N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

341 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

微芯片技术

60

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGLE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

40

85 °C

有

AGLE3000V2-FGG484I

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

AGLE3000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.2/1.5 V

INDUSTRIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PE3000-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

-40 to 85 °C

Tray

A3PE3000

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

SMD/SMT

175 MHz

有

90

微芯片技术

Actel

5.25 V

Tray

A40MX02

活跃

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-2VQG80

101 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

COMMERCIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

+ 85 C

SMD/SMT

870 MHz

有

微芯片技术

60

Actel

0.014110 oz

Tray

AX1000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

40

85 °C

有

AX1000-2FGG484I

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

317 I/O

1.425 V

- 40 C

-40°C ~ 85°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

870 MHz

S-PBGA-B484

516

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

+ 70 C

SMD/SMT

83 MHz

有

27

微芯片技术

Actel

0.084185 oz

5.25 V

Tray

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-FPLG44

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

1.36

Details

34 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

3.7 ns

295

3000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

- 40 C

+ 85 C

SMD/SMT

175 MHz

有

19

微芯片技术

Actel

0.171777 oz

5.5 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, LCC-68

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX02-2PLG68I

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

-40°C ~ 85°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

3 V

- 55 C

+ 125 C

SMD/SMT

215 MHz

有

微芯片技术

40

Actel

5.5 V

Tray

A42MX09

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX09-TQG176M

117 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

104 I/O

-55°C ~ 125°C (TC)

Tray

A42MX09

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

MILITARY

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

14000

2.5 ns

684

14000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

3 V

- 55 C

+ 125 C

SMD/SMT

247 MHz

有

微芯片技术

40

Actel

5.5 V

Tray

A42MX09

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX09-1TQG176M

135 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

104 I/O

-55°C ~ 125°C (TC)

Tray

A42MX09

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

MILITARY

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

14000

2.1 ns

684

14000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

VQFP-100

100-VQFP (14x14)

微芯片技术

1.575 V

Tray

A3P250

活跃

This product may require additional documentation to export from the United States.

N

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

1.5000 V

1.425 V

1.575 V

0 to 70 °C

Tray

A3P250

1.5 V

36864

250000

1

1 mm

14 mm

14 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

Details

1500 LE

133 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

526.32 MHz, 892.86 MHz

有

微芯片技术

348

IGLOOe

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL125

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

100 °C

有

AGL125V2-CSG196I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

AGL125V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

0.7 mm

8 mm

8 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P1000-2FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

M1A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

5.25 V

Tray

A42MX24

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX24-3PQG160

QFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

125 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

24

Actel

0.196363 oz

0°C ~ 70°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

COMMERCIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

5.25 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

- 40 C

+ 85 C

SMD/SMT

175 MHz

有

16

微芯片技术

Actel

0.239083 oz

Tray

A40MX04

活跃

5.5 V

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

5.3

MICROSEMI CORP

活跃

SQUARE

QCCJ

101 MHz

A40MX04-2PLG84I

有

85 °C

40

3.3 V

-40 °C

PLASTIC/EPOXY

Details

69 I/O

3 V

-40°C ~ 85°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

171 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

217 MHz

有

24

Actel

Tray

A54SX72

活跃

2.75 V

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A54SX72A

125 °C

-55 °C

2.5 V

217 MHz

1.5 ns

1.5 ns

6036

108000

217 MHz

6036

6036

4024

2.75 V

2.25 V

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

N

203 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

217 MHz

有

90

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

0°C ~ 70°C (TA)

Tray

A54SX72A

2.5 V

108000

6036

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

11000 LE

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

5.23

MICROSEMI CORP

活跃

SQUARE

BGA

350 MHz

A3P1000-2FGG256

有

85 °C

40

1.5 V

PLASTIC/EPOXY

3

网格排列

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

101 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

215 MHz

有

微芯片技术

24

Actel

0.196363 oz

Tray

A42MX09

活跃

5.5 V

3.3 V

MICROSEMI CORP

5.29

-55 °C

PLASTIC/EPOXY

3

FLATPACK

ROHS COMPLIANT, PLASTIC, QFP-160

活跃

SQUARE

QFP

117 MHz

A42MX09-PQG160M

有

125 °C

40

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A42MX09

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

MILITARY

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

2.5 ns

684

14000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

通孔

通孔

CCGA-624

624

624-CCGA (32.5x32.5)

微芯片技术

150 MHz

有

1

Actel

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

N

440 I/O

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TC)

APA600

125 °C

-55 °C

2.5 V

15.8 kB

5 mA

129024

600000

150 MHz

21504

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

微芯片技术

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3PE1500

活跃

FLASH

1.575 V

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

40

70 °C

有

A3PE1500-FGG676

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

0 to 70 °C

Tray

A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

350 MHz

S-PBGA-B676

444

不合格

1.5/3.3 V

COMMERCIAL

128 B

33.8 kB

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

231 MHz

STD

38400

38400

85 °C

38400

1.575 V

1.425 V

70 °C

1500000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

This product may require additional documentation to export from the United States.

Details

113 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

238 MHz

有

60

Actel

0.046530 oz

Tray

A54SX32

活跃

2.75 V

-55°C ~ 125°C (TC)

Tray

A54SX32A

2.5 V

48000

2880

1.4 mm

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

有

微芯片技术

27

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE3000-2FG896

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

0°C ~ 85°C (TJ)

Tray

A3PE3000

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

不合格

COMMERCIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

158 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

24

Actel

2.625 V

Tray

APA750

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 125°C (TJ)

Tray

APA750

125 °C

-40 °C

2.5 V

18 kB

147456

750000

180 MHz

STD

32768

2.625 V

2.375 V

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

77 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

90

微芯片技术

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P030

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P030-VQ100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.5

N

-40 to 85 °C

Tray

A3P030

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

STD

768

30000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

+ 70 C

SMD/SMT

175 MHz

有

16

微芯片技术

Actel

0.239083 oz

Tray

A40MX04

活跃

5.25 V

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-2PLG84

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

69 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

0°C ~ 85°C (TJ)

Tray

M1A3P1000

1.5 V

147456

1000000

1