N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

KYOCERA AVX

40

1.425 V

100 °C

有

AGL400V5-FGG256I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.46

Tape & Reel (TR)

活跃

178

AGL400

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

-40°C ~ 85°C (TA)

*

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

17 mm

17 mm

N/A

-

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

无

微芯片技术

1.14 V

85 °C

无

M2GL050TS-1FG896

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.27

377

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

20

0°C ~ 85°C (TJ)

IGLOO2

Black

Power

Receptacle

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

Resilient Mount

Open

G101

Marathon Electric

HVAC

轧钢

1,725 RPM

3

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

81

微芯片技术

1.425 V

70 °C

有

AGLN030V5-ZCSG81

VFBGA

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.31

Miscellaneous

66

Tray

AGLN030

Obsolete

5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-20 °C

1.5 V

未说明

-20°C ~ 85°C (TJ)

IGLOO nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

OTHER

768 CLBS, 30000 GATES

0.8 mm

现场可编程门阵列

768

30000

768

30000

5 mm

5 mm

N/A

-

YES

313

75 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.88

PLASTIC, BGA-313

网格排列

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A14V100A-BG313C

e0

锡铅

MAX 228 I/OS

8542.39.00.01

CMOS

BOTTOM

BALL

225

1.27 mm

compliant

S-PBGA-B313

不合格

COMMERCIAL

1377 CLBS, 10000 GATES

2.52 mm

现场可编程门阵列

3.9 ns

1377

10000

35 mm

35 mm

N/A

-

XJG24 SA

UL;CSA

Crouse-Hinds Industrial Produc

Copper Free Aluminum

Threaded

N/A

-

YES

313

BGA

280 MHz

A54SX32-1BG313I

无

85 °C

3 V

30

3.3 V

-40 °C

BGA313,25X25,50

PLASTIC/EPOXY

3

Miscellaneous

BGA, BGA313,25X25,50

网格排列

5.24

3.6 V

MICROSEMI CORP

活跃

SQUARE

e0

锡铅

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B313

249

不合格

3.3,5 V

INDUSTRIAL

249

2880 CLBS, 32000 GATES

2.52 mm

现场可编程门阵列

0.8 ns

2880

2880

32000

35 mm

35 mm

N/A

-

Miscellaneous

N/A

-

HS35R20488372

CE

Hollowshaft

Hollow

Dynapar

有

-40 to 85 Degrees C

10 Pin Connector

5~26 VDC

Differential

5~26 VDC

有

IP67

N/A

-

表面贴装

1657-BCBGA

1657-CBGA (42.5x42.5)

微芯片技术

720

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

317

Tray

AX500

活跃

1.575 V

1.425 V

1.5000 V

-40 to 85 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

2

N/A

-

表面贴装

676-BGA

676-FBGA (27x27)

微芯片技术

336

Tray

AX500

活跃

1.5000 V

1.425 V

1.575 V

-40 to 85 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

2

N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

300

Tray

MPF200

活跃

-40°C ~ 100°C (TJ)

PolarFire™

0.97V ~ 1.08V

192000

13619200

N/A

-

表面贴装

484-BFBGA

484-FPBGA (19x19)

微芯片技术

284

Tray

MPF100

活跃

109000 LE

1.03 V/1.08 V

970 mV/1.02 V

SMD/SMT

-40°C ~ 100°C (TJ)

PolarFire™

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

484-BFBGA

484-FPBGA (19x19)

微芯片技术

284

Tray

MPF100

活跃

0°C ~ 100°C (TJ)

PolarFire™

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

100-LQFP

100-TQFP (14x14)

PEI-Genesis

Bulk

活跃

81

A54SX16A

0°C ~ 70°C (TA)

*

2.25V ~ 5.25V

24000

1452

N/A

-

表面贴装

Axial

Axial

微芯片技术

170

Tray

活跃

-65°C ~ 175°C

Bulk

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±1%

活跃

2

±50ppm/°C

815 kOhms

Metal Film

0.125W, 1/8W

0.97V ~ 1.08V

S (0.001%)

192000

13946061

Military, Moisture Resistant, Weldable

--

N/A

-

表面贴装

Axial

YES

Axial

100

微芯片技术

-40 °C

1.5 V

30

1.425 V

85 °C

无

A3PN250-Z1VQ100I

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.91

68

Tray

A3PN250

Obsolete

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

-65°C ~ 175°C

Tape & Reel (TR)

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

e0

活跃

2

±25ppm/°C

117 kOhms

锡铅

Metal Film

0.125W, 1/8W

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

68

不合格

S (0.001%)

1.5,1.5/3.3 V

INDUSTRIAL

68

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

6144

6144

250000

Military, Moisture Resistant, Weldable

--

14 mm

14 mm

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

1.2 V

40

1.14 V

100 °C

有

AGL1000V2-FGG484I

108 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.41

300

Tray

AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

-40°C ~ 85°C (TA)

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

23 mm

23 mm