N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

Fusion

0.014110 oz

1.575 V

Tray

AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AFS250-2FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

3000 LE

114 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

90

-40°C ~ 100°C (TJ)

Tray

AFS250

3A001.A.7.A

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

4.5 kB

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1.47059 GHz

2

6144

6144

250000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3P1000

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

40

70 °C

有

A3P1000L-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

11000 LE

0 to 70 °C

Tray

A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

+ 70 C

SMD/SMT

781.25 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.26 V

Tray

A3P1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

A3P1000L-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

11000 LE

97 I/O

1.14 V

0 C

0°C ~ 85°C (TJ)

Tray

A3P1000L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

有

24

ProASIC3

1.5000 V

微芯片技术

1.425 V

1.575 V

1.575 V

Tray

M1A3P250

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P250-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

151 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

0 to 70 °C

Tray

M1A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

36864

250000

1

6144

250000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

Actel

5.5 V

微芯片技术

Tray

A40MX04

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

FLATPACK, THIN PROFILE

5.3

MICROSEMI CORP

活跃

SQUARE

TQFP

109 MHz

A40MX04-3VQG80I

有

85 °C

40

3.3 V

-40 °C

PLASTIC/EPOXY

3

Details

69 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

188 MHz

有

90

-40°C ~ 85°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

1.7 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

有

24

ProASIC3

微芯片技术

1.5000 V

1.575 V

Tray

M1A3P600

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-2PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

0 to 70 °C

Tray

M1A3P600

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

110592

600000

2

13824

600000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

有

60

ProASIC3

微芯片技术

0.014110 oz

1.575 V

Tray

M1A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P600-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

235 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

-40°C ~ 100°C (TJ)

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

60

Fusion

172

Tray

P1AFS600

活跃

0°C ~ 85°C (TJ)

Tray

P1AFS600

1.425V ~ 1.575V

110592

600000

2

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

70 °C

有

U1AFS250-FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

1.5000 V

1.425 V

1.575 V

114

Tray

U1AFS250

0 to 70 °C

Tray

U1AFS250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

STD

6144

250000

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.2000 V

1.26 V

Tray

A3P1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

A3P1000L-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

11000 LE

97 I/O

1.14 V

0 to 70 °C

Tray

A3P1000L

e0

锡铅银

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

+ 85 C

SMD/SMT

892.86 MHz

有

60

ProASIC3

微芯片技术

0.014110 oz

1.2000 V

1.26 V

Tray

M1A3P600

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

30

85 °C

无

M1A3P600L-1FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

235 I/O

1.14 V

- 40 C

-40 to 85 °C

Tray

M1A3P600L

e0

锡铅

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

235

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

235

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

400

400-VFBGA (17x17)

微芯片技术

IGLOO2

207

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

N

有

90

-40°C ~ 100°C (TJ)

Tray

M2GL050

100 °C

-40 °C

1.14V ~ 2.625V

228.3 kB

56340

1869824

1

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

IGLOO2

微芯片技术

1.2 V

Tray

M2GL060

活跃

11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060-1FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

200 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

0°C ~ 85°C (TJ)

Tray

M2GL060

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

1.2 V

OTHER

现场可编程门阵列

56520

1869824

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

310 MHz

有

160

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.575 V

Tray

A3P400

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P400-2FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0 to 70 °C

Tray

A3P400

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

2

9216

400000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

19

Actel

0.171777 oz

微芯片技术

5.25 V

Tray

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A40MX02-PLG68A

116 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.59

Details

57 I/O

4.75 V

- 40 C

+ 125 C

SMD/SMT

120 MHz

有

-40°C ~ 125°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

5 V

AUTOMOTIVE

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

STD

2.2 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

256

微芯片技术

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

无

M1AGL1000V2-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

90

IGLOOe

177

Tray

M1AGL1000

活跃

BGA,

网格排列

3

0°C ~ 70°C (TA)

Tray

M1AGL1000V2

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P1000-2FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

11000 LE

97 I/O

0 to 70 °C

Tray

A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

有

90

Fusion

微芯片技术

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS600-1FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

-40°C ~ 100°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

1

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

N

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

90

ProASIC3

微芯片技术

0.014110 oz

FBGA

1.5000 V

600000

177

600000

表面贴装

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P600-2FG256I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Industrial grade

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

M1A3P600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

256

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

Industrial

2

13824

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

20

1.14 V

85 °C

无

M2GL050T-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

176

IGLOO2

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

526.32 MHz, 892.86 MHz

SMD/SMT

+ 70 C

0 C

1.14 V

300 I/O

11000 LE

微芯片技术

N

This product may require additional documentation to export from the United States.

1.2, 1.5 V

1.14 V

1.575 V

Tray

AGL1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

AGL1000V2-FG484

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

0.014110 oz

IGLOOe

60

有

0 to 70 °C

Tray

AGL1000V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B484

不合格

1.2 V to 1.5 V

OTHER

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

Actel

0.062040 oz

微芯片技术

5.25 V

Tray

A40MX04

活跃

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-2PQG100

101 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

Details

69 I/O

3 V

0 C

+ 70 C

SMD/SMT

175 MHz

有

66

0°C ~ 70°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

2 ns

547

6000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

SMD/SMT

+ 70 C

0 C

1.425 V

270 I/O

Details

This product may require additional documentation to export from the United States.

310 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE600

活跃

0°C ~ 85°C (TJ)

Tray

A3PE600

1.425V ~ 1.575V

1.5 V

110592

600000

2

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

IGLOO2

微芯片技术

Tray

M2GL090

活跃

1.2 V

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

85 °C

无

M2GL090T-FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

0°C ~ 85°C (TJ)

Tray

M2GL090T

85 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

OTHER

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

无

M1AGL600V2-CS281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

1.2 V

有

184

IGLOOe

1.5 V

215

Tray

M1AGL600

活跃

10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, CSP-281

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

0°C ~ 70°C (TA)

Tray

M1AGL600V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

1.2 V to 1.5 V

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

13824

600000

10 mm

10 mm