N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

40

125 °C

有

M1A3PE3000L-1FGG484M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

1.14 V

- 55 C

+ 125 C

SMD/SMT

504 kbit

350 MHz

3500 LAB

60

ProASIC3

0.014110 oz

341 I/O

35000 LE

Details

This product may require additional documentation to export from the United States.

1.575 V

Tray

M1A3PE3000

活跃

-55°C ~ 125°C (TJ)

Tray

M1A3PE3000L

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

MILITARY

25 mA

700 Mb/s

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

23 mm

23 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

60

Fusion

223

Tray

P1AFS1500

活跃

0°C ~ 85°C (TJ)

Tray

P1AFS1500

1.425V ~ 1.575V

276480

1500000

2

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

1.5000 V

1.425 V

1.575 V

114

Tray

U1AFS250

活跃

This product may require additional documentation to export from the United States.

N

有

90

Fusion

0 to 70 °C

Tray

U1AFS250

1.425V ~ 1.575V

36864

250000

STD

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

5.24

ProASIC3

90

有

SMD/SMT

Details

This product may require additional documentation to export from the United States.

178

Tray

M1A3P400

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

0°C ~ 85°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

Fusion

90

有

Details

This product may require additional documentation to export from the United States.

119

Tray

P1AFS600

活跃

0°C ~ 85°C (TJ)

Tray

P1AFS600

1.425V ~ 1.575V

110592

600000

2

N/A

-

表面贴装

QFN EP

YES

68-QFN (8x8)

68

微芯片技术

1.5 V

30

有

HVQCCN

SQUARE

活跃

5.26

49 I/O

- 20 C

+ 70 C

SMD/SMT

350 MHz

有

260

Tray

A3PN015

3

UNSPECIFIED

-20 °C

70 °C

A3PN015-2QNG68

MICROSEMI CORP

Details

1.425 V

ProASIC3 nano

活跃

1.575 V

HVQCCN, LCC68,.32SQ,16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

-20°C ~ 85°C (TJ)

Tray

A3PN015

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

49

不合格

1.5 V

1.5,1.5/3.3 V

OTHER

1 mA

49

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

15000

2

384

384

15000

0.88 mm

8 mm

8 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

60

Fusion

172

Tray

AFS600

活跃

This product may require additional documentation to export from the United States.

N

7000 LE

有

-55°C ~ 100°C (TJ)

Tray

AFS600

100 °C

-55 °C

1.425V ~ 1.575V

13.5 kB

110592

600000

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

QFP208,1.2SQ,20

-55 °C

1.5 V

40

125 °C

有

A3P1000-1PQG208M

1.36

MICROSEMI CORP

活跃

SQUARE

FQFP

350 MHz

This product may require additional documentation to export from the United States.

Details

11000 LE

154 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

有

24

ProASIC3

1.575 V

Tray

A3P1000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-55°C ~ 125°C (TJ)

Tray

A3P1000

e3

3A001.A.2.C

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5 V

1.5,1.5/3.3 V

MILITARY

8 mA

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

184

IGLOOe

215

1.5 V

Tray

M1AGL600

活跃

10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, CSP-281

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M1AGL600V2-CSG281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

1.2 V

有

0°C ~ 70°C (TA)

Tray

M1AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

0.5 mm

compliant

S-PBGA-B281

不合格

1.2 V to 1.5 V

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

13824

600000

10 mm

10 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

71 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

350 MHz

有

90

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

40

70 °C

有

A3PN125-2VQG100

-20°C ~ 85°C (TJ)

Tray

A3PN125

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

2

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

微芯片技术

BGA896,30X30,40

-55 °C

1.2 V

30

125 °C

无

M1A3PE3000L-1FG896M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

620 I/O

1.14 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

有

27

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3PE3000

活跃

1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

-55°C ~ 125°C (TJ)

