2580 In Stock

• 1: ¥1,005.389574
• 10: ¥948.480731
• 100: ¥894.793144
• 500: ¥844.144473
查看所有的价格

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

+ 70 C

SMD/SMT

有

90

微芯片技术

Actel

0.023175 oz

2.7 V

Tray

EX256

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

40

70 °C

有

EX256-PTQG100

357 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

81 I/O

2.3 V

0 C

0°C ~ 70°C (TA)

Tray

eX256

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

2.5 V

COMMERCIAL

12000 GATES

1.6 mm

现场可编程门阵列

512

12000

0.7 ns

12000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

3 V

- 40 C

+ 85 C

SMD/SMT

175 MHz

有

微芯片技术

19

Actel

0.171777 oz

5.5 V

Tray

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX04-2PLG68I

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

-40°C ~ 85°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

3.68 mm

24.23 mm

24.23 mm

2055 In Stock

• 1: ¥1,063.592453
• 10: ¥1,003.389106
• 100: ¥946.593498
• 500: ¥893.012730
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-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

113 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

有

微芯片技术

60

Actel

0.046530 oz

2.5000 V

Tray

A54SX08

活跃

2.75 V

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

70 °C

有

A54SX08A-2TQG144

313 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

0 to 70 °C

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

113

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

2

0.9 ns

768

768

12000

1.4 mm

20 mm

20 mm

45 In Stock

• 1: ¥678.890525
• 10: ¥640.462758
• 100: ¥604.210151
• 500: ¥570.009575
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

A3PE600

活跃

1.575 V

This product may require additional documentation to export from the United States.

Details

165 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

0 to 70 °C

Tray

A3PE600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

272 MHz

1

13824

1.2 mm

17 mm

17 mm

无

2398 In Stock

• 1: ¥2,294.559943
• 10: ¥2,164.679189
• 100: ¥2,042.150178
• 500: ¥1,926.556778
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

Details

7000 LE

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

Tray

AFS600

活跃

1.575 V

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.73 mm

23 mm

23 mm

无

2145 In Stock

• 1: ¥1,827.220218
• 10: ¥1,723.792655
• 100: ¥1,626.219484
• 500: ¥1,534.169323
查看所有的价格

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

活跃

M1A3PE1500

Tray

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

40

70 °C

有

M1A3PE1500-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.59

0 to 70 °C

Tray

M1A3PE1500

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

3.4 mm

28 mm

28 mm

45 In Stock

• 1: ¥638.245981
• 10: ¥602.118849
• 100: ¥568.036649
• 500: ¥535.883637
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

活跃

M1A3P600

Tray

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-2FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P600

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.05 mm

13 mm

13 mm

2420 In Stock

• 1: ¥1,178.852841
• 10: ¥1,112.125324
• 100: ¥1,049.174834
• 500: ¥989.787580
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

+ 85 C

SMD/SMT

有

微芯片技术

90

IGLOOe

0.014110 oz

1.5000 V

1.575 V

Tray

M1AGL600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1AGL600V5-FG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

M1AGL600V5

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

34 In Stock

• 1: ¥632.413635
• 10: ¥596.616640
• 100: ¥562.845886
• 500: ¥530.986690
查看所有的价格

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

0 C

+ 70 C

SMD/SMT

175 MHz

有

微芯片技术

19

Actel

0.171777 oz

5.25 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, LCC-68

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-2PLG68

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

0°C ~ 70°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

2854 In Stock

• 1: ¥1,627.256051
• 10: ¥1,535.147214
• 100: ¥1,448.252093
• 500: ¥1,366.275555
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

24

ProASIC3

1.575 V

Tray

A3PE1500

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

40

70 °C

有

A3PE1500-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

A3PE1500

e3

Matte Tin (Sn)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

272 MHz

1

38400

38400

38400

1500000

3.4 mm

28 mm

28 mm

无

2201 In Stock

• 1: ¥3,177.294689
• 10: ¥2,997.447822
• 100: ¥2,827.780963
• 500: ¥2,667.717886
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

U1AFS600

活跃

This product may require additional documentation to export from the United States.

