N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

763 MHz

有

60

Actel

0.014110 oz

Axcelerator

微芯片技术

85C

Industrial

FBGA

1000000

-40C to 85C

317

612000

12096

0.15um

1.575(V)

1.5(V)

无

1.425(V)

-40C

有

12096

12096

表面贴装

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

AX1000-1FG484I

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.54

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tray

AX1000

e0

锡铅

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

763(MHz)

484

S-PBGA-B484

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

12096

1

12096

0.84 ns

12096

18144

1000000

1.73 mm

23 mm

23 mm

无

含铅

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

1.575 V

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

763 MHz

有

60

Actel

0.014110 oz

Tray

AX500

活跃

-55°C ~ 125°C (TA)

Tray

AX500

1.425V ~ 1.575V

1.5 V

73728

500000

8064

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

AX1000-1FG484

763 MHz

BGA

0°C ~ 70°C (TA)

Tray

AX1000

e0

锡铅

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

763 MHz

S-PBGA-B484

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

12096

1

12096

0.84 ns

12096

18144

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

0 C

+ 70 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

2.7 V

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

N

186 I/O

2.3 V

0°C ~ 70°C (TA)

Tray

APA600

70 °C

0 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

STD

21504

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-208

208

208-CQFP (75x75)

微芯片技术

5 MHz

有

1

APA600

This product may require additional documentation to export from the United States.

N

2.5 V

Actel

2.5 V

Tray

活跃

158 I/O

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TC)

APA600

125 °C

-55 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

5 MHz

21504

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P1000-FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

11000 LE

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

活跃

LBGA,

0 to 70 °C

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

Details

113 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

238 MHz

有

60

Actel

0.046530 oz

2.75 V

Tray

A54SX32

活跃

-40°C ~ 125°C (TA)

Tray

A54SX32A

2.25V ~ 5.25V

2.5 V

48000

2880

1.4 mm

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

This product may require additional documentation to export from the United States.

N

119 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

AFS1500

85 °C

-40 °C

1.425V ~ 1.575V

1.0989 GHz

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.0989 GHz

STD

38400

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

70 °C

无

A40MX04-FPL44

48 MHz

QCCJ

SQUARE

Obsolete

MICROSEMI CORP

5.19

LCC

N

547 LE

34 I/O

3 V

0 C

+ 70 C

SMD/SMT

83 MHz

有

547 LAB

27

Actel

0.084185 oz

Tray

A40MX04

Obsolete

5.25 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

30

0°C ~ 70°C (TA)

Tube

A40MX04

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

44

S-PQCC-J44

不合格

3.3 V, 5 V

COMMERCIAL

-

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

-

3.7 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

N/A

-

Production (Last Updated: 1 month ago)

Lead, Silver, Tin

表面贴装

表面贴装

BGA-456

456

456-PBGA (35x35)

微芯片技术

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.7 V

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

N

356 I/O

2.3 V

-40 to 85 °C

Tray

APA600

85 °C

-40 °C

2.3V ~ 2.7V

180 MHz

456

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

STD

21504

1.73 mm

35 mm

35 mm

无

含铅

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

活跃

0.014110 oz

Actel

60

有

649 MHz

SMD/SMT

+ 125 C

- 55 C

1.425 V

317 I/O

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

AX500

-55°C ~ 125°C (TA)

Tray

AX500

1.425V ~ 1.575V

1.5 V

73728

500000

8064

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

FQFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

158 I/O

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

有

24

Actel

2.7 V

Tray

APA1000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

2.5 V

40

125 °C

有

APA1000-PQG208M

180 MHz

-55°C ~ 125°C (TC)

Tray

APA1000

e3

3A001.A.2.C

Matte Tin (Sn)

125 °C

-55 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

158

不合格

2.5 V

2.5,2.5/3.3 V

MILITARY

2.7 V

2.3 V

24.8 kB

158

1000000 GATES

4.1 mm

现场可编程门阵列

202752

1000000

180 MHz

56320

56320

1000000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

240 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.35

Details

1800 LE

174 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

240 MHz

有

24

Actel

Tray

A54SX32

活跃

5.25 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

3.3 V

40

85 °C

有

A54SX32-PQG208I

-40°C ~ 85°C (TA)

Tray

A54SX32

e3

Matte Tin (Sn)

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

240 MHz

S-PQFP-G208

174

不合格

3.3 V, 5 V

3.3,5 V

INDUSTRIAL

5.5 V

4.5 V

900 ps

900 ps

-

174

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

2880

48000

240 MHz

2880

2880

STD

-

1080

0.9 ns

2880

2880

32000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP

YES

352

352-CQFP (75x75)

10.567001 g

352

微芯片技术

GQFF

SQUARE

活跃

MICROSEMI CORP

5.3

Military grade

This product may require additional documentation to export from the United States.

