N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

188 MHz

有

微芯片技术

90

Actel

Tray

A40MX04

活跃

5.25 V

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-3VQG80

109 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

69 I/O

3 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

COMMERCIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

1.7 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

153 MHz

有

16

微芯片技术

Actel

0.239083 oz

5.25 V

72

Tray

A42MX16

活跃

PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX16-PLG84A

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.53

Details

4.75 V

- 40 C

+ 125 C

SMD/SMT

-40°C ~ 125°C (TA)

Tube

A42MX16

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

5 V

AUTOMOTIVE

24000 GATES

4.57 mm

现场可编程门阵列

24000

STD

2.4 ns

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

676

676-FBGA (27x27)

400.011771 mg

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE1500

0 to 70 °C

Tray

A3PE1500

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

310 MHz

2

38400

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

N

235 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

活跃

1.5000 V

1.425 V

1.575 V

0.014110 oz

ProASIC3

90

有

272 MHz

SMD/SMT

+ 70 C

0 C

1.425 V

178 I/O

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

A3P400

0 to 70 °C

Tray

A3P400

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

6.8 kB

55296

400000

272 MHz

1

9216

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

Tray

A3PE600

活跃

1.575 V

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE600-1FG256

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

BGA,

This product may require additional documentation to export from the United States.

N

165 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

0 to 70 °C

Tray

A3PE600

e0

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

600000

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

5.25 V

Tray

A42MX24

活跃

50.4 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.26

A42MX24-FPQG160

有

70 °C

40

3.3 V

PLASTIC/EPOXY

3

FLATPACK

ROHS COMPLIANT, PLASTIC, QFP-160

Details

125 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

24

Actel

0.196363 oz

0°C ~ 70°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

1410

3.4 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

+ 85 C

SMD/SMT

188 MHz

有

微芯片技术

19

Actel

0.171777 oz

Tray

A40MX04

活跃

5.5 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX04-3PLG68I

109 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

57 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

1.7 ns

547

6000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

90

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

AGL600V5-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

AGL600V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

OTHER

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

有

160 MHz

SMD/SMT

+ 70 C

微芯片技术

0 C

3 V

57 I/O

Details

5.25 V

Tray

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-1PLG68

92 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

0.171777 oz

Actel

19

295 LAB

0°C ~ 70°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.3 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

+ 70 C

SMD/SMT

278 MHz

有

微芯片技术

60

Actel

0.046530 oz

2.75 V

Tray

A54SX08

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

70 °C

有

A54SX08A-1TQG144

278 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

113 I/O

2.25 V

0 C

0°C ~ 70°C (TA)

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

113

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

1.1 ns

768

768

12000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS250-2FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

114 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

M1AFS250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

2

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

3000 LE

143 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

250 MHz

有

348

IGLOOe

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL250

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.5 V

未说明

85 °C

无

AGL250V5-CS196

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

0 to 70 °C

Tray

AGL250V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B196

不合格

1.5 V

OTHER

20 uA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

0.7 mm

8 mm

8 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

微芯片技术

有

60

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

AX250-1FG484

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

248 I/O

0°C ~ 70°C (TA)

Tray

AX250

e0

锡铅

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

248

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

248

2816 CLBS, 250000 GATES

2.44 mm

现场可编程门阵列

55296

250000

4224

0.84 ns

2816

4224

250000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

AFS250-2FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

3000 LE

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

AFS250

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

OTHER

1.575 V

1.425 V

4.5 kB

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1.47059 GHz

2

6144

6144

250000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

11000 LE

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

微芯片技术

892.86 MHz

有

90

ProASIC3

0.014110 oz

Tray

A3P1000

活跃

1.26 V

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

30

70 °C

无

A3P1000L-1FG256

350 MHz

BGA

SQUARE

活跃

5.24

MICROSEMI CORP

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

A3P1000L

e0

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

SMD/SMT

188 MHz

有

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A40MX04

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-3PQG100

109 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

Details

69 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

1.7 ns

547

6000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

165 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE600

活跃

0°C ~ 85°C (TJ)

Tray

A3PE600

1.425V ~ 1.575V

1.5 V

110592

600000

2

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

SMD/SMT

微芯片技术

有

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060T-1FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

200 I/O

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

1.2 V

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

387 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

Tray

M2GL060

活跃

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL060

1.14V ~ 2.625V

1.2 V

56520

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

+ 85 C

- 40 C

微芯片技术

1.425 V

317 I/O

N

This product may require additional documentation to export from the United States.

1.575 V

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

AX1000-FG484I

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

0.014110 oz

Actel

60

有

649 MHz

-40°C ~ 85°C (TA)

Tray

AX1000

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

649 MHz

S-PBGA-B484

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

12096

STD

12096

0.99 ns

12096

18144

1000000

1.73 mm

23 mm

23 mm

无

含铅

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

M1A3P400

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1A3P400-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

90

ProASIC3

178

Tray

0°C ~ 85°C (TJ)

Tray

M1A3P400

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

Details

115 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

649 MHz

有

24

Actel

1.575 V

Tray

AX500

活跃

-55°C ~ 125°C (TA)

Tray

AX500

1.425V ~ 1.575V

1.5 V

73728

500000

8064

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

11000 LE

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

892.86 MHz

有

60

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

AGL1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

5.26

MICROSEMI CORP

活跃

SQUARE

BGA

108 MHz

AGL1000V5-FG484

无

85 °C

30

1.5 V

0 to 70 °C

Tray

AGL1000V5

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B484

不合格

1.5 V

OTHER

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

Details

11000 LE

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

微芯片技术

892.86 MHz

有

160

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3P1000

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

40

70 °C

有

A3P1000L-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.05 mm

13 mm

13 mm