N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P1000-2FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

Details

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P1000-FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

71 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

526.32 MHz, 892.86 MHz

有

微芯片技术

90

IGLOOe

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

AGL060V2-VQ100

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

N

0 to 70 °C

Tray

AGL060V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.2 V to 1.5 V

OTHER

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1536

18432

60000

STD

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

- 40 C

+ 85 C

SMD/SMT

526.32 MHz, 892.86 MHz

有

160

This product may require additional documentation to export from the United States.

N

微芯片技术

11000 LE

97 I/O

1.14 V

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

100 °C

无

AGL1000V2-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.29

-40 to 85 °C

Tray

AGL1000V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

1.2 V to 1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

114 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS250-1FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M1AFS250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

280 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

M1A3PE1500-2FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

N

71 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

526.32 MHz, 892.86 MHz

有

微芯片技术

90

IGLOOe

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

100 °C

无

AGL060V2-VQ100I

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

AGL060V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.2 V to 1.5 V

INDUSTRIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1536

18432

60000

STD

1536

60000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

272 MHz

SMD/SMT

+ 85 C

- 40 C

微芯片技术

1.425 V

221 I/O

N

This product may require additional documentation to export from the United States.

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

85 °C

无

A3PE3000-1FG324I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0.014110 oz

ProASIC3

84

有

-40 to 85 °C

Tray

A3PE3000

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

1 mm

not_compliant

272 MHz

S-PBGA-B324

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

25 mA

63 kB

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

221 I/O

N

This product may require additional documentation to export from the United States.

272 MHz

微芯片技术

有

84

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3PE3000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE3000-1FG324

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

SMD/SMT

+ 70 C

0 C

1.425 V

0 to 70 °C

Tray

A3PE3000

e0

锡铅银

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

25 mA

63 kB

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

1.5000 V

1.425 V

1.575 V

Tray

M1AFS250

活跃

1.575 V

This product may require additional documentation to export from the United States.

Details

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

0 to 70 °C

Tray

M1AFS250

1.425V ~ 1.575V

1.5 V

36864

250000

STD

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

114 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS250-1FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

M1AFS250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

892.86 MHz

微芯片技术

有

60

IGLOOe

0.014110 oz

Tray

M1AGLE3000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

20

70 °C

无

M1AGLE3000V5-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

M1AGLE3000V5

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

892.86 MHz

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

1098.9 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS600-FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

1.0989 GHz

S-PBGA-B256

不合格

1.5 V

OTHER

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.68 mm

现场可编程门阵列

110592

600000

1.0989 GHz

STD

13824

13824

600000

1.2 mm

17 mm

17 mm

无

无铅

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

24

ProASIC3

1.5000 V

Tray

M1A3P600

活跃

1.575 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P600-2PQG208I

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

-40 to 85 °C

Tray

M1A3P600

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

110592

600000

2

13824

600000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

微芯片技术

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS1500-FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

119 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

STD

1500000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

114 I/O

1.425 V

+ 85 C

SMD/SMT

1098.9 MHz

有

微芯片技术

90

Fusion

0.014110 oz

- 40 C

1.575 V

Tray

M1AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS250-FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M1AFS250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

微芯片技术

有

60

Fusion

0.014110 oz

Tray

M1AFS600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS600-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

172 I/O

0°C ~ 85°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

OTHER

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

N

0.014110 oz

ProASIC3

160

有

310 MHz

SMD/SMT

微芯片技术

+ 85 C

- 40 C

1.425 V

97 I/O

1.5000 V

1.575 V

Tray

M1A3P600

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P600-2FG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

M1A3P600

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

0.014110 oz

ProASIC3

27

有

781.25 MHz

SMD/SMT

+ 70 C

0 C

微芯片技术

1.14 V

620 I/O

Details

This product may require additional documentation to export from the United States.

1.2000 V

1.14 V

1.26 V

Tray

M1A3PE3000

活跃

1.26 V

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

40

70 °C

有

M1A3PE3000L-FGG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

CSP-289

YES

289-CSP (14x14)

289

1500 LE

212 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

有

微芯片技术

119

IGLOO PLUS

0.260886 oz

1.575 V

Tray

AGLP125

Obsolete

TFBGA, BGA289,17X17,32

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA289,17X17,32

-40 °C

1.5 V

未说明

85 °C

有

AGLP125V5-CSG289I

250 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

-40°C ~ 100°C (TJ)

Tray

AGLP125V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B289

212

不合格

1.5 V

1.5 V

INDUSTRIAL

-

212

3120 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3120

36864

125000

STD

-

3120

3120

125000

0.81 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

1.425 V

223 I/O

Details

1.575 V

Tray

M1AFS1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS1500-2FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0.014110 oz

Fusion

60

有

1470.59 MHz

SMD/SMT

+ 70 C

0 C

0°C ~ 85°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

OTHER

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

SMD/SMT

+ 70 C

0 C

1.14 V

微芯片技术

97 I/O

Details

This product may require additional documentation to export from the United States.

1.2, 1.5 V

1.14 V

1.575 V

Tray

M1AGL600

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

40

85 °C

有

M1AGL600V2-FGG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

0.014110 oz

IGLOOe

160

有

0 to 70 °C

Tray

M1AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.2 V to 1.5 V

OTHER

1.575 V

1.14 V

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

1.425 V

微芯片技术

97 I/O

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

M1AGL600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AGL600V5-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

0.014110 oz

IGLOOe

160

有

SMD/SMT

+ 70 C

0 C

0°C ~ 70°C (TA)

Tray

M1AGL600V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

OTHER

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

235 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

1.575 V

Tray

M7A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.425V ~ 1.575V

310 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

310 MHz

2

24576

1.2 mm

17 mm

17 mm

无