N/A

-

表面贴装

FBGA-896

YES

896-FBGA (31x31)

896

微芯片技术

1.2 V

30

85 °C

有

M2GL050T-FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

56340 LE

377 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

27

IGLOO2

1.2000 V

1.14 V

1.26 V

1.2 V

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

0 to 85 °C

Tray

M2GL050T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

667 Mb/s

377

2.44 mm

现场可编程门阵列

56340

1869824

STD

8 Transceiver

56340

31 mm

31 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

12084 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL010T-VFG256

LFBGA

SQUARE

活跃

0°C ~ 85°C (TJ)

Tray

M2GL010T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

OTHER

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

85 °C

有

M2GL090TS-1FGG484

BGA

SQUARE

活跃

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

23 mm

23 mm

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

-55°C ~ 125°C (TJ)

Tray

M2GL025T

1.2 V

27696

1130496

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

484

484-FPBGA (23x23)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

有

60

IGLOO2

267

Tray

M2GL050

-40°C ~ 100°C (TJ)

Tray

M2GL050

100 °C

-40 °C

1.14V ~ 2.625V

228.3 kB

56340

1869824

1

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484

484-FPBGA (23x23)

微芯片技术

233 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

This product may require additional documentation to export from the United States.

Details

12084 LE

-40°C ~ 100°C (TJ)

Tray

M2GL010

100 °C

-40 °C

1.2 V

114 kB

12084

933888

1

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060T-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.25

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

200 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

无

M2GL060TS-1FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060T-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

Tray

M2GL090

活跃

1.2 V

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

85 °C

无

M2GL090TS-FG676

BGA

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

425

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

1.2 V

BGA400,20X20,32

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE, FINE PITCH

LFBGA, BGA400,20X20,32

This product may require additional documentation to export from the United States.

Details

27696 LE

207 I/O

1.14 V

0 C

+ 85 C

IGLOO2

90

有

SMD/SMT

Tray

M2GL025

活跃

8542390000

1.26 V

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.52

BGA

M2GL025-VFG400

有

85 °C

未说明

0°C ~ 85°C (TJ)

Tray

M2GL025

有

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

138 kB

667 Mb/s

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

200 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060TS-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

OTHER

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152

1152-FCBGA (35x35)

1152

微芯片技术

This product may require additional documentation to export from the United States.

N

有

24

IGLOO2

1.2000 V

1.14 V

1.26 V

574

Tray

M2GL150

活跃

35 X 35 MM, 1 MM PITCH, FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

20

1.14 V

85 °C

无

M2GL150TS-1FC1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

0 to 85 °C

Tray

M2GL150TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

1

146124

35 mm

35 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

N

86184 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL090-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

-40°C ~ 100°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

86316

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL060T-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.7

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

84-LCC (J-Lead)

YES

84

84-PLCC (29.31x29.31)

84

微芯片技术

336

0.45UM

14000

有

INDUSTRIALC

72

Tube

A42MX09

Obsolete

PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

LDCC84,1.2SQ

-40 °C

3.3 V

30

3 V

85 °C

无

A42MX09-PL84I

117 MHz

QCCJ

SQUARE

Actel Corporation

Transferred

ACTEL CORP

3.6 V

5.81

PLCC

2.5/1.8(ns)

336

516

14000

72

表面贴装

5.5(V)

3.3/5(V)

3(V)

-40C to 85C

无

85C

-40C

42MX

-40°C ~ 85°C (TA)

Box

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATE AT 5.0V SUPPLY

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

129/215(MHz)

S-PQCC-J84

104

不合格

3.3,3.3/5,5 V

INDUSTRIAL

104

336 CLBS, 14000 GATES

4.57 mm

现场可编程门阵列

14000

2.5 ns

336

684

14000

29.3116 mm

29.3116 mm

N/A

-

表面贴装

144-LQFP

YES

144

144-TQFP (20x20)

144

微芯片技术

0.35um

1080

113

Tray

A54SX32

Obsolete

1.40 MM HEIGHT, MO-136, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

30

3 V

125 °C

无

A54SX32-TQ144M

240 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

TQFP

32000

113

0.9(ns)

表面贴装

SX

3.3/5(V)

-55C to 125C

无

125C

3.63/5.5(V)

2.97/4.5(V)

1800

2880

-55C

48000

有

-55°C ~ 125°C (TC)

SX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

240(MHz)

S-PQFP-G144

不合格

MILITARY

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

32000

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

0.014110 oz

Actel

40

有

763 MHz

SMD/SMT

+ 85 C

- 40 C

1.425 V

418 I/O

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

30

85 °C

无

AX1000-1FG676I

-40°C ~ 85°C (TA)

Tray

AX1000

e0

锡铅

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

763 MHz

S-PBGA-B676

516

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

12096

1

12096

0.84 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-208

YES

208

208-CQFP (75x75)

208

微芯片技术

QFP

This product may require additional documentation to export from the United States.