N

有

90

Fusion

114

Tray

-40°C ~ 100°C (TJ)

Tray

U1AFS600

1.425V ~ 1.575V

36864

250000

STD

2072 In Stock

• 1: ¥1,315.083189
• 10: ¥1,240.644521
• 100: ¥1,170.419353
• 500: ¥1,104.169203
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P1000

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

30

70 °C

无

M1A3P1000L-1FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P1000L

e0

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-144

YES

144

144-FPBGA (13x13)

144

97

微芯片技术

Tray

M1AGL1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1AGL1000V5-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

160

IGLOOe

-40°C ~ 85°C (TA)

Tray

M1AGL1000V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

13 mm

13 mm

2075 In Stock

• 1: ¥2,518.523301
• 10: ¥2,375.965379
• 100: ¥2,241.476775
• 500: ¥2,114.600731
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

Tray

A3PE1500

活跃

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

0 to 70 °C

Tray

A3PE1500

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

310 MHz

2

38400

1.73 mm

23 mm

23 mm

无

2815 In Stock

• 1: ¥1,047.404123
• 10: ¥988.117100
• 100: ¥932.185944
• 500: ¥879.420695
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE600-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

270 I/O

1.425 V

0 to 70 °C

Tray

A3PE600

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

272 MHz

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

600000

1.73 mm

23 mm

23 mm

无

2801 In Stock

• 1: ¥1,053.169761
• 10: ¥993.556378
• 100: ¥937.317337
• 500: ¥884.261639
查看所有的价格

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025TS

1.14V ~ 2.625V

1.2 V

27696

1130496

4 Transceiver

27 In Stock

• 1: ¥168.993471
• 10: ¥159.427806
• 100: ¥150.403590
• 500: ¥141.890177
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

N

96 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P060

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P060-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

0 to 70 °C

Tray

A3P060

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

1

1536

60000

1.05 mm

13 mm

13 mm

27 In Stock

• 1: ¥651.474073
• 10: ¥614.598184
• 100: ¥579.809608
• 500: ¥546.990191
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M1A3P600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3P600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

+ 125 C

SMD/SMT

131 MHz

微芯片技术

有

24

Actel

活跃

A42MX36

Tray

5.5 V

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX36-PQG208M

73 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

176 I/O

3 V

- 55 C

-55°C ~ 125°C (TC)

Tray

A42MX36

e3

3A001.A.2.C

Matte Tin (Sn)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

MILITARY

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

131 MHz

1184

1822

2.7 ns

2438

2414

54000

3.4 mm

28 mm

28 mm

无

2935 In Stock

• 1: ¥1,898.561120
• 10: ¥1,791.095397
• 100: ¥1,689.712638
• 500: ¥1,594.068529
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

Details

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

Tray

M1A3P1000

活跃

1.26 V

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

40

85 °C

有

M1A3P1000L-FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

M1A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

2381 In Stock

• 1: ¥1,172.920866
• 10: ¥1,106.529120
• 100: ¥1,043.895397
• 500: ¥984.806973
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

Details

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

40

70 °C

有

M1A3P1000L-FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.2 mm

17 mm

17 mm

2276 In Stock

• 1: ¥1,172.920866
• 10: ¥1,106.529120
• 100: ¥1,043.895397
• 500: ¥984.806973
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P1000

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

30

70 °C

无

M1A3P1000L-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P1000L

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.2 mm

17 mm

17 mm

45 In Stock

• 1: ¥446.558833
• 10: ¥421.281921
• 100: ¥397.435770
• 500: ¥374.939406
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

A3P400

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P400-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

97 I/O

0 to 70 °C

Tray

A3P400

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

272 MHz

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

6.8 kB

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

272 MHz

1

9216

9216

400000

1.05 mm

13 mm

13 mm

无

843 In Stock

• 1: ¥55,244.285318
• 10: ¥53,427.742085
• 25: ¥53,056.347655
• 50: ¥52,687.534906
查看所有的价格

-

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

SMD/SMT

250 MHz

有

微芯片技术

1

Actel

Tray

A54SX72

活跃

2.75 V

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

2.5 V

70 °C

无

A54SX72A-1CQ208

250 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.25

N

171 I/O

2.25 V

0 C

+ 70 C

0°C ~ 70°C (TA)

A54SX72A

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

0.5 mm

unknown

S-CQFP-F208

171

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

171

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

29.21 mm

29.21 mm

2408 In Stock

• 1: ¥1,296.973150
• 10: ¥1,223.559573
• 100: ¥1,154.301489
• 500: ¥1,088.963667
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

1.14 V

- 40 C

+ 85 C

SMD/SMT

有

微芯片技术

90

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

100 °C

无

M1AGL600V2-FG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

177 I/O

-40 to 85 °C

Tray

M1AGL600V2

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.2 V to 1.5 V

INDUSTRIAL

1.575 V

1.14 V

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm