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品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 内存大小 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | LABs数量/ CLBs数量 | 速度等级 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 长度 | 宽度 | ||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M2GL050-1VF400 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | This product may require additional documentation to export from the United States. | 微芯片技术 | 207 | Tray | M2GL050 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 20 | 1.14 V | 85 °C | 无 | M2GL050-1VF400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | IGLOO2 | 90 | 有 | N | 0°C ~ 85°C (TJ) | Tray | M2GL050 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | OTHER | 228.3 kB | 207 | 1.51 mm | 现场可编程门阵列 | 56340 | 1869824 | 56340 | 17 mm | 17 mm | ||||||||||||||||||
| M2GL005S-1FG484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | N | 1.14 V | 有 | 60 | 微芯片技术 | IGLOO2 | 1.26 V | 209 | Tray | M2GL005 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 85 °C | 无 | M2GL005S-1FG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.28 | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | M2GL005S | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 209 | 不合格 | 1.2 V | OTHER | 209 | 2.44 mm | 现场可编程门阵列 | 6060 | 719872 | 6060 | 23 mm | 23 mm | |||||||||||||||||||||
| M2GL005S-VF256I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | 119 | 微芯片技术 | IGLOO2 | 1.26 V | 161 | Tray | M2GL005 | 活跃 | LFBGA, | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 20 | 无 | M2GL005S-VF256I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.28 | This product may require additional documentation to export from the United States. | N | 1.14 V | 有 | -40°C ~ 100°C (TJ) | Tray | M2GL005S | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B256 | 1.56 mm | 现场可编程门阵列 | 6060 | 719872 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||
| M2GL050-1FG896 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 896-BGA | YES | 896-FBGA (31x31) | 896 | 有 | 27 | IGLOO2 | 微芯片技术 | 377 | Tray | M2GL050 | 活跃 | 31 X 31 MM, 1 MM PITCH, FBGA-896 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.2 V | 20 | 1.14 V | 85 °C | 无 | M2GL050-1FG896 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | This product may require additional documentation to export from the United States. | N | 0°C ~ 85°C (TJ) | Tray | M2GL050 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B896 | 377 | 不合格 | 1.2 V | OTHER | 228.3 kB | 377 | 2.44 mm | 现场可编程门阵列 | 56340 | 1869824 | 56340 | 31 mm | 31 mm | ||||||||||||||||||
| M2GL150-1FCV484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BFBGA | 484-FBGA (19x19) | 微芯片技术 | 有 | 84 | IGLOO2 | 248 | Tray | M2GL150 | 活跃 | This product may require additional documentation to export from the United States. | N | 0°C ~ 85°C (TJ) | Tray | M2GL150 | 1.14V ~ 2.625V | 146124 | 5120000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL150TS-FCVG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 484-BFBGA | YES | 484-BGA | 484 | IGLOO2 | 微芯片技术 | 248 | Tray | M2GL150 | 活跃 | FBGA, | GRID ARRAY, FINE PITCH | 4 | PLASTIC/EPOXY | 1.2 V | 30 | 1.14 V | 有 | M2GL150TS-FCVG484I | FBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | Details | 有 | 84 | -40°C ~ 100°C (TJ) | Tray | M2GL150TS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B484 | 3.15 mm | 现场可编程门阵列 | 146124 | 5120000 | STD | 19 mm | 19 mm | |||||||||||||||||||||||||||||
| M2GL050T-1FGG484M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 有 | 60 | IGLOO2 | 267 | Tray | M2GL050 | 活跃 | This product may require additional documentation to export from the United States. | Details | -55°C ~ 125°C (TJ) | Tray | M2GL050T | 1.14V ~ 2.625V | 56340 | 1869824 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL150TS-FCG1152I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 24 | IGLOO2 | 微芯片技术 | 574 | Tray | M2GL150 | 活跃 | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | 网格排列 | 4 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 30 | 1.14 V | 有 | M2GL150TS-FCG1152I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | Details | 有 | -40°C ~ 100°C (TJ) | Tray | M2GL150TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 2.9 mm | 现场可编程门阵列 | 146124 | 5120000 | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||