N

176 I/O

3.3 V

- 55 C

+ 125 C

SMD/SMT

有

1

Actel

3.3 V

Tray

A42MX36

活跃

CERAMIC, QFP-208

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

20

125 °C

无

A42MX36-1CQ208M

83 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

-55°C ~ 125°C (TC)

A42MX36

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V

QUAD

FLAT

225

0.5 mm

compliant

S-CQFP-F208

不合格

MILITARY

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

1184

2560

54000

1184

1

1822

2.3 ns

2438

2414

5.5 V

3 V

54000

29.21 mm

29.21 mm

无

N/A

-

表面贴装

BGA-456

YES

456

456-PBGA (35x35)

456

微芯片技术

2.5 V

30

70 °C

无

APA300-BG456

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

290 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA300

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

0 to 70 °C

Tray

APA300

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B456

290

不合格

2.5,2.5/3.3 V

COMMERCIAL

290

300000 GATES

2.54 mm

现场可编程门阵列

73728

300000

STD

8192

300000

1.73 mm

35 mm

35 mm

N/A

-

表面贴装

CQFP-84

YES

84-CQFP (42x42)

84

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

62 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

278 MHz

有

9

Actel

2.75 V

Tray

A54SX32

活跃

QFF,

FLATPACK

CERAMIC, METAL-SEALED COFIRED

-55 °C

2.5 V

20

125 °C

无

A54SX32A-1CQ84M

250 MHz

QFF

-55°C ~ 125°C (TC)

A54SX32A

e0

3A001.A.2.C

锡铅

IT CAN ALSO OPERATE WITH 3.3V AND 5V

8542.39.00.01

CMOS

2.5 V

QUAD

FLAT

225

0.635 mm

compliant

S-CQFP-F84

不合格

MILITARY

1800 CLBS, 48000 GATES

2.4 mm

现场可编程门阵列

48000

2880

1.2 ns

1800

48000

16.51 mm

16.51 mm

N/A

-

表面贴装

CQFP-208

208-CQFP (75x75)

微芯片技术

This product may require additional documentation to export from the United States.

N

158 I/O

2.5 V

- 55 C

+ 125 C

SMD/SMT

5 MHz

有

1

Actel

7.713328 oz

2.5 V

Tray

APA300

活跃

-55°C ~ 125°C (TC)

APA300

2.5 V

73728

300000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-208

YES

208

208-CQFP (75x75)

208

微芯片技术

QFP

This product may require additional documentation to export from the United States.

N

176 I/O

3.3 V

- 55 C

+ 125 C

SMD/SMT

有

1

Actel

Tray

A42MX36

活跃

3.3 V

GQFF,

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

20

125 °C

无

A42MX36-CQ208M

73 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

-55°C ~ 125°C (TC)

A42MX36

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V

QUAD

FLAT

225

0.5 mm

compliant

S-CQFP-F208

不合格

MILITARY

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

1184

2560

54000

1184

1822

2.7 ns

2438

2414

5.5 V

3 V

54000

29.21 mm

29.21 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA-896

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

30

70 °C

无

AX2000-FG896

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.56

N

21504 LE

586 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

有

32256 LAB

27

Actel

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

0 to 70 °C

Tray

AX2000

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

70 °C

0 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

649 MHz

S-PBGA-B896

684

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

36 kB

990 ps

990 ps

-

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

649 MHz

32256

21504

STD

-

21504

0.99 ns

21504

32256

1.575 V

1.425 V

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

870 MHz

有

60

Actel

0.014110 oz

Tray

AX500

活跃

1.575 V

0°C ~ 70°C (TA)

Tray

AX500

1.5 V

73728

500000

8064

1.73 mm

23 mm

23 mm