N/A

-

表面贴装

YES

84

84

CHIP CARRIER

3

PLASTIC/EPOXY

72

Compliant

LDCC84,1.2SQ

5 V

40

4.75 V

70 °C

有

A1280A-1PLG84C

75 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

5.8

QCCJ, LDCC84,1.2SQ

e3

哑光锡

70 °C

0 °C

MAX 72 I/OS

8542.39.00.01

现场可编程门阵列

CMOS

5 V

QUAD

J BEND

245

1.27 mm

compliant

90 MHz

S-PQCC-J84

140

不合格

5 V

COMMERCIAL

4.3 ns

140

1232 CLBS, 8000 GATES

4.45 mm

现场可编程门阵列

1232

8000

1232

1

998

4.3 ns

1232

1232

5.25 V

4.75 V

8000

29.21 mm

29.21 mm

无

N/A

-

表面贴装

YES

144

144

5.78

104

Non-Compliant

QFP,

FLATPACK

3

PLASTIC/EPOXY

-55 °C

5 V

30

4.5 V

125 °C

无

A1240A-1PQ144M

QFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

e0

3A001.A.2.C

锡铅

125 °C

-55 °C

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

225

0.65 mm

compliant

110 MHz

S-PQFP-G144

不合格

MILITARY

4.3 ns

684 CLBS, 4000 GATES

4.1 mm

现场可编程门阵列

684

4000

684

1

568

684

5.5 V

4.5 V

4000

28 mm

28 mm

无

N/A

-

表面贴装

YES

84

84

5.82

70

Compliant

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

5 V

40

4.75 V

70 °C

有

A1415A-PLG84C

125 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

e3

哑光锡

70 °C

0 °C

MAX 70 I/OS

CMOS

5 V

QUAD

J BEND

245

1.27 mm

compliant

125 MHz

S-PQCC-J84

不合格

COMMERCIAL

3 ns

3 ns

200 CLBS, 1500 GATES

4.572 mm

现场可编程门阵列

200

1500

200

264

3 ns

200

5.25 V

4.75 V

1500

29.3116 mm

29.3116 mm

无

N/A

-

表面贴装

YES

80

80

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.465 V

8.77

QFP

8542390000/8542390000/8542390000/8542390000/8542390000

69

Non-Compliant

1 MM, VQFP-80

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

TQFP80,.6SQ

3.3 V

30

3.135 V

70 °C

无

A10V20B-VQ80C

45 MHz

TQFP

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

MAX 69 I/OS

8542.39.00.01

现场可编程门阵列

CMOS

3.3 V

QUAD

鸥翼

225

0.65 mm

compliant

S-PQFP-G80

69

不合格

3.3 V

COMMERCIAL

6.5 ns

69

547 CLBS, 2000 GATES

1.2 mm

现场可编程门阵列

2000

547

273

4.5 ns

547

547

2000

14 mm

14 mm

无

含铅

N/A

-

表面贴装

YES

44

44

MICROSEMI CORP

5.25 V

5.79

8542390000/8542390000/8542390000/8542390000/8542390000

34

Compliant

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

5 V

40

4.75 V

70 °C

有

A1020B-PLG44C

45 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

e3

Matte Tin (Sn)

70 °C

0 °C

MAX 34 I/OS

8542.39.00.01

CMOS

5 V

QUAD

J BEND

245

1.27 mm

compliant

48 MHz

S-PQCC-J44

不合格

COMMERCIAL

4.5 ns

4.5 ns

547 CLBS, 2000 GATES

4.445 mm

现场可编程门阵列

547

2000

547

273

4.5 ns

547

5.25 V

4.75 V

2000

16.51 mm

16.51 mm

无

N/A

-

表面贴装

YES

84

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

5.84

72

Compliant

QCCJ, LDCC84,1.2SQ

CHIP CARRIER

3

PLASTIC/EPOXY

LDCC84,1.2SQ

-40 °C

5 V

30

4.5 V

85 °C

无

A1280A-1PL84I

75 MHz

QCCJ

e0

锡铅

85 °C

-40 °C

MAX 72 I/OS

8542.39.00.01

现场可编程门阵列

CMOS

5 V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J84

140

不合格

5 V

INDUSTRIAL

4.3 ns

140

1232 CLBS, 8000 GATES

4.45 mm

现场可编程门阵列

8000

1232

1

998

4.3 ns

1232

1232

8000

29.21 mm

29.21 mm

无

N/A

-

表面贴装

YES

176

176

MICROSEMI CORP

5.25 V

5.84

104

Non-Compliant

1.40 MM, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

5 V

30

4.75 V

70 °C

无

A1240A-TQ176C

66 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

e0

锡铅

70 °C

0 °C

PLD EQUIVALENT GATES=10000

现场可编程门阵列

CMOS

5 V

QUAD

鸥翼

225

0.5 mm

compliant

90 MHz

S-PQFP-G176

104

不合格

5 V

COMMERCIAL

5 ns

104

684 CLBS, 4000 GATES

1.6 mm

现场可编程门阵列

684

4000

684

568

5 ns

684

684

5.25 V

4.75 V

4000

24 mm

24 mm

无

N/A

-

表面贴装

84

69

Compliant

70 °C

0 °C

5 V

48 MHz

4.5 ns

4.5 ns

547

2000

547

273

5.25 V

4.75 V

无

N/A

-

表面贴装

表面贴装

YES

240

Polytetrafluoroethylene (PTFE)

240

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.81

500V

202

Compliant

FQFP, QFP240,1.3SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP240,1.3SQ,20

-40 °C

3.3 V

40

3 V

85 °C

有

A42MX36-3PQG240I

100 MHz

FQFP

SQUARE

-65°C ~ 125°C

A1_HV

--

e3

活跃

哑光锡

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G240

202

不合格

3.3,3.3/5,5 V

INDUSTRIAL

320 B

3000 @ 100MHz

202

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

Top

1184

54000

180 MHz

1184

3

1822

1.9 ns

2438

2438

5.5 V

3 V

0.5 ~ 8pF

54000

Sealed

3.4 mm

0.440 (11.18mm)

32 mm

32 mm

无

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

有

Details

608 LE

+ 85 C

5.5 V

0.188543 oz

微芯片技术

- 40 C

90

3 V

SMD/SMT

Microchip

Microchip Technology / Atmel

Actel

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX16-VQG100I

94 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.28

3 V

5.5 V

83

Tray

A42MX16

活跃

-40°C ~ 85°C (TA)

Tray

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

可编程逻辑集成电路

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

-

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

24000

STD

-

2.8 ns

1232

1232

24000

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

484-BGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

有

M1AFS600-2FGG484I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.62

1.5000 V

1.425 V

1.575 V

8542310000/8542310000/8542310000/8542310000/8542310000

172

Compliant

Tray

M1AFS600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

85 °C

-40 to 85 °C

Fusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1.47059 GHz

2

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

700 LE

18432 bit

71 I/O

+ 85 C

1.575 V

0.289093 oz

0 C

90

微芯片技术

1.425 V

SMD/SMT

Microchip

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

Tray

A3P060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P060-1VQG100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.32

1.5000 V

1.425 V

1.575 V

有

0 to 70 °C

Tray

A3P060

e3

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

2 mA

-

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

18432

60000

1

-

1536

60000

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm

N/A

-

表面贴装

80-TQFP

YES

80

80-VQFP (14x14)

80

微芯片技术

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

QFP

57

Tray

A40MX02

Obsolete

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A40MX02-1VQ80I

92 MHz

TQFP

SQUARE

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

S-PQFP-G80

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2.3 ns

295

3000

14 mm

14 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

584

Tray

MPF500

活跃

有

This product may require additional documentation to export from the United States.

481000 LE

+ 100 C

1.08 V

1.771987 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

-40°C ~ 100°C (TJ)

Tray

PolarFire™

可编程逻辑集成电路

0.97V ~ 1.08V

12.5 Gb/s

481000

FPGA - Field Programmable Gate Array

33792000

24 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

68-LCC (J-Lead)

YES

68

68-PLCC (24.23x24.23)

