品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 材料 | 质量 | 终端数量 | Maximum Voltage | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | ECCN 代码 | 连接器类型 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 额定电流 | 频率 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 外径 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 套管类型 | 产品类别 | 知识产权评级 | 高度 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | AGLN020V2-QNG68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-VFQFN Exposed Pad | YES | 6 | 68-QFN (8x8) | 68 | 600 VAC/600 VDC | 微芯片技术 | 未说明 | 1.14 V | 85 °C | 有 | HVQCCN | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.59 | 7000-PS202-8211050 | 飞线 | Female | Murrelektronik | PUR | 49 | Tray | AGLN020 | 活跃 | HVQCCN, | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 | UNSPECIFIED | -40 °C | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO nano | Female to Flying Leads, 6-pole, M23 | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 无铅 | 未说明 | 0.4 mm | compliant | 15 Amps | S-XQCC-N68 | 不合格 | INDUSTRIAL | 520 CLBS, 20000 GATES | 1 mm | 现场可编程门阵列 | 520 | 20000 | STD | 520 | 20000 | IP65/IP67 | 10.5 Meters | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-3PQ160 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160-PQFP (28x28) | Cast Iron | 160 | 微芯片技术 | QFP | SQUARE | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | QFP | 3TB52 | Maurey Power Transmission | 125 | Tray | A42MX16 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | 129 MHz | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 160 | S-PQFP-G160 | 不合格 | COMMERCIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 5.55 Inches | 1.9 ns | 1232 | 24000 | P1 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060T-VFG784I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 748-FBGA | 748-FBGA (23x23) | 微芯片技术 | Tray | 活跃 | 56500 LE | + 100 C | - 40 C | -40°C ~ 100°C (TJ) | IGLOO2 | 1.14V ~ 1.26V | 56520 | 1869824 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-PQ144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-BQFP | 144-PQFP (28x28) | 300 stainless steel | 微芯片技术 | 95 | Tray | Obsolete | 无 | A42MX09-PQ144I | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.8 | -40°C ~ 85°C (TA) | 42MX | Blind Threaded Inserts - MaxTite® | 3V ~ 3.6V, 4.75V ~ 5.25V | compliant | 348 | 14000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-1FG324I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 324-BGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | 微芯片技术 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | A3PE3000L-1FG324I | 250 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | 1.2000 V | 1.14 V | 1.26 V | 221 | Compliant | Tray | A3PE3000 | 活跃 | BGA, BGA324,18X18,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | -40 °C | -40 to 85 °C | ProASIC3L | e0 | 3A001.A.7.A | 锡铅银 | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B324 | 221 | 不合格 | 1.2 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | 现场可编程门阵列 | 516096 | 3e+06 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 1.25 mm | 19 mm | 19 mm | 无 | |||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08A-1FGG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.28 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | -40 °C | 2.5 V | 40 | 2.25 V | 85 °C | 有 | A54SX08A-1FGG144I | 278 MHz | LBGA | e1 | 锡银铜 | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 111 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 111 | 768 CLBS, 12000 GATES | 1.55 mm | 现场可编程门阵列 | 1.1 ns | 768 | 768 | 12000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P1000-1FGG256T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | 125 °C | 有 | A3P1000-1FGG256T | 350 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.23 | Automotive grade | 177 | Tray | A3P1000 | 活跃 | 1 MM PITCH, GREEN, FBGA-256 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 1.5 V | 30 | 1.425 V | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 177 | 不合格 | 1.5/3.3 V | AUTOMOTIVE | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | 现场可编程门阵列 | 147456 | 1000000 | AEC-Q100 | 1 | 24576 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL400V5-FGG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 1.575 V | 5.31 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 1.425 V | 100 °C | 有 | AGL400V5-FGG144I | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | e1 | 锡银铜 | 8542.39.00.01 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 不合格 | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.55 mm | 现场可编程门阵列 | 9216 | 400000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16-1VQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | Obsolete | MICROSEMI CORP | 3.6 V | 5.26 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 3 V | 85 °C | 有 | A54SX16-1VQG100I | 280 MHz | TFQFP | SQUARE | Microsemi Corporation | e3 | 哑光锡 | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | 