对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

ECCN 代码

最高工作温度

最小工作温度

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

时间@峰值回流温度-最大值(s)

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

最大电源电压

最小电源电压

内存大小

内存大小

数据率

输入数量

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

阀门数量

最高频率

LABs数量/ CLBs数量

逻辑块数(LABs)

速度等级

收发器数量

寄存器数量

逻辑单元数

高度

长度

宽度

辐射硬化

M7A3P1000-1PQG208
M7A3P1000-1PQG208
Microchip Technology 数据表

2507 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

24

ProASIC3

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

0°C ~ 85°C (TJ)

Tray

M7A3P1000

70 °C

0 °C

1.425V ~ 1.575V

272 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

272 MHz

1

24576

3.4 mm

28 mm

28 mm

A54SX16A-TQG144A
A54SX16A-TQG144A
Microchip Technology 数据表

2007 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

Details

113 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

227 MHz

60

Actel

0.046530 oz

2.75 V

Tray

A54SX16

活跃

-40°C ~ 125°C (TA)

Tray

A54SX16A

2.25V ~ 5.25V

2.5 V

24000

1452

STD

1.4 mm

20 mm

20 mm

M7A3P1000-FGG484I
M7A3P1000-FGG484I
Microchip Technology 数据表

2247 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

0.014110 oz

ProASIC3

60

231 MHz

SMD/SMT

+ 85 C

- 40 C

1.425 V

300 I/O

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M7A3P1000

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.425V ~ 1.575V

231 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

231 MHz

STD

24576

1.73 mm

23 mm

23 mm

M2GL010-VFG400
M2GL010-VFG400
Microchip Technology 数据表

12 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

1.2 V

0 C

+ 85 C

SMD/SMT

微芯片技术

90

IGLOO2

0.236938 oz

Tray

M2GL010

活跃

1.2 V

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

M2GL010-VFG400

LFBGA

SQUARE

活跃

FPGA - Field Programmable Gate Array M2GL010-VFG400

MICROSEMI CORP

1.6

This product may require additional documentation to export from the United States.

Details

12084 LE

195 I/O

0°C ~ 85°C (TJ)

Tray

M2GL010

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

OTHER

195

1.51 mm

现场可编程门阵列

12084

933888

STD

12084

17 mm

17 mm

M2GL060TS-1FGG484M
M2GL060TS-1FGG484M
Microchip Technology 数据表

2704 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

M2GL-EVAL-KIT

200 MHz

60

1826 kbit

IGLOO2

1.2 V

Tray

M2GL060

活跃

-55°C ~ 125°C (TJ)

Tray

M2GL060TS

1.14V ~ 2.625V

1.2 V

5 Gb/s

56520

1869824

4 Transceiver

M2GL060T-1FGG484M
M2GL060T-1FGG484M
Microchip Technology 数据表

2671 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

-55°C ~ 125°C (TJ)

Tray

M2GL060T

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

M2GL010T-1VF400
M2GL010T-1VF400
Microchip Technology 数据表

49 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

M2GL010T-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

12084 LE

195 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

OTHER

114 kB

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm

M2GL010-1VF256
M2GL010-1VF256
Microchip Technology 数据表

49 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

N

12084 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

119

IGLOO2

Tray

M2GL010

活跃

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL010

1.14V ~ 2.625V

1.2 V

12084

933888

M2GL050TS-FG484I
M2GL050TS-FG484I
Microchip Technology 数据表

2820 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

60

IGLOO2

267

Tray

M2GL050

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

M2GL150T-FCV484
M2GL150T-FCV484
Microchip Technology 数据表

2816 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

20

1.14 V

85 °C

M2GL150T-FCV484

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

M2GL060T-1VF400I
M2GL060T-1VF400I
Microchip Technology 数据表

2502 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

M2GL060T-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.7

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.2 V

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

M2GL010T-1FG484
M2GL010T-1FG484
Microchip Technology 数据表

49 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

SMD/SMT

微芯片技术

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

M2GL010T-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

OTHER

114 kB

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

M2GL060TS-FGG676I
M2GL060TS-FGG676I
Microchip Technology 数据表

2216 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

M2GL005-VFG400
M2GL005-VFG400
Microchip Technology 数据表

108 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

Details

1.26 V

Tray

M2GL005

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

M2GL005-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.29

IGLOO2

90

SMD/SMT

+ 85 C

0 C

1.14 V

171 I/O

6060 LE

0°C ~ 85°C (TJ)

