N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP

YES

100

100-VQFP (14x14)

100

微芯片技术

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

M1AGL250V2-VQ100

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

3000 LE

68 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

有

90

IGLOOe

1.575 V

Tray

M1AGL250

0°C ~ 70°C (TA)

Tray

M1AGL250V2

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.2 V to 1.5 V

OTHER

1.575 V

1.14 V

4.5 kB

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

M1A3P250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P250-1VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

68 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

90

ProASIC3

1.575 V

Tray

-40°C ~ 100°C (TJ)

Tray

M1A3P250

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP

YES

100

100-VQFP (14x14)

100

IGLOOe

微芯片技术

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1AGL250

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1AGL250V5-VQG100I

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

3000 LE

68 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

有

90

-40 to 85 °C

Tray

M1AGL250V5

e3

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

4.5 kB

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

160

ProASIC3

0.014110 oz

微芯片技术

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3P250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P250-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

0 to 70 °C

Tray

M1A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

160

ProASIC3

0.014110 oz

微芯片技术

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P250-FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

0 to 70 °C

Tray

M1A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

272 MHz

有

60

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-1FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

235 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0 to 70 °C

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

+ 85 C

SMD/SMT

892.86 MHz

有

90

ProASIC3

微芯片技术

0.014110 oz

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

M1A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

30

85 °C

无

M1A3P1000L-1FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

177 I/O

1.14 V

- 40 C

-40 to 85 °C

Tray

M1A3P1000L

e0

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

8 mA

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

SMD/SMT

781.25 MHz

有

160

ProASIC3

微芯片技术

0.014110 oz

1.2000 V

1.14 V

1.26 V

Tray

A3P600

活跃

1.26 V

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

A3P600L-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

0 C

+ 70 C

0 to 70 °C

Tray

A3P600L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

5 mA

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

0.014110 oz

1.575 V

Tray

M1AFS250

活跃

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS250-1FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0°C ~ 85°C (TJ)

Tray

M1AFS250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

SMD/SMT

310 MHz

有

60

微芯片技术

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3PE3000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE3000-2FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.76

This product may require additional documentation to export from the United States.

N

35000 LE

341 I/O

1.14 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

-

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

2

-

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

SMD/SMT

272 MHz

有

27

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

30

70 °C

无

M1A3PE3000-1FG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

0 C

+ 70 C

0 to 70 °C

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1AGLE3000

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

20

85 °C

无

M1AGLE3000V5-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

60

IGLOOe

-40 to 85 °C

Tray

M1AGLE3000V5

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

892.86 MHz

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

Fusion

微芯片技术

0.014110 oz

1.575 V

Tray

M1AFS250

活跃

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS250-FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

114 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

90

-40°C ~ 100°C (TJ)

Tray

M1AFS250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

0 C

+ 70 C

SMD/SMT

250 MHz

有

-

微芯片技术

348

36864 bit

IGLOOe

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL250

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

未说明

85 °C

有

AGL250V2-CSG196

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.62

This product may require additional documentation to export from the United States.

Details

3000 LE

143 I/O

1.14 V

0 to 70 °C

Tray

AGL250V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

1.2 V to 1.5 V

OTHER

20 uA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

8 mm

8 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

有

90

Fusion

微芯片技术

0.014110 oz

1.575 V

1.425 V

1.5000 V

Tray

M1AFS250

活跃

1.575 V

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS250-FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

0 to 70 °C

Tray

M1AFS250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

M1AFS1500

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS1500-FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

Tray

0°C ~ 85°C (TJ)

Tray

M1AFS1500

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

38400 CLBS, 1500000 GATES

1.68 mm

现场可编程门阵列

276480

1500000

STD

38400

1500000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

M1AGL250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

40

85 °C

有

M1AGL250V2-FGG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

3000 LE

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

有

160

IGLOOe

0.014110 oz

1.575 V

Tray

0°C ~ 70°C (TA)

Tray

M1AGL250V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.2 V to 1.5 V

OTHER

1.575 V

1.14 V

4.5 kB

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

UCSP

YES

81-UCSP (4x4)

81

有

490

IGLOOe

微芯片技术

1.5000 V

1.425 V

1.575 V

Tray

AGL030

活跃

1.575 V

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

100 °C

有

AGL030V5-UCG81I

108 MHz

VFBGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

330 LE

66 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

-40 to 85 °C

Tray

AGL030V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.4 mm

compliant

S-PBGA-B81

不合格

1.5 V

INDUSTRIAL

4 uA

768 CLBS, 30000 GATES

0.8 mm

现场可编程门阵列

768

30000

STD

768

30000

0.66 mm

4 mm

4 mm

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

114

Tray

U1AFS600

活跃

0°C ~ 85°C (TJ)

Tray

U1AFS600

1.425V ~ 1.575V

36864

250000

STD

N/A

-

表面贴装

CSP-81

YES

81-CSP (5x5)

81

IGLOO nano

微芯片技术

0.118870 oz

Tray

AGLN250

活跃

1.575 V

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

85 °C

有

AGLN250V5-CSG81I

VFBGA

SQUARE

活跃

MICROSEMI CORP

5.58

Details

3000 LE

60 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

250 MHz

有

640

-40°C ~ 100°C (TJ)

Tray

AGLN250V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

1.5 V

INDUSTRIAL

-

6144 CLBS, 250000 GATES

0.8 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

0.66 mm

5 mm

5 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

+ 85 C

SMD/SMT

有

160

IGLOOe

0.014110 oz

微芯片技术

FBGA

1.2, 1.5 V

1.14 V

600000

97

600000

1.575 V

表面贴装

1.575 V

Tray

M1AGL600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

100 °C

无

M1AGL600V2-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Industrial grade

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

- 40 C

-40 to 85 °C

Tray

M1AGL600V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

144

S-PBGA-B144

不合格

1.2 V to 1.5 V

INDUSTRIAL

1.575 V

1.14 V

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

Industrial

STD

13824

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

+ 85 C

SMD/SMT

231 MHz

有

40

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.575 V

1.425 V

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE1500-FG676I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

444 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

M1A3PE1500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

38400

1500000

1.73 mm

27 mm

27 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

272 MHz

有

60

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P600-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

235 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40 to 85 °C

Tray

M1A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

350 MHz

有

60

ProASIC3

微芯片技术

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

235 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

0 to 70 °C

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

+ 85 C

SMD/SMT

231 MHz

有

60

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE1500-FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

M1A3PE1500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

38400

1500000

1.73 mm

23 mm

23 mm