品牌是'Microchip' (5152)
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![]() | M7A3P1000-1PQG208 | Microchip Technology | 数据表 | 2507 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | PQFP-208 | 208 | 208-PQFP (28x28) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 154 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 272 MHz | 有 | 24 | ProASIC3 | 1.425 V | 1.575 V | 1.575 V | Tray | M7A3P1000 | 活跃 | 0°C ~ 85°C (TJ) | Tray | M7A3P1000 | 70 °C | 0 °C | 1.425V ~ 1.575V | 272 MHz | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 272 MHz | 1 | 24576 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-TQG144A | Microchip Technology | 数据表 | 2007 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-144 | 144-TQFP (20x20) | 微芯片技术 | Details | 113 I/O | 2.25 V | - 40 C | + 125 C | SMD/SMT | 227 MHz | 有 | 60 | Actel | 0.046530 oz | 2.75 V | Tray | A54SX16 | 活跃 | -40°C ~ 125°C (TA) | Tray | A54SX16A | 2.25V ~ 5.25V | 2.5 V | 24000 | 1452 | STD | 1.4 mm | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M7A3P1000-FGG484I | Microchip Technology | 数据表 | 2247 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | 微芯片技术 | 活跃 | This product may require additional documentation to export from the United States. | Details | 0.014110 oz | ProASIC3 | 60 | 有 | 231 MHz | SMD/SMT | + 85 C | - 40 C | 1.425 V | 300 I/O | 1.575 V | 1.425 V | 1.5000 V | 1.575 V | Tray | M7A3P1000 | -40 to 85 °C | Tray | M7A3P1000 | 85 °C | -40 °C | 1.425V ~ 1.575V | 231 MHz | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 231 MHz | STD | 24576 | 1.73 mm | 23 mm | 23 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010-VFG400 | Microchip Technology | 数据表 | 12 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | 1.2 V | 0 C | + 85 C | SMD/SMT | 微芯片技术 | 有 | 90 | IGLOO2 | 0.236938 oz | Tray | M2GL010 | 活跃 | 1.2 V | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 85 °C | 有 | M2GL010-VFG400 | LFBGA | SQUARE | 活跃 | FPGA - Field Programmable Gate Array M2GL010-VFG400 | MICROSEMI CORP | 1.6 | This product may require additional documentation to export from the United States. | Details | 12084 LE | 195 I/O | 0°C ~ 85°C (TJ) | Tray | M2GL010 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B400 | 195 | 不合格 | 1.2 V | 1.2 V | OTHER | 195 | 1.51 mm | 现场可编程门阵列 | 12084 | 933888 | STD | 12084 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||
![]() | M2GL060TS-1FGG484M | Microchip Technology | 数据表 | 2704 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | 484-FPBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 56520 LE | 267 I/O | 1.2 V | - 55 C | + 125 C | SMD/SMT | M2GL-EVAL-KIT | 200 MHz | 60 | 1826 kbit | IGLOO2 | 1.2 V | Tray | M2GL060 | 活跃 | -55°C ~ 125°C (TJ) | Tray | M2GL060TS | 1.14V ~ 2.625V | 1.2 V | 5 Gb/s | 56520 | 1869824 | 4 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060T-1FGG484M | Microchip Technology | 数据表 | 2671 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | 484-FPBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 56520 LE | 267 I/O | 1.2 V | - 55 C | + 125 C | SMD/SMT | 60 | IGLOO2 | 1.2 V | Tray | M2GL060 | 活跃 | -55°C ~ 125°C (TJ) | Tray | M2GL060T | 1.14V ~ 2.625V | 1.2 V | 56520 | 1869824 | 4 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010T-1VF400 | Microchip Technology | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | VFPBGA-400 | YES | 400 | 400-VFBGA (17x17) | 400 | 微芯片技术 | 90 | IGLOO2 | 1.2 V | Tray | M2GL010 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 20 | 85 °C | 无 | M2GL010T-1VF400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | N | 12084 LE | 195 I/O | 1.2 V | 0 C | + 85 C | SMD/SMT | 有 | 0°C ~ 85°C (TJ) | Tray | M2GL010T | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 195 | 不合格 | 1.2 V | 1.2 V | OTHER | 114 kB | 195 | 1.51 mm | 现场可编程门阵列 | 12084 | 933888 | 4 Transceiver | 12084 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||
