N/A

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

This product may require additional documentation to export from the United States.

N

444 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE1500-2FG676I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE1500

e0

锡铅

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

444

不合格

1.5/3.3 V

INDUSTRIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

1.73 mm

27 mm

27 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

341 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

M1A3PE3000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

40

85 °C

有

M1A3PE3000L-FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5/3.3 V

INDUSTRIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3PE1500

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

M1A3PE1500-FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE1500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

280

不合格

1.5/3.3 V

COMMERCIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

Fusion

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS1500-2FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.29

N

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

90

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

33.8 kB

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

1.575 V

1.425 V

1500000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE1500-1FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE1500

e0

锡铅

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

280

不合格

1.5/3.3 V

INDUSTRIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

SMD/SMT

1282.05 MHz

有

微芯片技术

60

Fusion

0.014110 oz

Tray

M1AFS1500

活跃

1.575 V

FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS1500-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

223 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

896

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

Details

620 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

40

85 °C

有

M1A3PE3000-FGG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

620

不合格

1.5/3.3 V

INDUSTRIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

256

177 I/O

- 40 C

+ 85 C

SMD/SMT

250 MHz

微芯片技术

有

90

IGLOOe

1.2, 1.5 V

1.2 V

1.5 V

Tray

M1AGL1000

活跃

5.3

1.575 V

MICROSEMI CORP

活跃

SQUARE

BGA

108 MHz

M1AGL1000V2-FGG256I

有

100 °C

1.14 V

40

1.2 V

-40 °C

PLASTIC/EPOXY

3

网格排列

BGA,

This product may require additional documentation to export from the United States.

Details

11000 LE

-40 to 85 °C

Tray

M1AGL1000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

18 kB

127 uA

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

STD

24576

1000000

17 mm

17 mm

无铅

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

+ 70 C

SMD/SMT

1470.59 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS250-2FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

114 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

M1AFS250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

2

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

24

ProASIC3

Tray

M1A3PE1500

活跃

1.575 V

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

40

85 °C

有

M1A3PE1500-2PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.59

This product may require additional documentation to export from the United States.

Details

147 I/O

-40°C ~ 100°C (TJ)

Tray

M1A3PE1500

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS1500-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

223 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0°C ~ 85°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

OTHER

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

40

70 °C

有

A3PN125-1VQG100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

71 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

-20°C ~ 85°C (TJ)

Tray

A3PN125

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

1

3072

125000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.26 V

8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/85

Tray

A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

30

85 °C

无

A3PE3000L-1FG484I

250 MHz

BGA

SQUARE

活跃

FPGA ProASICu00ae3EL Family 3M Gates 892.86MHz 130nm Technology 1.2V 484-Pin FBGA Tray

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

341 I/O

1.14 V

-40°C ~ 100°C (TJ)

Tray

A3PE3000L

e0

锡铅

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.2/1.5,1.2/3.3 V

INDUSTRIAL

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

892.86 MHz

1

75264

75264

75264

1.26 V

1.14 V

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

N

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.2000 V

1.26 V

Tray

M1A3P1000

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

30

85 °C

无

M1A3P1000L-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

M1A3P1000L

e0

锡铅银

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

INDUSTRIAL

8 mA

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

A3PN125-1VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

-20°C ~ 85°C (TJ)

Tray

A3PN125

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

1

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

SMD/SMT

1098.9 MHz

有

微芯片技术

0.014110 oz

Fusion

60

Tray

M1AFS1500

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS1500-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

223 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

INDUSTRIAL

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

Tray

M1A3PE3000

活跃

1.575 V

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

M1A3PE3000-FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

0°C ~ 85°C (TJ)

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

N

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

M1A3P1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

30

85 °C

无

M1A3P1000L-FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

M1A3P1000L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

INDUSTRIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

1.14 V

- 55 C

+ 125 C

SMD/SMT

有

微芯片技术

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

40

125 °C

有

M1A3PE3000L-FGG484M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

-55°C ~ 125°C (TJ)

Tray

M1A3PE3000L

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.2/1.5,1.2/3.3 V

MILITARY

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

N

235 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P600-2FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

M1A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.2 V

20

100 °C

无

M1AGL600V2-CS281I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

1.2 V

有

184

IGLOOe

215

1.5 V

Tray

M1AGL600

活跃

TFBGA,

-40°C ~ 85°C (TA)

Tray

M1AGL600V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

13824

600000

10 mm

10 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

235 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

M1A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

40

85 °C

有

M1A3P600L-1FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

-40 to 85 °C

Tray

M1A3P600L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

235

不合格

1.5/3.3 V

INDUSTRIAL

5 mA

235

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

350 MHz

有

微芯片技术

90

ProASIC3 nano

Tray

A3PN060

活跃

1.575 V

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

40

70 °C

有

A3PN060-1VQG100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

71 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

-20°C ~ 85°C (TJ)

Tray

A3PN060

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

2 mA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

1

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

160

0.014110 oz

ProASIC3

1.26 V

Tray

M1A3P1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

M1A3P1000L-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

97 I/O

0°C ~ 85°C (TJ)

Tray

M1A3P1000L

e0

锡铅银

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

COMMERCIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

0.014110 oz

有

350 MHz

SMD/SMT

+ 125 C

- 55 C

微芯片技术

1.14 V

341 I/O

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

125 °C

无

M1A3PE3000L-FG484M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

60

ProASIC3

-55°C ~ 125°C (TJ)

Tray

M1A3PE3000L

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.2/1.5,1.2/3.3 V

MILITARY

25 mA

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

23 mm

23 mm