N

198 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

763 MHz

有

1

Actel

0.372740 oz

1.575 V

Tray

AX2000

活跃

GQFF, TPAK352,2.9SQ,20

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

TPAK352,2.9SQ,20

-55 °C

1.5 V

20

125 °C

无

AX2000-1CQ352M

763 MHz

-55°C ~ 125°C (TA)

AX2000

e0

3A001.A.2.C

锡铅

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F352

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

36 kB

850 ps

684

21504 CLBS, 2000000 GATES

2.89 mm

现场可编程门阵列

21504

294912

2000000

763 MHz

32256

MIL-STD-883 Class B

1

21504

0.84 ns

21504

32256

2000000

2.66 mm

48 mm

48 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

294 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

203 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

294 MHz

有

90

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

30

70 °C

无

A54SX72A-2FG256

0°C ~ 70°C (TA)

Tray

A54SX72A

e0

TIN LEAD/TIN LEAD SILVER

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

203

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

203

6036 CLBS, 108000 GATES

1.97 mm

现场可编程门阵列

108000

6036

1.1 ns

6036

6036

108000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

无

AX250-FG256

649 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

138 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

649 MHz

有

90

Actel

0.014110 oz

Tray

AX250

活跃

1.575 V

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA256,16X16,40

1.5 V

30

70 °C

0°C ~ 70°C (TA)

Tray

AX250

3A001.A.7.A

TIN LEAD/TIN LEAD SILVER

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

248

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

248

2816 CLBS, 250000 GATES

1.7 mm

现场可编程门阵列

55296

250000

4224

0.99 ns

2816

4224

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

320 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

175 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

320 MHz

有

24

Actel

Tray

A54SX16

活跃

3.6 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

3.3 V

40

85 °C

有

A54SX16P-2PQG208I

-40°C ~ 85°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

3.3 V, 5 V

3.3,3.3/5 V

INDUSTRIAL

175

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

0.7 ns

1452

1452

16000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

有

A54SX32A-2TQG144I

313 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

113 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

313 MHz

有

60

Actel

0.046530 oz

2.75 V

Tray

A54SX32

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-40 °C

2.5 V

40

85 °C

-40°C ~ 85°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

113

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

Details

203 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

238 MHz

有

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

-40°C ~ 125°C (TA)

Tray

A54SX32A

2.25V ~ 5.25V

2.5 V

48000

2880

STD

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

+ 85 C

SMD/SMT

180 MHz

有

-

90

27648 bit

ProASICPLUS

微芯片技术

0.023175 oz

PROASICPLUS

85C

INDUSTRIALC

TQFP

75000

-40C to 85C

66

75000

0.22UM

2.7(V)

2.5(V)

2.3(V)

-40C

有

3072

表面贴装

2.7 V

Tray

APA075

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-40 °C

2.5 V

40

85 °C

有

APA075-TQG100I

180 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

1.56

Details

1000 LE

66 I/O

2.3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

APA075

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

180(MHz)

100

S-PQFP-G100

66

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

5 mA

-

66

75000 GATES

1.6 mm

现场可编程门阵列

27648

75000

STD

-

3072

75000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P1000-1FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

11000 LE

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

活跃

-40 to 85 °C

Tray

A3P1000

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

0 C

+ 70 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

Tray

APA600

活跃

2.7 V

This product may require additional documentation to export from the United States.

Details

186 I/O

2.3 V

0°C ~ 70°C (TA)

Tray

APA600

70 °C

0 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

STD

21504

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

370 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

60

Actel

0.014110 oz

Tray

APA600

活跃

2.7 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

2.5 V

40

70 °C

有

APA600-FGG484

180 MHz

BGA

0°C ~ 70°C (TA)

Tray

APA600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

250

1 mm

compliant

180 MHz

S-PBGA-B484

370

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

2.7 V

2.3 V

15.8 kB

370

600000 GATES

2.44 mm

现场可编程门阵列

129024

600000

180 MHz

STD

21504

21504

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

313 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

81 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

有

90

Actel

0.023175 oz

2.75 V

Tray

A54SX08

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

40

70 °C

有

A54SX08A-2TQG100

0°C ~ 70°C (TA)

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

127

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

127

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

0.9 ns

768

768

12000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

微芯片技术

40

85 °C

有

A3P250-1VQG100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

A3P250

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

0 to 70 °C

Tray

A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm