对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

JESD-609代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

最大电源电压

最小电源电压

内存大小

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

阀门数量

最高频率

LABs数量/ CLBs数量

逻辑块数(LABs)

速度等级

收发器数量

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

等效门数

高度

长度

宽度

辐射硬化

A40MX04-2PLG68I
A40MX04-2PLG68I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

3 V

- 40 C

+ 85 C

SMD/SMT

175 MHz

微芯片技术

19

Actel

0.171777 oz

5.5 V

Tray

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A40MX04-2PLG68I

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

-40°C ~ 85°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

3.68 mm

24.23 mm

24.23 mm

A54SX08A-2TQG144
A54SX08A-2TQG144
Microchip Technology 数据表

2271 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

113 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

微芯片技术

60

Actel

0.046530 oz

2.5000 V

Tray

A54SX08

活跃

2.75 V

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

70 °C

A54SX08A-2TQG144

313 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

0 to 70 °C

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

113

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

2

0.9 ns

768

768

12000

1.4 mm

20 mm

20 mm

A3PE600-1FGG256
A3PE600-1FGG256
Microchip Technology 数据表

25 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

A3PE600

活跃

1.575 V

This product may require additional documentation to export from the United States.

Details

165 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

0 to 70 °C

Tray

A3PE600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

272 MHz

1

13824

1.2 mm

17 mm

17 mm

AFS600-1FGG484
AFS600-1FGG484
Microchip Technology 数据表

2041 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

Details

7000 LE

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

60

Fusion

0.014110 oz

Tray

AFS600

活跃

1.575 V

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.73 mm

23 mm

23 mm

M1A3PE1500-1PQG208
M1A3PE1500-1PQG208
Microchip Technology 数据表

2832 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

活跃

M1A3PE1500

Tray

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

40

70 °C

M1A3PE1500-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.59

0 to 70 °C

Tray

M1A3PE1500

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

3.4 mm

28 mm

28 mm

M1A3P600-2FG144
M1A3P600-2FG144
Microchip Technology 数据表

25 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

活跃

M1A3P600

Tray

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

M1A3P600-2FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P600

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.05 mm

13 mm

13 mm

M2GL050T-1FCS325
M2GL050T-1FCS325
Microchip Technology 数据表

40 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

85 °C

M2GL050T-1FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

176

IGLOO2

200

Tray

M2GL050

0°C ~ 85°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

A3P125-1FG144I
A3P125-1FG144I
Microchip Technology 数据表

46 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

N

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

A3P125-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

-40 to 85 °C

Tray

A3P125

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

36864

125000

1

3072

125000

1.05 mm

13 mm

13 mm

A3P060-1FG144
A3P060-1FG144
Microchip Technology 数据表

16 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

N

96 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P060

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

A3P060-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

0 to 70 °C

Tray

A3P060

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

1

1536

60000

1.05 mm

13 mm

13 mm

M1A3P600-FG256
M1A3P600-FG256
Microchip Technology 数据表

16 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

90

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M1A3P600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

M1A3P600-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3P600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

A3PE1500-2FG484
A3PE1500-2FG484
Microchip Technology 数据表

2073 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

Tray

A3PE1500

活跃

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

0 to 70 °C

Tray

A3PE1500

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

310 MHz

2

38400

1.73 mm

23 mm

23 mm

A3PE600-1FG484
A3PE600-1FG484
Microchip Technology 数据表

2962 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

A3PE600-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

270 I/O

1.425 V

0 to 70 °C

Tray

A3PE600

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

272 MHz

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

600000

1.73 mm

23 mm

23 mm

U1AFS600-FGG256I
U1AFS600-FGG256I
Microchip Technology 数据表

2499 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

U1AFS600

活跃

This product may require additional documentation to export from the United States.

