N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

85 °C

有

A3P060-1TQG144

350 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

91 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.046530 oz

1.5000 V

1.575 V

Tray

A3P060

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

0 to 70 °C

Tray

A3P060

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

不合格

1.5 V

COMMERCIAL

1536 CLBS, 60000 GATES

1.6 mm

现场可编程门阵列

18432

60000

1

1536

60000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

2.5 V

40

125 °C

有

A54SX32A-1PQG208M

278 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

174 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

278 MHz

有

24

Actel

2.75 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

-55°C ~ 125°C (TC)

Tray

A54SX32A

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

2.5 V

2.5,3.3/5 V

MILITARY

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

A54SX16P-1PQG208

280 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

175 I/O

3 V

0 C

+ 70 C

SMD/SMT

280 MHz

有

24

Actel

Tray

A54SX16

活跃

3.6 V

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

3.3 V

40

70 °C

有

0°C ~ 70°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

3.3 V, 5 V

3.3,3.3/5 V

COMMERCIAL

175

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

0.8 ns

1452

1452

16000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

223 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

AFS1500-2FG484

BGA

SQUARE

0°C ~ 85°C (TJ)

Tray

AFS1500

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

1.5 V

OTHER

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

ProASIC3

0.046530 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P060

活跃

Details

91 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

60

-40 to 85 °C

Tray

A3P060

1.425V ~ 1.575V

1.5 V

18432

60000

1

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

1.5 V

40

85 °C

有

A3P125-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

133 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

A3P125

活跃

1.575 V

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

0 to 70 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

3072 CLBS, 125000 GATES

4.1 mm

现场可编程门阵列

36864

125000

1

3072

125000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

5.29

MICROSEMI CORP

IC FPGA 158 I/O 208QFP

活跃

SQUARE

FQFP

180 MHz

APA1000-PQG208I

有

85 °C

40

2.5 V

-40 °C

QFP208,1.2SQ,20

PLASTIC/EPOXY

3

This product may require additional documentation to export from the United States.

Details

158 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

24

Actel

2.3 V

2.7 V

8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/85

2.7 V

Tray

APA1000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

-40°C ~ 85°C (TA)

Tray

APA1000

e3

3A001.A.7.A

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

245

0.5 mm

compliant

180 MHz

S-PQFP-G208

158

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

2.7 V

2.3 V

24.8 kB

158

1000000 GATES

4.1 mm

现场可编程门阵列

202752

1000000

180 MHz

STD

56320

56320

1000000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

2.3 V

- 40 C

+ 85 C

SMD/SMT

0.014110 oz

Actel

160

有

180 MHz

微芯片技术

PROASICPLUS

85C

Industrial

FBGA

300000

-40C to 85C

100

300000

0.22UM

2.7(V)

2.5(V)

无

2.3(V)

-40C

有

8192

表面贴装

2.7 V

Tray

APA300

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

2.5 V

40

85 °C

有

APA300-FGG144I

180 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

100 I/O

-40°C ~ 85°C (TA)

Tray

APA300

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

260

1 mm

compliant

180(MHz)

144

S-PBGA-B144

100

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

100

300000 GATES

1.55 mm

现场可编程门阵列

73728

300000

STD

8192

300000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

-40 °C

3.3 V

40

85 °C

有

A42MX24-PQG208I

91.8 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.27

FLATPACK, FINE PITCH

FQFP,

Details

912 LE

176 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

24

Actel

3.748176 oz

3.3, 5 V

3 V

5.5 V

5.5 V

Tray

A42MX24

活跃

3

PLASTIC/EPOXY

-40 to 85 °C

Tray

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

-

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

250 MHz

912

STD

-

1410

2.5 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-256

YES

256

256-CQFP (75x75)

256

微芯片技术

5.19

QFP

This product may require additional documentation to export from the United States.

N

202 I/O

3.3 V

- 55 C

+ 125 C

SMD/SMT

1

Actel

3.3 V

Tray

A42MX36

活跃

CERAMIC, QFP-256

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

20

125 °C

无

A42MX36-1CQ256M

83 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

-55°C ~ 125°C (TC)

A42MX36

e0

3A001.A.2.C

锡铅

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

FLAT

225

0.5 mm

compliant

256

S-CQFP-F256

不合格

3.3 V

MILITARY

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

1184

2560

54000

1184

1

1822

2.3 ns

2438

54000

36 mm

36 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

BGA256,16X16,40

-40 °C

2.5 V

40

85 °C

有

APA150-FGG256I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

186 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

2.7 V

Tray

APA150

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

-40°C ~ 85°C (TA)

Tray

APA150

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

186

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

186

150000 GATES

1.8 mm

现场可编程门阵列

36864

150000

STD

6144

150000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

Tray

APA750

活跃

This product may require additional documentation to export from the United States.