| M2GL150T-1FCSG536I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 微芯片技术 | 有 | 90 | IGLOO2 | 293 | Tray | M2GL150 | 活跃 | This product may require additional documentation to export from the United States. | Details | -40°C ~ 100°C (TJ) | Tray | M2GL150T | 1.14V ~ 2.625V | 146124 | 5120000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL050T-VF400 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | IGLOO2 | 微芯片技术 | 207 | Tray | M2GL050 | 活跃 | 17 X 17 MM, 0.80 MM PITCH, VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 20 | 1.14 V | 85 °C | 无 | M2GL050T-VF400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | This product may require additional documentation to export from the United States. | N | 有 | 90 | 0°C ~ 85°C (TJ) | Tray | M2GL050T | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | OTHER | 228.3 kB | 207 | 1.51 mm | 现场可编程门阵列 | 56340 | 1869824 | 56340 | 17 mm | 17 mm | ||||||||||||||||||
| M2GL005S-1TQG144 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 1.14 V | 有 | 60 | 微芯片技术 | IGLOO2 | 1.26 V | 84 | Tray | M2GL005 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 1.2 V | 30 | 85 °C | 有 | M2GL005S-1TQG144 | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.57 | This product may require additional documentation to export from the United States. | Details | 0°C ~ 85°C (TJ) | Tray | M2GL005S | 1.14V ~ 2.625V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G144 | OTHER | 1.6 mm | 现场可编程门阵列 | 6060 | 719872 | 20 mm | 20 mm | |||||||||||||||||||||||||||||
| M2GL150T-FCVG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BFBGA | 484-BGA | 微芯片技术 | 有 | 84 | IGLOO2 | 248 | Tray | M2GL150 | 活跃 | This product may require additional documentation to export from the United States. | Details | -40°C ~ 100°C (TJ) | Tray | M2GL150T | 1.14V ~ 2.625V | 146124 | 5120000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL005-FG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 有 | 60 | 微芯片技术 | IGLOO2 | 1.26 V | 209 | Tray | M2GL005 | 活跃 | 23 X 23 MM, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | 1.2 V | 20 | 无 | M2GL005-FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.28 | This product may require additional documentation to export from the United States. | N | 1.14 V | -40°C ~ 100°C (TJ) | Tray | M2GL005 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 2.44 mm | 现场可编程门阵列 | 6060 | 719872 | STD | 23 mm | 23 mm | |||||||||||||||||||||||||||||
| M2GL150T-1FCV484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BFBGA | 484-FBGA (19x19) | 微芯片技术 | 有 | 84 | IGLOO2 | 活跃 | M2GL150 | Tray | 248 | This product may require additional documentation to export from the United States. | N | 0°C ~ 85°C (TJ) | Tray | M2GL150T | 1.14V ~ 2.625V | 146124 | 5120000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AX2000-1LG624M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | CCGA-624 | 624 | 624-CLGA (32.5x32.5) | 微芯片技术 | 418 | Tray | AX2000 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 有 | 1 | Actel | -55°C ~ 125°C (TA) | AX2000 | 125 °C | -55 °C | 1.425V ~ 1.575V | 36 kB | 21504 | 294912 | 2e+06 | 32256 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| AX2000-LG624M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | CCGA-624 | 624 | 624-CLGA (32.5x32.5) | 微芯片技术 | 418 | Tray | AX2000 | 活跃 | Actel | 1 | 有 | SMD/SMT | N | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TA) | AX2000 | 125 °C | -55 °C | 1.425V ~ 1.575V | 36 kB | 21504 | 294912 | 2000000 | 32256 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| U1AFS600-FGG256 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | 有 | 90 | Fusion | 114 | Tray | U1AFS600 | 活跃 | This product may require additional documentation to export from the United States. | Details | 0°C ~ 85°C (TJ) | Tray | U1AFS600 | 1.425V ~ 1.575V | 36864 | 250000 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| U1AFS1500-FGG256 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | 有 | 90 | Fusion | 119 | Tray | U1AFS1500 | 活跃 | This product may require additional documentation to export from the United States. | Details | 0°C ~ 85°C (TJ) | Tray | U1AFS1500 | 1.425V ~ 1.575V | 276480 | 1500000 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| U1AFS600-FG256I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | 有 | 90 | Fusion | 114 | Tray | U1AFS600 | 活跃 | This product may require additional documentation to export from the United States. | N | -40°C ~ 100°C (TJ) | Tray | U1AFS600 | 1.425V ~ 1.575V | 36864 | 250000 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M1AGL1000V2-FG256I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FPBGA-256 | YES | 256 | 256-FPBGA (17x17) | 256 | N | 11000 LE | SMD/SMT | 有 | 微芯片技术 | 90 | IGLOOe | 177 | Tray | M1AGL1000 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.2 V | 30 | 1.14 V | 100 °C | 无 | M1AGL1000V2-FG256I | 108 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | This product may require additional documentation to export from the United States. | -40°C ~ 85°C (TA) | Tray | M1AGL1000V2 | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 不合格 | INDUSTRIAL | 18 kB | 24576 CLBS, 1000000 GATES | 1.8 mm | 现场可编程门阵列 | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 17 mm | 17 mm | |||||||||||
