N/A

-

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

M7A3P1000-2FGG144

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

97 I/O

0 to 70 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

310 MHz

S-PBGA-B144

不合格

COMMERCIAL

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

310 MHz

2

24576

24576

1.575 V

1.425 V

1000000

1.05 mm

13 mm

13 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

1282.05 MHz

SMD/SMT

+ 85 C

- 40 C

1.425 V

172 I/O

N

Tray

M7AFS600

活跃

1.575 V

0.014110 oz

Fusion

60

有

-40°C ~ 85°C (TA)

Tray

M7AFS600

85 °C

-40 °C

1.5 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.575 V

1.425 V

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

This product may require additional documentation to export from the United States.

Details

113 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

227 MHz

有

60

Actel

0.046530 oz

2.75 V

Tray

A54SX16

活跃

-55°C ~ 125°C (TC)

Tray

A54SX16A

2.5 V

24000

1452

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

N

172 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

-40°C ~ 85°C (TA)

Tray

M7AFS600

1.5 V

110592

600000

2

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

+ 70 C

SMD/SMT

198 MHz

有

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A42MX16

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-1PQG100

108 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.28

Details

83 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

3000 LE

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

微芯片技术

526.32 MHz, 892.86 MHz

有

160

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

AGL250V2-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

AGL250V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

OTHER

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

- 40 C

+ 85 C

SMD/SMT

160 MHz

有

微芯片技术

19

Actel

0.171777 oz

5.5 V

Tray

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX02-1PLG68I

92 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

57 I/O

3 V

-40°C ~ 85°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.3 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

1.575 V

Tray

A3P600

活跃

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

0 to 70 °C

Tray

A3P600

1.5 V

110592

600000

1

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

90

有

247 MHz

SMD/SMT

微芯片技术

+ 85 C

- 40 C

5.5 V

Tray

A42MX09

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX09-1VQG100I

135 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

83 I/O

3 V

Actel

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

2.1 ns

684

14000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

- 40 C

+ 85 C

SMD/SMT

160 MHz

有

微芯片技术

66

Actel

0.062040 oz

Tray

A40MX04

活跃

5.5 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX04-1PQG100I

48 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.29

Details

69 I/O

3 V

-40°C ~ 85°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

2.3 ns

547

6000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P030

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P030-1VQG100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

77 I/O

0 to 70 °C

Tray

A3P030

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

1

768

30000

1 mm

14 mm

14 mm

N/A

-

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M7A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

M7A3P1000-FG144

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

97 I/O

0 to 70 °C

Tray

M7A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B144

不合格

COMMERCIAL

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1.575 V

1.425 V

1000000

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

Details

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

0°C ~ 70°C (TA)

Tray

M7AFS600

1.5 V

110592

600000

2

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.575 V

1.425 V

Tray

A3PE3000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PE3000-2FG896I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

A3PE3000

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

不合格

INDUSTRIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 85 C

SMD/SMT

296 MHz

有

微芯片技术

90

Actel

5.5 V

Tray

A42MX09

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX09-3VQG100I

161 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

83 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

1.6 ns

684

14000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

158 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

24

Actel

2.625 V

Tray

APA450

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 125°C (TJ)

Tray

APA450

125 °C

-40 °C

2.5 V

13.5 kB

110592

450000

180 MHz

STD

12288

2.625 V

2.375 V

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

310 MHz

有

微芯片技术

90

ProASIC3

1.575 V

Tray

A3P030

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P030-2VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

77 I/O

1.425 V

0 C

+ 70 C

0°C ~ 85°C (TJ)

Tray

A3P030

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

2

768

30000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

Details

115 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

763 MHz

有

24

Actel

1.575 V

Tray

AX500

活跃

-55°C ~ 125°C (TA)

Tray

AX500

1.5 V

73728

500000

8064

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

N

96 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P060

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

5.24

MICROSEMI CORP

活跃

SQUARE

LBGA

350 MHz

A3P060-2FG144I

无

100 °C

30

1.5 V

-40 °C

PLASTIC/EPOXY

3

-40 to 85 °C

Tray

A3P060

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

2

1536

60000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

83 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

247 MHz

微芯片技术

有

66

Actel

0.062040 oz

5.5 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX09-1PQG100M

135 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A42MX09

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

MILITARY

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

2.1 ns

684

14000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

表面贴装

FBGA

144

144-FPBGA (13x13)

400.011771 mg

微芯片技术

Tray

M7A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.5 V

310 MHz

18 kB

147456

1000000

310 MHz

2

24576

1.575 V

1.425 V

1.05 mm

13 mm

13 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE3000-2FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

0 C

0 to 70 °C

Tray

A3PE3000

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

This product may require additional documentation to export from the United States.

Details

6500 LE

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

272 MHz

有

-

24

110592 bit

ProASIC3

1.5000 V

1.575 V

Tray

A3P600

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P600-1PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

A3P600

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

45 mA

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

110592

600000

1

13824

600000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M7A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

M7A3P1000-FG484

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

300 I/O

0 to 70 °C

Tray

M7A3P1000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

COMMERCIAL

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

235 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P600-2FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.73 mm

23 mm

23 mm