N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

84

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3PE3000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE3000-1FG324

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

221 I/O

1.425 V

0 to 70 °C

Tray

A3PE3000

e0

锡铅银

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

不合格

COMMERCIAL

63 kB

25 mA

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

1.575 V

1.425 V

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

1.5000 V

1.425 V

1.575 V

Tray

M1AFS250

活跃

1.575 V

This product may require additional documentation to export from the United States.

Details

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

0 to 70 °C

Tray

M1AFS250

1.5 V

36864

250000

STD

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

114 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS250-1FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

M1AFS250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

892.86 MHz

微芯片技术

有

60

IGLOOe

0.014110 oz

Tray

M1AGLE3000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

20

70 °C

无

M1AGLE3000V5-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

M1AGLE3000V5

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

892.86 MHz

STD

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

1098.9 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS600-FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

1.0989 GHz

S-PBGA-B256

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.68 mm

现场可编程门阵列

110592

600000

1.0989 GHz

STD

13824

13824

1.575 V

1.425 V

600000

1.2 mm

17 mm

17 mm

无

无铅

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

24

ProASIC3

1.5000 V

Tray

M1A3P600

活跃

1.575 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P600-2PQG208I

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

-40 to 85 °C

Tray

M1A3P600

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

110592

600000

2

13824

600000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

微芯片技术

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS1500-FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

119 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

STD

1500000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

114 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS250-FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M1AFS250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

有

1282.05 MHz

SMD/SMT

+ 70 C

0 C

微芯片技术

1.425 V

172 I/O

Details

This product may require additional documentation to export from the United States.

Tray

M1AFS600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS600-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0.014110 oz

Fusion

60

0°C ~ 85°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

OTHER

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

N

This product may require additional documentation to export from the United States.

1.5000 V

1.575 V

Tray

M1A3P600

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P600-2FG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

97 I/O

-40 to 85 °C

Tray

M1A3P600

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

896

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

Details

620 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

Tray

M1A3PE3000

活跃

1.26 V

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

40

70 °C

有

M1A3PE3000L-FGG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

620

不合格

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

CSP-289

YES

289-CSP (14x14)

289

1500 LE

212 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

有

微芯片技术

119

IGLOO PLUS

0.260886 oz

1.575 V

Tray

AGLP125

Obsolete

TFBGA, BGA289,17X17,32

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA289,17X17,32

-40 °C

1.5 V

未说明

85 °C

有

AGLP125V5-CSG289I

250 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

-40°C ~ 100°C (TJ)

Tray

AGLP125V5

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B289

212

不合格

1.5 V

INDUSTRIAL

-

212

3120 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3120

36864

125000

STD

-

3120

3120

125000

0.81 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

60

Fusion

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS1500-2FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

223 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

0°C ~ 85°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

OTHER

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

0 C

+ 70 C

SMD/SMT

有

微芯片技术

160

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

Tray

M1AGL600

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

40

85 °C

有

M1AGL600V2-FGG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

97 I/O

1.14 V

0 to 70 °C

Tray

M1AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

1.575 V

1.14 V

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

有

微芯片技术

160

IGLOOe

0.014110 oz

1.575 V

Tray

M1AGL600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AGL600V5-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

M1AGL600V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

1.575 V

1.425 V

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

235 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

1.575 V

Tray

M7A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.5 V

310 MHz

18 kB

147456

1000000

310 MHz

2

24576

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP

YES

100

100-VQFP (14x14)

100

+ 70 C

SMD/SMT

微芯片技术

有

90

IGLOOe

1.575 V

Tray

M1AGL250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

M1AGL250V2-VQ100

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

3000 LE

68 I/O

1.14 V

0 C

0°C ~ 70°C (TA)

Tray

M1AGL250V2

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

4.5 kB

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

1.575 V

1.14 V

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 85 C

SMD/SMT

272 MHz

有

微芯片技术

90

ProASIC3

1.575 V

Tray

M1A3P250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P250-1VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

68 I/O

1.425 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M1A3P250

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP

YES

100

100-VQFP (14x14)

100

3000 LE

68 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

有

90

IGLOOe

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1AGL250

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1AGL250V5-VQG100I

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

-40 to 85 °C

Tray

M1AGL250V5

e3

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

4.5 kB

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

1.575 V

1.425 V

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3P250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P250-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P250-FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

235 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-1FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

M1A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

30

85 °C

无

M1A3P1000L-1FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

M1A3P1000L

e0

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

8 mA

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

Tray

A3P600

活跃

1.26 V

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

A3P600L-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

A3P600L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

COMMERCIAL

5 mA

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.05 mm

13 mm

13 mm