Tray

M1A3PE3000L

e0

3A001.A.2.C

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

620

不合格

1.5 V

1.2/1.5,1.2/3.3 V

MILITARY

25 mA

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

31 mm

31 mm

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

119

Tray

M1AFS1500

活跃

N

有

90

Fusion

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

1.425V ~ 1.575V

276480

1500000

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

5.24

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

90

ProASIC3

178

Tray

M1A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P400-FG256I

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

-40°C ~ 100°C (TJ)

Tray

M1A3P400

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

无

AGLN125V2-VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

N

1500 LE

71 I/O

1.14 V

- 20 C

+ 70 C

SMD/SMT

250 MHz

有

90

IGLOO nano

1.575 V

Tray

AGLN125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.2 V

30

70 °C

-20°C ~ 85°C (TJ)

Tray

AGLN125V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.2 V to 1.5 V

OTHER

18 uA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

1.5 V

40

125 °C

有

M1A3P1000-PQG208M

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

有

24

ProASIC3

1.575 V

Tray

M1A3P1000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

-55°C ~ 125°C (TJ)

Tray

M1A3P1000

e3

3A001.A.2.C

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5 V

1.5,1.5/3.3 V

MILITARY

8 mA

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

5.24

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

160

ProASIC3

97

Tray

M1A3P400

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P400-1FG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

-40°C ~ 100°C (TJ)

Tray

M1A3P400

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

9216

400000

13 mm

13 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

微芯片技术

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

84

ProASIC3

221

Tray

M1A3PE3000

活跃

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

-40 °C

1.5 V

40

1.425 V

85 °C

有

M1A3PE3000-FGG324I

350 MHz

BGA

SQUARE

活跃

-40°C ~ 100°C (TJ)

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.5/3.3 V

INDUSTRIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

M1A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

-55°C ~ 125°C (TJ)

Tray

M1A3P1000

1.425V ~ 1.575V

1.5 V

8 mA

147456

1000000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

3

PLASTIC/EPOXY

BGA484,22X22,40

20

无

M1AFS1500-1FG484K

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.84

N

有

60

Fusion

223

Tray

M1AFS1500

活跃

BGA, BGA484,22X22,40

网格排列

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

223

不合格

1.5,3.3 V

33.8 kB

223

现场可编程门阵列

276480

1500000

38400

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

160

ProASIC3

1.5000 V

1.425 V

1.575 V

97

Tray

M1A3P400

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-FGG144

0 to 85 °C

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

STD

9216

400000

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

256-LBGA

YES

256

256-FPBGA (17x17)

256

微芯片技术

Fusion

119

Tray

AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-55 °C

1.5 V

30

1.425 V

100 °C

有

AFS1500-FGG256K

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

90

-55°C ~ 100°C (TJ)

Tray

AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B256

不合格

OTHER

33.8 kB

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1.5e+06

1500000

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

SQUARE

活跃

FPGA IGLOOu00ae2 Family 27696 Cells 1.2V 256-Pin VFBGA Tray

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

27696 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL025-VF256

LFBGA

0°C ~ 85°C (TJ)

Tray

M2GL025

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

27696

1130496

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

484

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2000 V

微芯片技术

1.14 V

1.26 V

IGLOO®2

85C

Commercial

FBGA

0C to 85C

267

56340

1.26(V)

1.2(V)

无

1.14(V)

0C

有

56340

表面贴装

1.26 V

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

Tray

M2GL050

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL050-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.56

This product may require additional documentation to export from the United States.

Details

56340 LE

267 I/O

1.14 V

0 C

0 to 85 °C

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

484

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

1.26 V

1.14 V

228.3 kB

667 Mb/s

267

2.44 mm

现场可编程门阵列

56340

1869824

STD

4 Transceiver

56340

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

有

60

Fusion

172

Tray

M1AFS600

-55°C ~ 100°C (TJ)

Tray

M1AFS600

100 °C

-55 °C

1.425V ~ 1.575V

13.5 kB

110592

600000

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025TS

1.14V ~ 2.625V

1.2 V

27696

1130496

2 Transceiver