![]() | M2GL010-1VF256 | Microchip Technology | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFPBGA-256 | 256-FPBGA (14x14) | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 12084 LE | 138 I/O | 1.2 V | 0 C | + 85 C | SMD/SMT | 有 | 119 | IGLOO2 | Tray | M2GL010 | 活跃 | 1.2 V | 0°C ~ 85°C (TJ) | Tray | M2GL010 | 1.14V ~ 2.625V | 1.2 V | 12084 | 933888 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050TS-FG484I | Microchip Technology | 数据表 | 2820 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 有 | 60 | IGLOO2 | 267 | Tray | M2GL050 | 活跃 | -40°C ~ 100°C (TJ) | Tray | M2GL050TS | 1.14V ~ 2.625V | 56340 | 1869824 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150T-FCV484 | Microchip Technology | 数据表 | 2816 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | 微芯片技术 | 20 | 1.14 V | 85 °C | 无 | M2GL150T-FCV484 | FBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | N | 有 | 84 | IGLOO2 | 248 | Tray | M2GL150 | 活跃 | FBGA, | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 0°C ~ 85°C (TJ) | Tray | M2GL150T | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B484 | OTHER | 3.15 mm | 现场可编程门阵列 | 146124 | 5120000 | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060T-1VF400I | Microchip Technology | 数据表 | 2502 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | 90 | IGLOO2 | 1.2 V | Tray | M2GL060 | 活跃 | LFBGA, | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 20 | 无 | M2GL060T-1VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.7 | This product may require additional documentation to export from the United States. | N | 56520 LE | 207 I/O | 1.2 V | - 40 C | + 100 C | SMD/SMT | 有 | -40°C ~ 100°C (TJ) | Tray | M2GL060T | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 1.2 V | 1.51 mm | 现场可编程门阵列 | 56520 | 1869824 | 4 Transceiver | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010T-1FG484 | Microchip Technology | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | SMD/SMT | 微芯片技术 | 有 | 60 | IGLOO2 | 1.2 V | Tray | M2GL010 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 85 °C | 无 | M2GL010T-1FG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | N | 12084 LE | 233 I/O | 1.2 V | 0 C | + 85 C | 0°C ~ 85°C (TJ) | Tray | M2GL010T | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 1.2 V | OTHER | 114 kB | 233 | 2.44 mm | 现场可编程门阵列 | 12084 | 933888 | 4 Transceiver | 12084 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||
![]() | M2GL060TS-FGG676I | Microchip Technology | 数据表 | 2216 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-676 | 676-FBGA (27x27) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 56520 LE | 387 I/O | 1.2 V | - 40 C | + 100 C | SMD/SMT | 有 | 40 | IGLOO2 | 1.2 V | Tray | M2GL060 | 活跃 | -40°C ~ 100°C (TJ) | Tray | M2GL060TS | 1.14V ~ 2.625V | 1.2 V | 56520 | 1869824 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005-VFG400 | Microchip Technology | 数据表 | 108 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | VFBGA-400 | YES | 400 | 400-VFBGA (17x17) | 400 | 微芯片技术 | Details | 1.26 V | Tray | M2GL005 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 85 °C | 有 | M2GL005-VFG400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | IGLOO2 | 90 | 有 | SMD/SMT | + 85 C | 0 C | 1.14 V | 171 I/O | 6060 LE | 0°C ~ 85°C (TJ) | Tray | M2GL005 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | not_compliant | S-PBGA-B400 | 171 | 不合格 | 1.2 V | 1.2 V | OTHER | 128 kB | 87.9 kB | 667 Mb/s | 171 | 1.51 mm | 现场可编程门阵列 | 6060 | 719872 | 400 MHz | 11 | STD | 6060 | 17 mm | 17 mm | |||||||||||||||||||||||||||