N

90

Fusion

114

Tray

-40°C ~ 100°C (TJ)

Tray

U1AFS600

1.425V ~ 1.575V

36864

250000

STD

M1A3P1000L-1FG256
M1A3P1000L-1FG256
Microchip Technology 数据表

2023 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

90

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P1000

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

30

70 °C

M1A3P1000L-1FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P1000L

e0

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.2 mm

17 mm

17 mm

M1AGL1000V5-FG144I
M1AGL1000V5-FG144I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-144

YES

144

144-FPBGA (13x13)

144

97

微芯片技术

Tray

M1AGL1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

M1AGL1000V5-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

160

IGLOOe

-40°C ~ 85°C (TA)

Tray

M1AGL1000V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

13 mm

13 mm

A40MX02-2PLG68
A40MX02-2PLG68
Microchip Technology 数据表

30 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

0 C

+ 70 C

SMD/SMT

175 MHz

微芯片技术

19

Actel

0.171777 oz

5.25 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, LCC-68

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A40MX02-2PLG68

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

0°C ~ 70°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

A3PE1500-1PQG208
A3PE1500-1PQG208
Microchip Technology 数据表

2502 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

+ 70 C

SMD/SMT

272 MHz

微芯片技术

24

ProASIC3

1.575 V

Tray

A3PE1500

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

40

70 °C

A3PE1500-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

A3PE1500

e3

Matte Tin (Sn)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

272 MHz

1

38400

38400

38400

1500000

3.4 mm

28 mm

28 mm

M2GL025TS-FGG484
M2GL025TS-FGG484
Microchip Technology 数据表

2191 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025TS

1.14V ~ 2.625V

1.2 V

27696

1130496

4 Transceiver

A42MX36-PQG208M
A42MX36-PQG208M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

+ 125 C

SMD/SMT

131 MHz

微芯片技术

24

Actel

活跃

A42MX36

Tray

5.5 V

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

A42MX36-PQG208M

73 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

176 I/O

3 V

- 55 C

-55°C ~ 125°C (TC)

Tray

A42MX36

e3

3A001.A.2.C

Matte Tin (Sn)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

MILITARY

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

131 MHz

1184

1822

2.7 ns

2438

2414

54000

3.4 mm

28 mm

28 mm

M1AGL600V5-CS281
M1AGL600V5-CS281
Microchip Technology 数据表

2550 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

PLASTIC/EPOXY

1.5 V

20

1.425 V

85 °C

M1AGL600V5-CS281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

184

IGLOOe

215

Tray

M1AGL600

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

0°C ~ 70°C (TA)

Tray

M1AGL600V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

13824

600000

10 mm

10 mm

A54SX72A-1CQ208
A54SX72A-1CQ208
Microchip Technology 数据表

750 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

SMD/SMT

250 MHz

微芯片技术

1

Actel

Tray

A54SX72

活跃

2.75 V

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

2.5 V

70 °C

A54SX72A-1CQ208

250 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.25

N

171 I/O

2.25 V

0 C

+ 70 C

0°C ~ 70°C (TA)

A54SX72A

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

0.5 mm

unknown

S-CQFP-F208

171

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

171

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

29.21 mm

29.21 mm

M1AGL600V2-FG256I
M1AGL600V2-FG256I
Microchip Technology 数据表

2498 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

1.14 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

90

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

100 °C

M1AGL600V2-FG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

177 I/O

-40 to 85 °C

Tray

M1AGL600V2

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.2 V to 1.5 V

INDUSTRIAL

1.575 V

1.14 V

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

A3P400-1FG144
A3P400-1FG144
Microchip Technology 数据表

25 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

160

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

A3P400

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

A3P400-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

97 I/O

0 to 70 °C

Tray

A3P400

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

272 MHz

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

6.8 kB

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

272 MHz

1

9216

9216

400000

1.05 mm

13 mm

13 mm

M1A3P1000L-FGG256
M1A3P1000L-FGG256
Microchip Technology 数据表

2747 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

Details

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

微芯片技术

90

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

40

70 °C

M1A3P1000L-FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.2 mm

17 mm

17 mm

M1A3P1000L-FG256
M1A3P1000L-FG256
Microchip Technology 数据表

2967 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

微芯片技术

90

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P1000

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

30

70 °C

M1A3P1000L-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P1000L

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.2 mm

17 mm

17 mm