68

微芯片技术

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

LCC

Non-Compliant

57

Tray

A40MX04

Obsolete

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A40MX04-2PL68I

101 MHz

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J68

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

24.2316 mm

24.2316 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

896

400.011771 mg

896

620

Compliant

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

70 °C

有

M1AGLE3000V2-FGG896

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

e1

锡银铜

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

245

1 mm

compliant

S-PBGA-B896

不合格

COMMERCIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

3e+06

892.86 MHz

75264

75264

1.575 V

1.14 V

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

YES

Brass

84

ACTEL CORP

3.6 V

5.87

Killark-Hubbell Electrical Products

69

Non-Compliant

PLASTIC, MS-007-AE, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

LDCC84,1.2SQ

3.3 V

30

3 V

70 °C

无

A10V20B-PL84C

50 MHz

QCCJ

SQUARE

Obsolete

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

Metallic

MAX 69 I/OS

现场可编程门阵列

CMOS

3.3 V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J84

69

不合格

3.3 V

COMMERCIAL

6.5 ns

69

547 CLBS, 2000 GATES

4.45 mm

现场可编程门阵列

2000

547

273

4.5 ns

547

547

2000

29.21 mm

29.21 mm

无

N/A

-

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

无

A54SX08-2FG144I

320 MHz

LBGA

SQUARE

Microsemi Corporation

GRID ARRAY, LOW PROFILE

LBGA, BGA144,12X12,40

活跃

MICROSEMI CORP

3.6 V

5.24

3.3, 5 V

2.97, 4.5 V

3.63, 5.5 V

111

Tray

A54SX08

活跃

Compliant

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

3.3 V

30

3 V

85 °C

-40 to 85 °C

SX

e0

锡铅银

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

225

1 mm

compliant

320 MHz

S-PBGA-B144

111

不合格

3.3,5 V

INDUSTRIAL

700 ps

700 ps

111

768 CLBS, 8000 GATES

1.55 mm

现场可编程门阵列

768

12000

320 MHz

768

768

2

256

0.7 ns

768

768

5.5 V

4.5 V

8000

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

Tray

A3P400

活跃

有

54 kbit

5000 LE

55296 bit

54 kbit

+ 100 C

1.575 V

微芯片技术

- 40 C

24

1.425 V

SMD/SMT

-

Microchip

Microchip Technology / Atmel

231 MHz

ProASIC3

Details

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P400-PQG208I

350 MHz

FQFP

SQUARE

活跃

FPGA ProASICu00ae3 Family 400K Gates 231MHz 130nm Technology 1.5V 208-Pin PQFP Tray

MICROSEMI CORP

1.34

1.5000 V

151

-40 to 85 °C

Tray

ProASIC3

e3

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

30 mA

-

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

55296

400000

STD

-

9216

400000

FPGA - Field Programmable Gate Array

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

有

This product may require additional documentation to export from the United States.

300000 LE

20.6 Mbit

244 I/O

+ 100 C

1.08 V

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

MPF300

活跃

-40°C ~ 100°C (TJ)

Tray

MPF300TS

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094400

8 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

300

Tray

MPF300

活跃

300000 LE

+ 100 C

1.03 V/1.08 V

- 40 C

970 mV/1.02 V

SMD/SMT

-40°C ~ 100°C (TJ)

PolarFire™

0.97V ~ 1.08V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

Non-Compliant

有

This product may require additional documentation to export from the United States.

300000 LE

20.6 Mbit

388 I/O

+ 100 C

1.08 V

2.842997 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Tray

MPF300

活跃

-40°C ~ 100°C (TJ)

Tray

MPF300T

可编程逻辑集成电路

1.05 V

不适用

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094.4Kbit

16 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

Non-Compliant

1.08 V

1.627244 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

有

This product may require additional documentation to export from the United States.

109000 LE

170 I/O

7.6 Mbit

+ 100 C

Tray

MPF100

活跃

-40°C ~ 100°C (TJ)

Tray

MPF100T

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

109000

FPGA - Field Programmable Gate Array

7782.4Kbit

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

有

109000 LE

284 I/O

7.6 Mbit

+ 100 C

1.08 V

5.762942 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

活跃

MPF100

Tray

-40°C ~ 100°C (TJ)

Tray

MPF100T

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

109000

FPGA - Field Programmable Gate Array

7782.4Kbit

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

300

Tray

MPF300

活跃

300000 LE

+ 100 C

1.03 V/1.08 V

- 40 C

970 mV/1.02 V

SMD/SMT

-40°C ~ 100°C (TJ)

PolarFire™

0.97V ~ 1.08V

12.7 Gb/s

300000

21094400