![]() | M2GL150T-1FCG1152 | Microchip Technology | 数据表 | 2374 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 微芯片技术 | 网格排列 | 4 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 30 | 1.14 V | 85 °C | 有 | M2GL150T-1FCG1152 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | This product may require additional documentation to export from the United States. | Details | 有 | 24 | IGLOO2 | 574 | Tray | M2GL150 | 活跃 | BGA, BGA1152,34X34,40 | 0°C ~ 85°C (TJ) | Tray | M2GL150T | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 574 | 2.9 mm | 现场可编程门阵列 | 146124 | 5120000 | 1 | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060T-FGG676I | Microchip Technology | 数据表 | 2082 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-676 | 676-FBGA (27x27) | 微芯片技术 | IGLOO2 | 40 | 有 | SMD/SMT | + 100 C | - 40 C | 1.2 V | 387 I/O | 56520 LE | Details | This product may require additional documentation to export from the United States. | 1.2 V | Tray | M2GL060 | 活跃 | -40°C ~ 100°C (TJ) | Tray | M2GL060T | 1.14V ~ 2.625V | 1.2 V | 667 Mb/s | 56520 | 1869824 | 4 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090T-1FG676 | Microchip Technology | 数据表 | 2472 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | SMD/SMT | 微芯片技术 | 有 | 40 | IGLOO2 | 1.2 V | Tray | M2GL090 | 活跃 | 27 X 27 MM, 1 MM PITCH, FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 20 | 85 °C | 无 | M2GL090T-1FG676 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | This product may require additional documentation to export from the United States. | N | 86184 LE | 425 I/O | 1.2 V | 0 C | + 85 C | 0°C ~ 85°C (TJ) | Tray | M2GL090T | 85 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | 1.2 V | OTHER | 323.3 kB | 425 | 2.44 mm | 现场可编程门阵列 | 86316 | 2648064 | 4 Transceiver | 86316 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||
![]() | M2GL150-FCVG484I | Microchip Technology | 数据表 | 2386 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCBGA-484 | YES | 484-BGA | 484 | 微芯片技术 | IGLOO2 | 1.26 V | Tray | M2GL150 | 活跃 | 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-484 | GRID ARRAY, FINE PITCH | 4 | PLASTIC/EPOXY | 1.2 V | 30 | 有 | M2GL150-FCVG484I | FBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | Details | 146124 LE | 248 I/O | 1.14 V | - 40 C | + 100 C | SMD/SMT | 有 | 84 | -40°C ~ 100°C (TJ) | Tray | M2GL150 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B484 | 1.2 V | 667 Mb/s | 3.15 mm | 现场可编程门阵列 | 146124 | 5120000 | 4 Transceiver | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010T-1FG484M | Microchip Technology | 数据表 | 2508 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | 1.14 V | - 55 C | + 125 C | SMD/SMT | 微芯片技术 | 有 | 60 | IGLOO2 | 0.761080 oz | 1.26 V | Tray | M2GL010 | 活跃 | 23 X 23 MM, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.2 V | 20 | 125 °C | 无 | M2GL010T-1FG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | This product may require additional documentation to export from the United States. | N | 12084 LE | 233 I/O | -55°C ~ 125°C (TJ) | Tray | M2GL010T | 3A001.A.2.C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 1.2 V | MILITARY | 667 Mb/s | 233 | 2.44 mm | 现场可编程门阵列 | 12084 | 933888 | 4 Transceiver | 12084 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||
