ACTEL CORP | 3.6 V | 5.87 | Killark-Hubbell Electrical Products | 69 | Non-Compliant | PLASTIC, MS-007-AE, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | Metallic | MAX 69 I/OS | 现场可编程门阵列 | CMOS | 3.3 V | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J84 | 69 | 不合格 | 3.3 V | COMMERCIAL | 6.5 ns | 69 | 547 CLBS, 2000 GATES | 4.45 mm | 现场可编程门阵列 | 2000 | 547 | 273 | 4.5 ns | 547 | 547 | 2000 | 29.21 mm | 29.21 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AX500-FG484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 微芯片技术 | 5376 | FBGA | 表面贴装 | Axcelerator | 1.5(V) | 286000 | 317 | 0C to 70C | 无 | 70C | 1.575(V) | 0C | 1.425(V) | 5376 | 5376 | 有 | 0.15um | 500000 | Commercial | 1.5000 V | 0.99(ns) | 1.425 V | 1.575 V | 317 | Tray | AX500 | 活跃 | 0 to 70 °C | Tray | Axcelerator | 1.425V ~ 1.575V | 649(MHz) | 73728 | 500000 | 8064 | STD |
-
MPF300TS-FC484M
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
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A3P250-PQ208
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
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AFS1500-2FG256
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
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AX1000-1FGG676
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
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AFS600-2FGG484
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
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AGL1000V5-FGG256I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
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A40MX02-VQ80I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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A42MX24-2PQ160I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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A1415A-2PQG100C
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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AFS250-PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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A42MX16-2PQ160
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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A3PE3000L-PQG208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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M2GL025-VFG400I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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M2GL010T-1VF400I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000-PQG208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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A42MX36-2BG272I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX09-PQ160
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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A40MX04-PLG84
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A40MX04-3PL68I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX09-TQ176M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-1PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL090-1FCSG325I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A40MX04-2PL68I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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A10V20B-PL84C
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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AX500-FG484
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)