N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P600-1FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

-40 to 85 °C

Tray

A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

+ 125 C

SMD/SMT

180 MHz

微芯片技术

有

-

160

Actel

0.014110 oz

2.625 V

Tray

APA075

活跃

BGA, BGA144,12X12,40

网格排列

3

PLASTIC/EPOXY

BGA144,12X12,40

有

APA075-FGG144A

BGA

SQUARE

活跃

MICROSEMI CORP

5.61

Details

-

100 I/O

2.375 V

- 40 C

-40°C ~ 125°C (TJ)

Tray

APA075

8542.39.00.01

CMOS

2.375V ~ 2.625V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B144

100

不合格

2.5 V

2.5,2.5/3.3 V

100

现场可编程门阵列

27648

75000

STD

3072

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

165 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

Tray

A3PE600

活跃

1.575 V

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.5 V

40

70 °C

有

A3PE600-FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

A3PE600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

165

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

165

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

11000 LE

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

231 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P1000-FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Actel

2.625 V

Tray

APA600

活跃

QFP, QFP208,1.2SQ,20

FLATPACK

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

有

APA600-PQG208A

QFP

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

Details

158 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

24

-40°C ~ 125°C (TJ)

Tray

APA600

125 °C

-40 °C

8542.39.00.01

CMOS

2.375V ~ 2.625V

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G208

158

不合格

2.5 V

2.5,2.5/3.3 V

2.625 V

2.375 V

15.8 kB

158

现场可编程门阵列

129024

600000

180 MHz

STD

21504

21504

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

101 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

247 MHz

微芯片技术

有

24

Actel

0.196363 oz

5.5 V

Tray

A42MX09

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX09-1PQG160M

135 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A42MX09

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

MILITARY

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

2.1 ns

684

14000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.425 V

1.575 V

1.575 V

Tray

A3PE1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

A3PE1500-2FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

280 I/O

1.425 V

0 C

+ 70 C

0°C ~ 85°C (TJ)

Tray

A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

310 MHz

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

A3P600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P600-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

97 I/O

0°C ~ 85°C (TJ)

Tray

A3P600

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

N

-

177 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P1000-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.47

0 to 70 °C

Tray

A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

Details

295 LE

57 I/O

3 V

0 C

+ 70 C

SMD/SMT

139 MHz

微芯片技术

有

295 LAB

19

Actel

0.171777 oz

3.3, 5 V

3 V

5.25 V

5.25 V

Tube

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-PLG68

80 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

1.54

0 to 70 °C

Tube

A40MX02

e3

Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

COMMERCIAL

-

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

STD

-

2.7 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P125

活跃

1.575 V

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P125-2FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

0 to 70 °C

Tray

A3P125

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

36864

125000

2

3072

125000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

ProASIC3

27

有

231 MHz

SMD/SMT

微芯片技术

+ 70 C

0 C

1.425 V

620 I/O

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

30

70 °C

无

A3PE3000-FG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

0.014110 oz

0 to 70 °C

Tray

A3PE3000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

231 MHz

STD

75264

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

176 I/O

Details

Tray

A42MX36

活跃

5.25 V

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX36-2PQG208

91 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Actel

24

有

164 MHz

SMD/SMT

+ 70 C

0 C

3 V

0°C ~ 70°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

164 MHz

1184

2

1822

2.1 ns

2438

54000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

71 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P060-2VQG100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

-40 to 85 °C

Tray

A3P060

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

2

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

Details

100 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

60

ProASIC3

0.046530 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P125-2TQG144I

350 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

不合格

1.5 V

INDUSTRIAL

3072 CLBS, 125000 GATES

1.6 mm

现场可编程门阵列

36864

125000

2

3072

125000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

Details

7000 LE

97 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

892.86 MHz

微芯片技术

有

160

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

AGL600

活跃

1.575 V

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

AGL600V5-FGG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.4

-40 to 85 °C

Tray

AGL600V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

-

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

-

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

3 V

- 55 C

+ 125 C

SMD/SMT

139 MHz

微芯片技术

有

90

Actel

5.5 V

Tray

A40MX04

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A40MX04-VQG80M

80 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

1.55

This product may require additional documentation to export from the United States.

Details

69 I/O

-55°C ~ 125°C (TC)

Tray

A40MX04

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

MILITARY

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2.7 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

SMD/SMT

160 MHz

有

微芯片技术

90

Actel

5.25 V

Tray

A40MX02

活跃

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-1VQG80

92 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

57 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2.3 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 1 month ago)

Lead, Silver, Tin

表面贴装

表面贴装

FBGA-256

YES

256

256-FPBGA (17x17)

400.011771 mg

256

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P600-FG256I

350 MHz

BGA

SQUARE

活跃

FPGA - Field Programmable Gate Array ProASIC3

MICROSEMI CORP

1.48

N

-

177 I/O

-40 to 85 °C

Tray

A3P600

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

231 MHz

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

231 MHz

STD

13824

13824

600000

1.2 mm

17 mm

17 mm

无

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

310 MHz

微芯片技术

有

40

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

A3PE1500

活跃

27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE1500-2FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0 to 70 °C

Tray

A3PE1500

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

310 MHz

2

38400

38400

1500000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

+ 70 C

SMD/SMT

188 MHz

有

微芯片技术

27

Actel

0.084185 oz

5.25 V

Tray

A40MX04

活跃

ROHS COMPLIANT, PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-3PLG44

109 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

34 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

3.3 V, 5 V

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

1.7 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P1000-FGG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P1000-1FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

+ 125 C

SMD/SMT

153 MHz

有

微芯片技术

24

Actel

Tray

A42MX16

活跃

5.25 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX16-PQG208A

139 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

140 I/O

4.75 V

- 40 C

-40°C ~ 125°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

5 V

AUTOMOTIVE

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

STD

2.2 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

- 40 C

+ 125 C

SMD/SMT

192 MHz

有

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A42MX09

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX09-PQG100A

174 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.6

Details

83 I/O

4.75 V

-40°C ~ 125°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

5 V

AUTOMOTIVE

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

STD

2 ns

684

14000

2.7 mm

20 mm

14 mm