对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

JESD-609代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

JESD-30代码

资历状况

工作电源电压

温度等级

最大电源电压

最小电源电压

内存大小

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

阀门数量

最高频率

LABs数量/ CLBs数量

速度等级

寄存器数量

CLB-Max的组合延时

逻辑块数量

等效门数

高度

长度

宽度

辐射硬化

A54SX32A-TQG144M
A54SX32A-TQG144M
Microchip Technology 数据表

630 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

活跃

2.75 V

This product may require additional documentation to export from the United States.

Details

113 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

238 MHz

60

Actel

0.046530 oz

Tray

A54SX32

-55°C ~ 125°C (TC)

Tray

A54SX32A

2.25V ~ 5.25V

2.5 V

48000

2880

1.4 mm

20 mm

20 mm

A3PE3000-2FG896
A3PE3000-2FG896
Microchip Technology 数据表

915 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

SMD/SMT

310 MHz

微芯片技术

27

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

A3PE3000-2FG896

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

0 C

+ 70 C

0°C ~ 85°C (TJ)

Tray

A3PE3000

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

3000000

1.73 mm

31 mm

31 mm

APA750-PQG208A
APA750-PQG208A
Microchip Technology 数据表

747 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

Details

158 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

24

Actel

2.625 V

Tray

APA750

活跃

-40°C ~ 125°C (TJ)

Tray

APA750

125 °C

-40 °C

2.375V ~ 2.625V

2.5 V

2.625 V

2.375 V

18 kB

147456

750000

180 MHz

STD

32768

3.4 mm

28 mm

28 mm

A3P030-VQ100I
A3P030-VQ100I
Microchip Technology 数据表

248 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP

YES

100-VQFP (14x14)

100

N

77 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P030

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

A3P030-VQ100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.5

-40 to 85 °C

Tray

A3P030

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

STD

768

30000

1 mm

14 mm

14 mm

A40MX04-2PLG84
A40MX04-2PLG84
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

3 V

0 C

+ 70 C

SMD/SMT

175 MHz

微芯片技术

16

Actel

0.239083 oz

Tray

A40MX04

活跃

5.25 V

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A40MX04-2PLG84

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

69 I/O

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

M1A3P1000-1FGG484
M1A3P1000-1FGG484
Microchip Technology 数据表

36 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

M1A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

60

ProASIC3

0.014110 oz

1.575 V

Tray

0°C ~ 85°C (TJ)

Tray

M1A3P1000

1.425V ~ 1.575V

1.5 V

147456

1000000

1

M7A3P1000-2FGG144
M7A3P1000-2FGG144
Microchip Technology 数据表

2172 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

70 °C

M7A3P1000-2FGG144

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

310 MHz

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

310 MHz

2

24576

24576

1000000

1.05 mm

13 mm

13 mm

M7AFS600-1FG484I
M7AFS600-1FG484I
Microchip Technology 数据表

2376 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

60

Fusion

0.014110 oz

Tray

M7AFS600

活跃

1.575 V

N

172 I/O

-40°C ~ 85°C (TA)

Tray

M7AFS600

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.73 mm

23 mm

23 mm

A54SX16A-TQG144M
A54SX16A-TQG144M
Microchip Technology 数据表

935 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

A54SX16

活跃

This product may require additional documentation to export from the United States.

Details

113 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

227 MHz

60

Actel

0.046530 oz

2.75 V

Tray

-55°C ~ 125°C (TC)

Tray

A54SX16A

2.25V ~ 5.25V

2.5 V

24000

1452

1.4 mm

20 mm

20 mm

M7AFS600-2FG484I
M7AFS600-2FG484I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

N

172 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

60

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

-40°C ~ 85°C (TA)

Tray

M7AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

2

1.73 mm

23 mm

23 mm

A42MX16-1PQG100
A42MX16-1PQG100
Microchip Technology 数据表

2564 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

3 V

0 C

+ 70 C

SMD/SMT

198 MHz

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A42MX16

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A42MX16-1PQG100

108 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.28

Details

83 I/O

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

2.7 mm

20 mm

14 mm

AGL250V2-FG144
AGL250V2-FG144
Microchip Technology 数据表

36 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

3000 LE

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

微芯片技术

526.32 MHz, 892.86 MHz

160

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

30

85 °C

AGL250V2-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

AGL250V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

1.2 V to 1.5 V

OTHER

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1.05 mm

13 mm

13 mm

A40MX02-1PLG68I
A40MX02-1PLG68I
Microchip Technology 数据表

49 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

57 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

160 MHz

微芯片技术

19

Actel

0.171777 oz

5.5 V

Tray

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A40MX02-1PLG68I

92 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

-40°C ~ 85°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.3 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

