N/A

-

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

284 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

0°C ~ 100°C (TJ)

Tray

MPF300TL

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-484

YES

484-FCBGA (23x23)

484

244 I/O

0.97 V

- 40 C

微芯片技术

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

0.892167 oz

1.08 V

Tray

MPF300

活跃

BGA-484

网格排列

PLASTIC/EPOXY

-40 °C

1 V

100 °C

有

MPF300T-FCG484I

BGA

SQUARE

2.36

MICROSEMI CORP

FPGA PolarFire Family 300000 Cells 28nm Technology 484-Pin FBGA Tray

活跃

Details

300000 LE

-40°C ~ 100°C (TJ)

Tray

MPF300T

IT ALSO OPERATES AT 1.05 V NOM SUPPLY

CMOS

1 V, 1.05 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B484

INDUSTRIAL

12.5 Gb/s

2.87 mm

现场可编程门阵列

300000

21094.4Kbit

8 Transceiver

23 mm

23 mm

N/A

-

表面贴装

BGA-536

536-CSPBGA (16x16)

微芯片技术

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

300 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

-40°C ~ 100°C (TJ)

Tray

MPF300TS

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-536

536-CSPBGA (16x16)

微芯片技术

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

300

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF200TS

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

584

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF500TS

1.05 V

481000

33792000

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

244

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF200TLS

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

244

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

0°C ~ 100°C (TJ)

Tray

MPF200TL

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

388

Tray

MPF500

活跃

1.03 V/1.08 V

This product may require additional documentation to export from the United States.

Details

0°C ~ 100°C (TJ)

Tray

MPF500T

1.05 V

481000

33792000

N/A

-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

584

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

Details

0°C ~ 100°C (TJ)

Tray

MPF500TL

1.05 V

481000

33792000

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

388

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF500TS

1.05 V

481000

33792000

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

活跃

MPF200

Tray

284

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF200TS

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

244 I/O

0.97 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.08 V

Tray

-40°C ~ 100°C (TJ)

Tray

MPF300T

1 V, 1.05 V

12.5 Gb/s

300000

21094.4Kbit

8 Transceiver

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

364

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF200TS

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

Details

192000 LE

284 I/O

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

Tray

MPF200

活跃

0°C ~ 100°C (TJ)

Tray

MPF200T

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

284

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF200TL

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

284 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

-40°C ~ 100°C (TJ)

Tray

MPF300TL

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL010T-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

12084 LE

195 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

OTHER

114 kB

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

IGLOO2

119

有

SMD/SMT

+ 85 C

0 C

1.2 V

138 I/O

12084 LE

N

This product may require additional documentation to export from the United States.

Tray

M2GL010

活跃

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL010

1.2 V

12084

933888

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL060-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL060

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.51 mm

现场可编程门阵列

56520

1869824

STD

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060TS-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

OTHER

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060

1.2 V

56520

1869824

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

有

M2GL010TS-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

12084 LE

195 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

195

不合格

1.2 V

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060TS

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

IGLOO2

微芯片技术

0 C

1.2 V

138 I/O

12084 LE

N

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL010

活跃

14 X 14 MM, 0.80 MM PITCH, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL010TS-VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

+ 85 C

SMD/SMT

有

119

0°C ~ 85°C (TJ)

Tray

M2GL010TS

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

OTHER

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

0°C ~ 85°C (TJ)

Tray

M2GL090T

85 °C

0 °C

1.2 V

323.3 kB

86316

2648064

STD

4 Transceiver