品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | M2GL100TS-1FC1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 1.2 V | 无 | M2GL100TS-1FC1152I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.88 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 现场可编程门阵列 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 现场可编程门阵列 | 99512 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S100TS-1FCG1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150S-1FC1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 1.2 V | 无 | M2GL150S-1FC1152I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.88 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 现场可编程门阵列 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 现场可编程门阵列 | 146124 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S100TS-1FC1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090S-1FGG676I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 425 | Compliant | 100 °C | -40 °C | 323.3 kB | 86316 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-1PQG240M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 240 | 240 | 83 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.81 | 202 | Compliant | FQFP, QFP240,1.3SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP240,1.3SQ,20 | -55 °C | 3.3 V | 40 | 3 V | 125 °C | 有 | A42MX36-1PQG240M | e3 | 3A001.A.2.C | 哑光锡 | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G240 | 202 | 不合格 | 5 V | 3.3,3.3/5,5 V | MILITARY | 5.5 V | 3 V | 320 B | 202 | 2438 CLBS, 54000 GATES | 4.1 mm | 现场可编程门阵列 | 1184 | 54000 | 151 MHz | 1184 | 1 | 1822 | 2.3 ns | 2438 | 2438 | 54000 | 3.4 mm | 32 mm | 32 mm | 无 | ||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090S-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 484 | 267 | Compliant | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 有 | M2GL090S-1FGG484I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.3 | 100 °C | -40 °C | 现场可编程门阵列 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 323.3 kB | 267 | 现场可编程门阵列 | 86316 | 86316 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL250V2-VQ100T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 36864 | Non-Compliant | 无 | AGL250V2-VQ100T | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.79 | 70 °C | 0 °C | 8542.39.00.01 | unknown | 4.5 kB | 现场可编程门阵列 | 6144 | 250000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RT4G150L-LGG1657PROTO | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1657-BCLGA | 1657-CLGA (42.5x42.5) | 微芯片技术 | Bulk | 活跃 | -55°C ~ 125°C (TJ) | RTG4™ | 1.14V ~ 1.26V | 151824 | 5325 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS1500-2FG256 | Microchip Technology | 数据表 | 2371 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | 有 | 微芯片技术 | 90 | Fusion | 0.014110 oz | 1.575 V | Tray | AFS1500 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 85 °C | 无 | AFS1500-2FG256 | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | N | 119 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 1470.59 MHz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 不合格 | 1.5 V | OTHER | 38400 CLBS, 1500000 GATES | 1.68 mm | 现场可编程门阵列 | 276480 | 1500000 | 2 | 38400 | 1500000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-1FGG676 | Microchip Technology | 数据表 | 937 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 676-FBGA (27x27) | 676 | SMD/SMT | 763 MHz | 有 | 微芯片技术 | 40 | Actel | 0.014110 oz | 1.575 V | Tray | AX1000 | 活跃 | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.5 V | 40 | 70 °C | 有 | AX1000-1FGG676 | 763 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | This product may require additional documentation to export from the United States. | Details | 418 I/O | 1.425 V | 0 C | + 70 C | 0°C ~ 70°C (TA) | Tray | AX1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||
![]() | AFS600-2FGG484 | Microchip Technology | 数据表 | 2956 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | 484-FPBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 7000 LE | 172 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 1470.59 MHz | 有 | 60 | Fusion | 0.014110 oz | 1.575 V | Tray | AFS600 | 活跃 | 0°C ~ 85°C (TJ) | Tray | AFS600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | 2 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-PQG100 | Microchip Technology | 数据表 | 2438 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-100 | YES | 100-PQFP (20x14) | 100 | 0.062040 oz | Details | 微芯片技术 | 336 LE | 83 I/O | 5.25 V | Tray | A42MX09 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX09-PQG100 | 117 MHz | QFP | RECTANGULAR | 活跃 | FPGA - Field Programmable Gate Array MX | MICROSEMI CORP | 1.55 | 3 V | 0 C | + 70 C | SMD/SMT | 有 | 66 | Actel | 0°C ~ 70°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 3.3 V, 5 V | COMMERCIAL | - | 684 CLBS, 14000 GATES | 3.4 mm | 现场可编程门阵列 | 14000 | STD | - | 2.5 ns | 684 | 14000 | 2.7 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||