![]() | M2GL060T-1FGG676I | Microchip Technology | 数据表 | 2316 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | 微芯片技术 | 40 | IGLOO2 | 1.2 V | Tray | M2GL060 | 活跃 | 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | 1.2 V | 有 | M2GL060T-1FGG676I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | This product may require additional documentation to export from the United States. | Details | 56520 LE | 387 I/O | 1.2 V | - 40 C | + 100 C | SMD/SMT | 有 | -40°C ~ 100°C (TJ) | Tray | M2GL060T | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B676 | 1.2 V | 2.44 mm | 现场可编程门阵列 | 56520 | 1869824 | 4 Transceiver | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010T-VFG400 | Microchip Technology | 数据表 | 99 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | VFBGA-400 | YES | 400 | 400-VFBGA (17x17) | 400 | SMD/SMT | 微芯片技术 | 有 | 90 | IGLOO2 | 3 oz | 1.26 V | Tray | M2GL010 | 活跃 | 5.29 | MICROSEMI CORP | 活跃 | SQUARE | LFBGA | M2GL010T-VFG400 | 有 | 85 °C | 30 | 1.2 V | BGA400,20X20,32 | PLASTIC/EPOXY | 3 | GRID ARRAY, LOW PROFILE, FINE PITCH | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400 | This product may require additional documentation to export from the United States. | Details | 12084 LE | 195 I/O | 1.14 V | 0 C | + 85 C | 0°C ~ 85°C (TJ) | Tray | M2GL010T | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B400 | 195 | 不合格 | 1.2 V | 1.2 V | OTHER | 114 kB | 667 Mb/s | 195 | 1.51 mm | 现场可编程门阵列 | 12084 | 933888 | 4 Transceiver | 12084 | 17 mm | 17 mm | ||||||||||||||||||||||||||||
![]() | M2GL010T-1FG484I | Microchip Technology | 数据表 | 12 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | SMD/SMT | 微芯片技术 | 有 | 60 | IGLOO2 | Tray | M2GL010 | 活跃 | 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000 | 1.2 V | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 无 | M2GL010T-1FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | N | 12084 LE | 233 I/O | 1.2 V | - 40 C | + 100 C | -40°C ~ 100°C (TJ) | Tray | M2GL010T | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 1.2 V | 114 kB | 233 | 2.44 mm | 现场可编程门阵列 | 12084 | 933888 | 1 | 4 Transceiver | 12084 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||
![]() | M2GL025TS-FCSG325I | Microchip Technology | 数据表 | 2756 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | SMD/SMT | 微芯片技术 | 有 | 176 | IGLOO2 | 1.2 V | Tray | M2GL025 | 活跃 | BGA, BGA325,21X21,20 | 网格排列 | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 有 | M2GL025TS-FCSG325I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.2 | This product may require additional documentation to export from the United States. | Details | 27696 LE | 180 I/O | 1.2 V | - 40 C | + 100 C | -40°C ~ 100°C (TJ) | Tray | M2GL025TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 1.2 V | 180 | 现场可编程门阵列 | 27696 | 1130496 | 2 Transceiver | 27696 | ||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010-FG484I | Microchip Technology | 数据表 | 12 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | SMD/SMT | 微芯片技术 | 有 | 60 | IGLOO2 | Tray | M2GL010 | 活跃 | 1.2 V | 23 X 23 MM, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 无 | M2GL010-FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | This product may require additional documentation to export from the United States. | N | 12084 LE | 233 I/O | 1.2 V | - 40 C | + 100 C | -40°C ~ 100°C (TJ) | Tray | M2GL010 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 1.2 V | 233 | 2.44 mm | 现场可编程门阵列 | 12084 | 933888 | STD | 12084 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||
![]() | M2GL050TS-1FCSG325 | Microchip Technology | 数据表 | 2209 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 1.14 V | 85 °C | 有 | M2GL050TS-1FCSG325 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | Details | 有 | 176 | IGLOO2 | 200 | Tray | M2GL050 | 活跃 | 11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325 | 网格排列 | 0°C ~ 85°C (TJ) | Tray | M2GL050TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | compliant | 30 | S-PBGA-B325 | 200 | 不合格 | 1.2 V | OTHER | 200 | 现场可编程门阵列 | 56340 | 1869824 | 56340 |
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