N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

0 C

+ 85 C

SMD/SMT

微芯片技术

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060T-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.2 V

OTHER

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

+ 100 C

SMD/SMT

微芯片技术

有

60

IGLOO2

Tray

M2GL060

活跃

1.2 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060TS-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

1.2 V

2.44 mm

现场可编程门阵列

56520

1869824

STD

4 Transceiver

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

+ 100 C

SMD/SMT

微芯片技术

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL090-1FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

180 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

86316

N/A

-

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

30

1.14 V

有

M2GL150-1FCVG484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

1

19 mm

19 mm

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

有

微芯片技术

60

IGLOO2

1.26 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060T-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

56520 LE

267 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

1.2 V

667 Mb/s

2.44 mm

现场可编程门阵列

56520

1869824

STD

4 Transceiver

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

Details

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL090

活跃

, BGA325,21X21,20

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090TS-1FCSG325

活跃

MICROSEMI CORP

5.3

IGLOO2

176

有

SMD/SMT

+ 85 C

0 C

1.2 V

180 I/O

86184 LE

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

compliant

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

4 Transceiver

86316

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

SMD/SMT

微芯片技术

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL060TS-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.2 V

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

0 C

+ 85 C

SMD/SMT

微芯片技术

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL025-1VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL025

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

27696

1130496

14 mm

14 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

微芯片技术

有

60

IGLOO2

Tray

M2GL025

活跃

1.2 V

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

125 °C

有

M2GL025TS-1FGG484M

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

27696 LE

-55°C ~ 125°C (TJ)

Tray

M2GL025TS

3A001.A.2.C

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

MILITARY

267

2.44 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

IGLOO2

1.2 V

Tray

M2GL090

活跃

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090TS-FCSG325

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

compliant

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

4 Transceiver

86316

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

138 I/O

微芯片技术

12084 LE

N

IGLOO2

1.2 V

Tray

M2GL010

活跃

5.27

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2GL010TS-VF256I

无

20

1.2 V

PLASTIC/EPOXY

GRID ARRAY, LOW PROFILE, FINE PITCH

LFBGA,

This product may require additional documentation to export from the United States.

119

有

SMD/SMT

+ 100 C

- 40 C

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

IGLOO2

60

有

N

This product may require additional documentation to export from the United States.

267

Tray

M2GL050

活跃

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

1.14V ~ 2.625V

228.3 kB

56340

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

0 C

+ 85 C

SMD/SMT

微芯片技术

有

90

IGLOO2

1.2 V

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

Tray

M2GL050

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL050-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.59

This product may require additional documentation to export from the United States.

Details

56340 LE

207 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

1.2 V

OTHER

256 kB

228.3 kB

667 Mb/s

207

1.51 mm

现场可编程门阵列

56340

1869824

400 MHz

72

STD

4 Transceiver

56340

17 mm

17 mm

N/A

-

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

1.14 V

85 °C

有

M2GL150-1FCVG484

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

0°C ~ 85°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

N/A

-

表面贴装

FBGA-256

256-FBGA (17x17)

微芯片技术

1.5 V

Tray

A3P1000

活跃

This product may require additional documentation to export from the United States.

11000 LE

177 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

144 kbit

350 MHz

-

90

1 kbit

ProASIC3

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.14V ~ 1.575V

1.5 V

8 mA

700 Mb/s

147456

1000000

N/A

-

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

MICROSEMI CORP

活跃

SQUARE

FBGA

M2GL150T-FCV484I

无

1.14 V

20

1.2 V

PLASTIC/EPOXY

GRID ARRAY, FINE PITCH

FBGA,

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

248

Tray

M2GL150

活跃

1.26 V

1.71

-40°C ~ 100°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

+ 100 C

SMD/SMT

微芯片技术

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL025T-1VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL025T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

1.56 mm

现场可编程门阵列

27696

1130496

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

BGA400,20X20,32

1.2 V

20

1.14 V

无

M2GL050T-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

207

Tray

M2GL050

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

Tray

M2GL050T

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

56340

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

微芯片技术

A3P250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

1.5 V

1.425 V

125 °C

有

A3P250-VQG100M

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.18

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

90

ProASIC3

8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000

68

Tray

-55°C ~ 125°C (TJ)

Tray

A3P250

125 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G100

MILITARY

4.5 kB

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

6144

250000

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

SMD/SMT

微芯片技术

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

有

M2GL025-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.56

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL025

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

267

2.44 mm

现场可编程门阵列

27696

1130496

1

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060

1.14V ~ 2.625V

1.2 V

56520

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

0°C ~ 85°C (TJ)

Tray

M2GL010

85 °C

0 °C

1.14V ~ 2.625V

1.2 V

114 kB

12084

933888

STD

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

56520 LE

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

M2GL060TS

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

N/A

-

TQFP-144

微芯片技术

This product may require additional documentation to export from the United States.

Details

12084 LE

84 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

60

IGLOO2

Tray

M2GL010

活跃

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL010S

1.14V ~ 2.625V

1.2 V

12084

933888

N/A

-

表面贴装

PGA-132

132-CPGA

微芯片技术

Tray

A42MX09

活跃

This product may require additional documentation to export from the United States.

95 I/O

4.5 V

SMD/SMT

250 MHz

21

5.5 V

-55°C ~ 125°C (TJ)

Tray

A42MX09

3V ~ 3.6V, 4.5V ~ 5.5V

3.3 V, 5 V

14000