![]() | A3P250-PQ208 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | PQFP-208 | This product may require additional documentation to export from the United States. | N | 151 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 231 MHz | 有 | 24 | ProASIC3 | 0.198628 oz | 1.575 V | Tray | A3P250 | 1.5 V | 250000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300TS-FC484M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 484-BFCPGA | 484-CCGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | 300000 LE | 970 mV/1.02 V | 1 | 1.03 V/1.08 V | 284 | Tray | 活跃 | -55°C ~ 125°C (TJ) | Tray | MPF300TS | 0.97V ~ 1.08V | 1.05 V | 300000 | 21600666 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL1000V5-FGG256I | Microchip Technology | 数据表 | 2581 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | 11000 LE | 177 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 892.86 MHz | 微芯片技术 | 有 | 90 | IGLOOe | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | AGL1000 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | AGL1000V5-FGG256I | 108 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | Details | -40 to 85 °C | Tray | AGL1000V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 不合格 | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | 现场可编程门阵列 | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||
![]() | MPF050TLS-FCSG325I | Microchip Technology | 数据表 | 2909 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCS-325 | 325-BGA (11x11) | 微芯片技术 | 500 MHz | 1 | 3.6 MB | 1.03 V/1.08 V | Tray | 活跃 | 48000 LE | 176 I/O | 970 mV/1.02 V | - 40 C | + 100 C | SMD/SMT | -40°C ~ 100°C (TJ) | Tray | - | 0.97V ~ 1.08V | 1 V, 1.05 V | 3774874 | 48000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF050T-FCVG484E | Microchip Technology | 数据表 | 22 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCV-484 | 484-FBGA (19x19) | 微芯片技术 | + 100 C | SMD/SMT | 500 MHz | 1 | 3.6 MB | MSL 3 - 168 hours | 1.03 V/1.08 V | Tray | 活跃 | 48000 LE | 176 I/O | 970 mV/1.02 V | 0 C | 0°C ~ 100°C (TJ) | Tray | - | 0.97V ~ 1.08V | 1 V, 1.05 V | 3774874 | 3686.4Kbit | 48000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF050TS-1FCVG484I | Microchip Technology | 数据表 | 2508 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCV-484 | 484-FBGA (19x19) | 微芯片技术 | 500 MHz | 1 | 3.6 MB | 1.03 V/1.08 V | Tray | 活跃 | 48000 LE | 176 I/O | 970 mV/1.02 V | - 40 C | + 100 C | SMD/SMT | -40°C ~ 100°C (TJ) | Tray | - | 0.97V ~ 1.08V | 1 V, 1.05 V | 3774874 | 48000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF050TL-FCVG484I | Microchip Technology | 数据表 | 2216 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCV-484 | 484-FBGA (19x19) | 微芯片技术 | 500 MHz | 1 | 3.6 MB | Tray | 活跃 | 1.03 V/1.08 V | 48000 LE | 176 I/O | 970 mV/1.02 V | - 40 C | + 100 C | SMD/SMT | -40°C ~ 100°C (TJ) | Tray | - | 0.97V ~ 1.08V | 1 V, 1.05 V | 3774874 | 48000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF050TS-1FCSG325I | Microchip Technology | 数据表 | 2463 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCS-325 | 325-BGA (11x11) | 微芯片技术 | 500 MHz | 1 | 3.6 MB | Tray | 活跃 | 1.03 V/1.08 V | 48000 LE | 176 I/O | 970 mV/1.02 V | - 40 C | + 100 C | SMD/SMT | -40°C ~ 100°C (TJ) | Tray | - | 0.97V ~ 1.08V | 1 V, 1.05 V | 3774874 | 48000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL125V5-FG144 | Microchip Technology | 数据表 | 46 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | 0 C | + 70 C | SMD/SMT | 892.86 MHz | 有 | 微芯片技术 | 160 | IGLOOe | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | AGL125 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 85 °C | 无 | AGL125V5-FG144 | 108 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | N | 1500 LE | 97 I/O | 1.425 V | 0 to 70 °C | Tray | AGL125V5 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | 不合格 | 1.5 V | OTHER | 3072 CLBS, 125000 GATES | 1.55 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||