A3P600-1PQG208
A3P600-1PQG208
Microchip Technology 数据表

19 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

24

ProASIC3

1.5000 V

0 to 70 °C

Tray

A3P600

1.425V ~ 1.575V

1.5 V

110592

600000

1

3.4 mm

28 mm

28 mm

A42MX09-1VQG100I
A42MX09-1VQG100I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP

YES

100-VQFP (14x14)

100

3 V

- 40 C

+ 85 C

SMD/SMT

247 MHz

微芯片技术

90

Actel

5.5 V

Tray

A42MX09

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A42MX09-1VQG100I

135 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

83 I/O

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

3.3 V, 5 V

INDUSTRIAL

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

2.1 ns

684

14000

1 mm

14 mm

14 mm

A40MX04-1PQG100I
A40MX04-1PQG100I
Microchip Technology 数据表

2027 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

69 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

160 MHz

微芯片技术

66

Actel

0.062040 oz

Tray

A40MX04

活跃

5.5 V

5.29

MICROSEMI CORP

活跃

RECTANGULAR

QFP

48 MHz

A40MX04-1PQG100I

85 °C

40

3.3 V

-40 °C

PLASTIC/EPOXY

3

FLATPACK

QFP,

Details

-40°C ~ 85°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

2.3 ns

547

6000

2.7 mm

20 mm

14 mm

A3P030-1VQG100
A3P030-1VQG100
Microchip Technology 数据表

19 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP

YES

100-VQFP (14x14)

100

Details

77 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P030

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

A3P030-1VQG100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

A3P030

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

1

768

30000

1 mm

14 mm

14 mm

M7A3P1000-FG144
M7A3P1000-FG144
Microchip Technology 数据表

2854 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

0.014110 oz

ProASIC3

160

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

70 °C

M7A3P1000-FG144

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M7A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

M7AFS600-2FGG256
M7AFS600-2FGG256
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

Details

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

0°C ~ 70°C (TA)

Tray

M7AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

2

1.2 mm

17 mm

17 mm

A3PE3000-2FG896I
A3PE3000-2FG896I
Microchip Technology 数据表

600 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

27

ProASIC3

0.014110 oz

1.425 V

1.575 V

Tray

A3PE3000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

A3PE3000-2FG896I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

620 I/O

-40°C ~ 100°C (TJ)

Tray

A3PE3000

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

3000000

1.73 mm

31 mm

31 mm

A42MX09-3VQG100I
A42MX09-3VQG100I
Microchip Technology 数据表

2011 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP

YES

100-VQFP (14x14)

100

3 V

- 40 C

+ 85 C

SMD/SMT

296 MHz

微芯片技术

90

Actel

5.5 V

Tray

A42MX09

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A42MX09-3VQG100I

161 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

83 I/O

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

3.3 V, 5 V

INDUSTRIAL

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

1.6 ns

684

14000

1 mm

14 mm

14 mm

APA450-PQG208A
APA450-PQG208A
Microchip Technology 数据表

802 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

Details

158 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

24

Actel

2.625 V

Tray

APA450

活跃

-40°C ~ 125°C (TJ)

Tray

APA450

125 °C

-40 °C

2.375V ~ 2.625V

2.5 V

2.625 V

2.375 V

13.5 kB

110592

450000

180 MHz

STD

12288

3.4 mm

28 mm

28 mm

AX2000-1LG624M
AX2000-1LG624M
Microchip Technology 数据表

755 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CCGA-624

624

624-CLGA (32.5x32.5)

微芯片技术

This product may require additional documentation to export from the United States.

N

SMD/SMT

1

Actel

418

Tray

AX2000

活跃

-55°C ~ 125°C (TA)

AX2000

125 °C

-55 °C

1.425V ~ 1.575V

36 kB

21504

294912

2e+06

32256

A3P030-2VQ100
A3P030-2VQ100
Microchip Technology 数据表

36 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP

YES

100-VQFP (14x14)

100

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

90

ProASIC3

1.575 V

Tray

A3P030

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

A3P030-2VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

77 I/O

1.425 V

0°C ~ 85°C (TJ)

Tray

A3P030

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

2

768

30000

1 mm

14 mm

14 mm

AX500-1PQG208M
AX500-1PQG208M
Microchip Technology 数据表

653 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

Actel

This product may require additional documentation to export from the United States.

Details

115 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

763 MHz

24

1.575 V

Tray

AX500

活跃

-55°C ~ 125°C (TA)

Tray

AX500

1.425V ~ 1.575V

1.5 V

73728

500000

8064

3.4 mm

28 mm

28 mm