Tray

M2GL005

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

not_compliant

S-PBGA-B400

171

不合格

1.2 V

1.2 V

OTHER

128 kB

87.9 kB

667 Mb/s

171

1.51 mm

现场可编程门阵列

6060

719872

400 MHz

11

STD

6060

17 mm

17 mm

M2GL150T-1FCG1152
M2GL150T-1FCG1152
Microchip Technology 数据表

2374 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

85 °C

M2GL150T-1FCG1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

Details

24

IGLOO2

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

1

146124

35 mm

35 mm

M2GL060T-FGG676I
M2GL060T-FGG676I
Microchip Technology 数据表

2082 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA-676

676-FBGA (27x27)

微芯片技术

IGLOO2

40

SMD/SMT

+ 100 C

- 40 C

1.2 V

387 I/O

56520 LE

Details

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL060

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL060T

1.14V ~ 2.625V

1.2 V

667 Mb/s

56520

1869824

4 Transceiver

M2GL090T-1FG676
M2GL090T-1FG676
Microchip Technology 数据表

2472 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

SMD/SMT

微芯片技术

40

IGLOO2

1.2 V

Tray

M2GL090

活跃

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

85 °C

M2GL090T-1FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL090T

85 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

OTHER

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

4 Transceiver

86316

27 mm

27 mm

M2GL150-FCVG484I
M2GL150-FCVG484I
Microchip Technology 数据表

2386 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FCBGA-484

YES

484-BGA

484

微芯片技术

IGLOO2

1.26 V

Tray

M2GL150

活跃

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-484

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

30

M2GL150-FCVG484I

FBGA

SQUARE

活跃

MICROSEMI CORP

5.27

Details

146124 LE

248 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

84

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B484

1.2 V

667 Mb/s

3.15 mm

现场可编程门阵列

146124

5120000

4 Transceiver

19 mm

19 mm

M2GL010T-1FG484M
M2GL010T-1FG484M
Microchip Technology 数据表

2508 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

1.14 V

- 55 C

+ 125 C

SMD/SMT

微芯片技术

60

IGLOO2

0.761080 oz

1.26 V

Tray

M2GL010

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

20

125 °C

M2GL010T-1FG484M

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

-55°C ~ 125°C (TJ)

Tray

M2GL010T

3A001.A.2.C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

MILITARY

667 Mb/s

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

M2GL060T-1FGG676I
M2GL060T-1FGG676I
Microchip Technology 数据表

2316 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

微芯片技术

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-676

网格排列

3

PLASTIC/EPOXY

1.2 V

M2GL060T-1FGG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B676

1.2 V

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

M2GL010T-VFG400
M2GL010T-VFG400
Microchip Technology 数据表

99 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

SMD/SMT

微芯片技术

90

IGLOO2

3 oz

1.26 V

Tray

M2GL010

活跃

5.29

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2GL010T-VFG400

85 °C

30

1.2 V

BGA400,20X20,32

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE, FINE PITCH

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

This product may require additional documentation to export from the United States.

Details

12084 LE

195 I/O

1.14 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

OTHER

114 kB

667 Mb/s

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm

M2GL010T-1FG484I
M2GL010T-1FG484I
Microchip Technology 数据表

12 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

SMD/SMT

微芯片技术

60

IGLOO2

Tray

M2GL010

活跃

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

1.2 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

M2GL010T-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL010T

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

114 kB

233

2.44 mm

现场可编程门阵列

12084

933888

1

4 Transceiver

12084

23 mm

23 mm

M2GL025TS-FCSG325I
M2GL025TS-FCSG325I
Microchip Technology 数据表

2756 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

SMD/SMT

微芯片技术

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

M2GL025TS-FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

This product may require additional documentation to export from the United States.

Details

27696 LE

180 I/O

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

27696

1130496

2 Transceiver

27696

M2GL010-FG484I
M2GL010-FG484I
Microchip Technology 数据表

12 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

SMD/SMT

微芯片技术

60

IGLOO2

Tray

M2GL010

活跃

1.2 V

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

M2GL010-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

233

2.44 mm

现场可编程门阵列

12084

933888

STD

12084

23 mm

23 mm

M2GL050TS-1FCSG325
M2GL050TS-1FCSG325
Microchip Technology 数据表

2209 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

85 °C

M2GL050TS-1FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

176

IGLOO2

200

Tray

M2GL050

活跃

11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325

网格排列

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340