![]() | AX1000-1FG676I | Microchip Technology | 数据表 | 942 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 微芯片技术 | 40 | Actel | 0.014110 oz | 1.575 V | Tray | AX1000 | 活跃 | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | -40 °C | 1.5 V | 30 | 85 °C | 无 | AX1000-1FG676I | 763 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | This product may require additional documentation to export from the United States. | N | 418 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 763 MHz | 有 | -40°C ~ 85°C (TA) | Tray | AX1000 | e0 | 锡铅 | 85 °C | -40 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 763 MHz | S-PBGA-B676 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 763 MHz | 18144 | 12096 | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | 无 | ||||||||||||||||
![]() | A42MX36-1CQ208M | Microchip Technology | 数据表 | 786 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | CQFP-208 | YES | 208 | 208-CQFP (75x75) | 208 | 微芯片技术 | Tray | A42MX36 | 活跃 | CERAMIC, QFP-208 | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | -55 °C | 3.3 V | 20 | 125 °C | 无 | A42MX36-1CQ208M | 83 MHz | GQFF | SQUARE | 活跃 | MICROSEMI CORP | 5.19 | QFP | This product may require additional documentation to export from the United States. | N | 176 I/O | 3.3 V | - 55 C | + 125 C | SMD/SMT | 有 | 1 | Actel | 3.3 V | -55°C ~ 125°C (TC) | A42MX36 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | FLAT | 225 | 0.5 mm | compliant | 208 | S-CQFP-F208 | 不合格 | 3.3 V | MILITARY | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 3.3 mm | 现场可编程门阵列 | 1184 | 2560 | 54000 | 1184 | 1 | 1822 | 2.3 ns | 2438 | 2414 | 54000 | 29.21 mm | 29.21 mm | 无 | ||||||||||||||||||||||||||||
![]() | APA300-BG456 | Microchip Technology | 数据表 | 2959 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-456 | YES | 456-PBGA (35x35) | 456 | 0 C | + 70 C | SMD/SMT | 180 MHz | 有 | 微芯片技术 | 24 | Actel | 2.5000 V | 2.3 V | 2.7 V | 2.7 V | Tray | APA300 | 活跃 | BGA, BGA456,26X26,50 | 网格排列 | 3 | PLASTIC/EPOXY | BGA456,26X26,50 | 2.5 V | 30 | 70 °C | 无 | APA300-BG456 | 180 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | N | 290 I/O | 2.3 V | 0 to 70 °C | Tray | APA300 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 456 | S-PBGA-B456 | 290 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 290 | 300000 GATES | 2.54 mm | 现场可编程门阵列 | 73728 | 300000 | STD | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm |
M2GL100TS-1FC1152I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2S100TS-1FCG1152I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL150S-1FC1152I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2S100TS-1FC1152I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL090S-1FGG676I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX36-1PQG240M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL090S-1FGG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL250V2-VQ100T
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
RT4G150L-LGG1657PROTO
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS1500-2FG256
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
2,253.809443
AX1000-1FGG676
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
6,300.678407
AFS600-2FGG484
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,824.061259
A42MX09-PQG100
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,220.157038
A3P250-PQ208
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF300TS-FC484M
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL1000V5-FGG256I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,273.728893
MPF050TLS-FCSG325I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
896.877659
MPF050T-FCVG484E
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF050TS-1FCVG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,052.431912
MPF050TL-FCVG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,220.410260
MPF050TS-1FCSG325I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
896.877659
AGL125V5-FG144
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
177.955610
AX1000-1FG676I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
8,112.107876
A42MX36-1CQ208M
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
60,004.943489
APA300-BG456
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
3,338.791383