Details

158 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

-40 to 85 °C

Tray

APA750

85 °C

-40 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

18 kB

147456

750000

180 MHz

STD

32768

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

2.5 V

40

85 °C

有

A54SX32A-2PQG208I

313 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.39

Details

174 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

313 MHz

有

24

Actel

2.5000 V

2.25 V

2.75 V

Tray

A54SX32

活跃

2.75 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

-40 to 85 °C

Tray

A54SX32A

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

2

0.9 ns

2880

2880

48000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

微芯片技术

85 °C

无

A54SX32A-1BG329I

278 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

249 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

278 MHz

有

27

Actel

2.75 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

2.5 V

30

-40°C ~ 85°C (TA)

Tray

A54SX32A

e0

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P1000-1FGG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

-40°C ~ 100°C (TJ)

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

有

A42MX24-PQG208

84 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.55

Details

176 I/O

3 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

24

Actel

3.3, 5 V

3 V

5.25 V

Tray

A42MX24

活跃

5.25 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

未说明

70 °C

0 to 70 °C

Tray

A42MX24

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

250 MHz

912

STD

1410

2.5 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P250-1FGG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

157 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P250

-40 to 85 °C

Tray

A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.8 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

微芯片技术

85 °C

无

A54SX32-1BG329I

280 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

249 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

280 MHz

有

27

Actel

3.6 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

3.3 V

30

-40°C ~ 85°C (TA)

Tray

A54SX32

e0

锡铅

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

3.3 V, 5 V

3.3,5 V

INDUSTRIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

85 °C

有

AX1000-FGG484I

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

317 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

649 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

40

-40°C ~ 85°C (TA)

Tray

AX1000

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B484

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

12096

12096

0.99 ns

12096

18144

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

2.5 V

40

85 °C

有

A54SX72A-1PQG208I

250 MHz

FQFP

SQUARE

活跃

FPGA - Field Programmable Gate Array SXA

MICROSEMI CORP

5.24

Details

171 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

24

Actel

2.5000 V

2.25 V

2.75 V

2.75 V

Tray

A54SX72

活跃

FQFP, QFP208,1.2SQ,20

-40 to 85 °C

Tray

A54SX72A

e3

Matte Tin (Sn)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

171

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

171

6036 CLBS, 108000 GATES

4.1 mm

现场可编程门阵列

108000

6036

1

1.3 ns

6036

6036

108000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

This product may require additional documentation to export from the United States.

N

223 I/O

0°C ~ 85°C (TJ)

Tray

AFS1500

70 °C

0 °C

1.425V ~ 1.575V

1.0989 GHz

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.0989 GHz

STD

38400

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

2.5 V

40

125 °C

有

A54SX72A-1PQG208M

250 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

171 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

250 MHz

有

24

Actel

2.75 V

Tray

A54SX72

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

-55°C ~ 125°C (TC)

Tray

A54SX72A

3A001.A.2.C

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

171

不合格

2.5 V

2.5,3.3/5 V

MILITARY

171

6036 CLBS, 108000 GATES

4.1 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

3

GRID ARRAY, LOW PROFILE

LBGA,

This product may require additional documentation to export from the United States.

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

LBGA

AFS1500-FG256

无

85 °C

30

1.5 V

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

Tray

AFS1500

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

1.0989 GHz

S-PBGA-B256

不合格

1.5 V

OTHER

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

1.68 mm

现场可编程门阵列

276480

1500000

1.0989 GHz

STD

38400

38400

1500000

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-456

YES

456

456-PBGA (35x35)

456

微芯片技术

PLASTIC/EPOXY

BGA456,26X26,50

-40 °C

2.5 V

40

85 °C

有

APA750-BGG456I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

356 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA750

活跃

BGA, BGA456,26X26,50

网格排列

3

-40 to 85 °C

Tray

APA750

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

245

1.27 mm

compliant

456

S-PBGA-B456

356

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

2.7 V

2.3 V

18 kB

356

750000 GATES

2.54 mm

现场可编程门阵列

147456

750000

180 MHz

STD

32768

32768

750000

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

-40 °C

1.5 V

85 °C

有

M7A3P1000-1PQG208I

350 MHz

FQFP

SQUARE

不推荐

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

M7A3P1000

活跃

1.575 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

0.5 mm

compliant

272 MHz

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

272 MHz

1

24576

24576

1000000

3.4 mm

28 mm

28 mm

无