1452 CLBS, 16000 GATES | 1.2 mm | 现场可编程门阵列 | 0.8 ns | 1452 | 16000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS090-2FGG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 256 | 400.011771 mg | 256 | 1.575 V | 5.83 | 75 | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | AFS090-2FGG256I | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | e1 | 锡银铜 | 85 °C | -40 °C | 8542.39.00.01 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 3.4 kB | 2304 CLBS, 90000 GATES | 1.68 mm | 现场可编程门阵列 | 90000 | 1.47059 GHz | 2 | 2304 | 2304 | 90000 | 1.2 mm | 17 mm | 17 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-TQ144M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | 113 | Tray | A54SX16A | Obsolete | -55°C ~ 125°C (TC) | SX-A | 2.25V ~ 5.25V | 24000 | 1452 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1FG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (27X27) | 484 | 微芯片技术 | 2.5 V | 30 | 2.25 V | 70 °C | 无 | A54SX32A-1FG484 | 278 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.75 V | 5.29 | 2.5000 V | 2.25 V | 2.75 V | 249 | Tray | A54SX32 | 活跃 | BGA, BGA484,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,26X26,40 | 0 to 70 °C | SX-A | e0 | 锡铅 | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 249 | 不合格 | 2.5,2.5/5 V | COMMERCIAL | 249 | 2880 CLBS, 48000 GATES | 2.44 mm | 现场可编程门阵列 | 48000 | 2880 | 1 | 1.1 ns | 2880 | 2880 | 48000 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-1PQ208M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | 125 °C | 3 V | 30 | 3.3 V | -55 °C | PLASTIC/EPOXY | 3 | FLATPACK, FINE PITCH | PLASTIC, QFP-208 | 176 | Compliant | Tray | A42MX36 | Obsolete | 5.23 | QFP | 3.6 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | SQUARE | FQFP | 83 MHz | A42MX36-1PQ208M | 无 | -55°C ~ 125°C (TC) | MX | 3A001.A.2.C | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | 5 V | MILITARY | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 4.1 mm | 现场可编程门阵列 | 1184 | 2560 | 54000 | 151 MHz | 1184 | 1 | 1822 | 2.3 ns | 2438 | 2414 | 54000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-2FG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | Obsolete | MICROSEMI CORP | 2.75 V | 5.32 | 30 | 2.5 V | BGA144,12X12,40 | PLASTIC/EPOXY | 3 | GRID ARRAY, LOW PROFILE | LBGA, BGA144,12X12,40 | 2.25 V | 70 °C | 无 | A54SX16A-2FG144 | 294 MHz | LBGA | SQUARE | Microsemi Corporation | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 111 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 111 | 1452 CLBS, 24000 GATES | 1.55 mm | 现场可编程门阵列 | 1 ns | 1452 | 1452 | 24000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-1BGG729M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 729-BBGA | YES | 729 | 729-PBGA (35x35) | 729 | 微芯片技术 | 有 | AX1000-1BGG729M | 763 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.26 | Military grade | 516 | Compliant | Tray | AX1000 | 活跃 | BGA, BGA729,27X27,50 | 网格排列 | 3 | PLASTIC/EPOXY | BGA729,27X27,50 | -55 °C | 1.5 V | 40 | 1.425 V | 125 °C | -55°C ~ 125°C (TA) | Axcelerator | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 245 | 1.27 mm | compliant | S-PBGA-B729 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.54 mm | 现场可编程门阵列 | 12096 | 165888 | 1e+06 | 763 MHz | 18144 | MIL-STD-883 Class B | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 35 mm | 35 mm | 无 | ||||||||||||||||||||||||||||||||||||||
![]() | A54SX72A-FPQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.25 | 171 | Compliant | Tray | A54SX72A | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 2.5 V | 30 | 2.25 V | 70 °C | 无 | A54SX72A-FPQ208 | 156 MHz | 0°C ~ 70°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 156 MHz | S-PQFP-G208 | 171 | 不合格 | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 2.75 V | 2.25 V | 2 ns | 2 ns | 171 | 6036 CLBS, 108000 GATES | 4.1 mm | 现场可编程门阵列 | 6036 | 108000 | 156 MHz | 6036 | 6036 | 4024 | 2 ns | 6036 | 6036 | 108000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-3PQG240 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 240 | 240 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.81 | 202 | Compliant | FQFP, QFP240,1.3SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP240,1.3SQ,20 | 3.3 V | 40 | 3 V | 70 °C | 有 | A42MX36-3PQG240 | 100 MHz | FQFP | e3 | 哑光锡 | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G240 | 202 | 不合格 | 5 V | 3.3,3.3/5,5 V | COMMERCIAL | 5.25 V | 3 V | 320 B | 202 | 2438 CLBS, 54000 GATES | 4.1 mm | 现场可编程门阵列 | 1184 | 54000 | 180 MHz | 1184 | 3 | 1822 | 1.9 ns | 2438 | 2438 | 54000 | 3.4 mm | 32 mm | 32 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-1VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 100 | 100 | Obsolete | MICROSEMI CORP | 3.6 V | 5.31 | 81 | Compliant | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 3 V | 70 °C | 有 | A54SX08-1VQG100 | 280 MHz | TFQFP | SQUARE | Microsemi Corporation | e3 | 哑光锡 | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 280 MHz | S-PQFP-G100 | 不合格 | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 800 ps | 800 ps | 768 CLBS, 8000 GATES | 1.2 mm | 现场可编程门阵列 | 768 | 12000 | 280 MHz | 768 | 1 | 256 | 0.8 ns | 768 | 8000 | 1 mm | 14 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-FG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (27X27) | 微芯片技术 | 2.5000 V | 2.25 V | 2.75 V | 249 | Tray | A54SX32 | 活跃 | 0 to 70 °C | SX-A | 2.25V ~ 5.25V | 48000 | 2880 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN060-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | 1.575 V | Details | ProASIC3 nano | 350 MHz | Microchip Technology / Atmel | Microchip | 微芯片技术 | SMD/SMT | 1.425 V | 90 | - 20 C | 0.419608 oz | Tray | A3PN060 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -20 °C | 1.5 V | 40 | 70 °C | 有 | A3PN060-VQG100 | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 0.84 | 有 | 700 LE | 18432 bit | 71 I/O | + 85 C | -20°C ~ 85°C (TJ) | Tray | A3PN060 | e3 | Matte Tin (Sn) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 1.425 V to 1.575 V | OTHER | - | 1536 CLBS, 60000 GATES | 1.2 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 18432 | 60000 | STD | - | 1536 | 60000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P1000-FG484M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.16 | 11000 LE | + 125 C | - 55 C | SMD/SMT | 300 | Tray | A3P1000 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 20 | 1.425 V | 无 | A3P1000-FG484M | BGA | -55°C ~ 125°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | - | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 147456 | 1000000 | - | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16-2VQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 3.6 V | 5.26 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A54SX16-2VQ100 | 320 MHz | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | e0 | Tin/Lead (Sn/Pb) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | COMMERCIAL | 1452 CLBS, 16000 GATES | 1.2 mm | 现场可编程门阵列 | 0.7 ns | 1452 | 16000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P060-1VQ100T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.23 | Automotive grade | 71 | Tray | A3P060 | Obsolete | 0.50 MM PITCH, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | TQFP100,.63SQ | -40 °C | 1.5 V | 1.425 V | 125 °C | 无 | A3P060-1VQ100T | 350 MHz | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G100 | 71 | 不合格 | 1.5/3.3 V | AUTOMOTIVE | 71 | 1536 CLBS, 60000 GATES | 1.2 mm | 现场可编程门阵列 | 18432 | 60000 | AEC-Q100 | 1536 | 1536 | 60000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-BG329 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 329-BBGA | 329-PBGA (31x31) | 微芯片技术 | 2.5000 V | 2.25 V | 2.75 V | 249 | Tray | A54SX32 | 活跃 | 0 to 70 °C | SX-A | 2.25V ~ 5.25V | 48000 | 2880 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX250-2PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.81 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | AX250-2PQG208I | 870 MHz | FQFP | e3 | 哑光锡 | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 248 | 不合格 | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 248 | 2816 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 0.74 ns | 2816 | 4224 | 250000 | 28 mm | 28 mm |
AGLN020V2-QNG68I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-3PQ160
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060T-VFG784I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX09-PQ144I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE3000L-1FG324I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08A-1FGG144I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000-1FGG256T
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL400V5-FGG144I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16-1VQG100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS090-2FGG256I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16A-TQ144M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-1FG484
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX36-1PQ208M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16A-2FG144
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX1000-1BGG729M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX72A-FPQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX36-3PQG240
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08-1VQG100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-FG484
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PN060-VQG100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000-FG484M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16-2VQ100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P060-1VQ100T
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-BG329
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX250-2PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