| P1AFS600-2FGG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 有 | 60 | Fusion | 172 | Tray | P1AFS600 | 活跃 | This product may require additional documentation to export from the United States. | Details | -40°C ~ 100°C (TJ) | Tray | P1AFS600 | 1.425V ~ 1.575V | 110592 | 600000 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| P1AFS600-2FG256I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | 有 | 90 | Fusion | 119 | Tray | P1AFS600 | 活跃 | This product may require additional documentation to export from the United States. | N | -40°C ~ 100°C (TJ) | Tray | P1AFS600 | 1.425V ~ 1.575V | 110592 | 600000 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M1AGL1000V2-FGG144 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FPBGA-144 | YES | 144 | 144-FPBGA (13x13) | 144 | 11000 LE | SMD/SMT | 有 | 微芯片技术 | 160 | IGLOOe | 97 | Tray | M1AGL1000 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M1AGL1000V2-FGG144 | 108 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | This product may require additional documentation to export from the United States. | Details | 0°C ~ 70°C (TA) | Tray | M1AGL1000V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 不合格 | OTHER | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | 现场可编程门阵列 | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||
| P1AFS1500-2FGG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 有 | 60 | Fusion | 223 | Tray | P1AFS1500 | 活跃 | This product may require additional documentation to export from the United States. | Details | -40°C ~ 100°C (TJ) | Tray | P1AFS1500 | 1.425V ~ 1.575V | 276480 | 1500000 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M1AGL600V5-CSG281I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 281-TFBGA, CSBGA | YES | 281 | 281-CSP (10x10) | 281 | IGLOOe | 微芯片技术 | 215 | Tray | M1AGL600 | 活跃 | TFBGA, | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 1.425 V | 100 °C | 有 | M1AGL600V5-CSG281I | 108 MHz | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | This product may require additional documentation to export from the United States. | Details | 有 | 184 | -40°C ~ 85°C (TA) | Tray | M1AGL600V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 0.5 mm | compliant | 30 | S-PBGA-B281 | 不合格 | INDUSTRIAL | 13.5 kB | 13824 CLBS, 600000 GATES | 1.05 mm | 现场可编程门阵列 | 13824 | 110592 | 600000 | 13824 | 600000 | 10 mm | 10 mm |
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M2GL050-1VF400
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-1FG484
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-VF256I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050-1FG896
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150-1FCV484
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-FCVG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050T-1FGG484M
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-FCG1152I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-1FCSG536I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050T-VF400
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-1TQG144
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-FCVG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-FG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-1FCV484
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-1LG624M
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-LG624M
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
U1AFS600-FGG256
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
U1AFS1500-FGG256
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
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U1AFS600-FG256I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL1000V2-FG256I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
P1AFS600-2FGG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
P1AFS600-2FG256I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL1000V2-FGG144
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
P1AFS1500-2FGG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL600V5-CSG281I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)