N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

无

M2GL050T-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

176

IGLOO2

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

85 °C

0°C ~ 85°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

Actel

0.196363 oz

3.3, 5 V

微芯片技术

3 V

5.25 V

5.25 V

Tray

A42MX16

活跃

40

70 °C

有

A42MX16-FPQG160

56 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

1.4

3.3 V

PLASTIC/EPOXY

3

FLATPACK

QFP,

Details

125 I/O

3 V

0 C

+ 70 C

SMD/SMT

103 MHz

有

24

0 to 70 °C

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

F

4 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

CQFP

256-CQFP (75x75)

微芯片技术

202 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

151 MHz

有

1

Actel

0.372740 oz

5.5 V

Tray

5962-9958502

活跃

This product may require additional documentation to export from the United States.

N

-55°C ~ 125°C (TJ)

MX

3.3 V, 5 V

2560

54000

2.8 mm

36 mm

36 mm

N/A

-

表面贴装

BGA-456

YES

456

456-PBGA (35x35)

456

有

24

Actel

2.5000 V

微芯片技术

2.3 V

2.7 V

2.7 V

Tray

APA1000

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

-40 °C

2.5 V

40

85 °C

有

APA1000-BGG456I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

356 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

-40 to 85 °C

Tray

APA1000

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

245

1.27 mm

compliant

S-PBGA-B456

356

不合格

2.5,2.5/3.3 V

INDUSTRIAL

356

1000000 GATES

2.54 mm

现场可编程门阵列

202752

1000000

STD

56320

1000000

1.73 mm

35 mm

35 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

0.014110 oz

微芯片技术

1.575 V

Tray

M1A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P1000-FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

90

ProASIC3

0°C ~ 85°C (TJ)

Tray

M1A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

Tray

M1AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS1500-FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

0.014110 oz

Fusion

90

有

1098.9 MHz

SMD/SMT

+ 85 C

- 40 C

1.425 V

119 I/O

N

1.575 V

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

STD

1500000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

微芯片技术

PLASTIC/EPOXY

BGA324,18X18,40

1.5 V

1.425 V

70 °C

有

M1A3PE3000-FGG324

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

84

ProASIC3

3000000

3000000

221

Tray

M1A3PE3000

活跃

BGA, BGA324,18X18,40

网格排列

3

0°C ~ 85°C (TJ)

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

40

S-PBGA-B324

221

不合格

1.5/3.3 V

COMMERCIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

90

ProASIC3

0.014110 oz

微芯片技术

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

A3PE600-2FGG256

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

165 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

0 to 70 °C

Tray

A3PE600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

ProASIC3

0.014110 oz

微芯片技术

1.5000 V

1.575 V

Tray

M1A3P600

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

160

0 to 70 °C

Tray

M1A3P600

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

CSP-201

YES

201-CSP (8x8)

201

最后一次购买

微芯片技术

AGLP060

Tray

VFBGA, BGA201,15X15,20

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA201,15X15,20

-40 °C

1.5 V

未说明

85 °C

有

AGLP060V5-CSG201I

250 MHz

VFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

157 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

348

IGLOO PLUS

1.575 V

-40°C ~ 100°C (TJ)

Tray

AGLP060V5

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B201

157

不合格

1.5 V

INDUSTRIAL

157

1584 CLBS, 60000 GATES

0.99 mm

现场可编程门阵列

1584

18432

60000

1584

1584

60000

0.66 mm

8 mm

8 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

有

90

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

Tray

A3P1000

活跃

1.575 V

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P1000-1FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

11000 LE

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

0 to 70 °C

Tray

A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

CSP-289

YES

289-CSP (14x14)

289

微芯片技术

AGLP060

Obsolete

TFBGA, BGA289,17X17,32

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA289,17X17,32

-40 °C

1.5 V

未说明

85 °C

无

AGLP060V2-CS289I

160 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

N

157 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

119

IGLOO PLUS

1.575 V

Tray

-40°C ~ 100°C (TJ)

Tray

AGLP060V2

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

未说明

0.8 mm

unknown

S-PBGA-B289

157

不合格

1.2/1.5 V

INDUSTRIAL

157

1584 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1584

18432

60000

STD

1584

1584

60000

0.81 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3P1000

活跃

1.575 V

0 to 70 °C

Tray

M1A3P1000

1.5 V

147456

1000000

1

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-55 °C

1.5 V

30

125 °C

无

AX1000-FG676M

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

This product may require additional documentation to export from the United States.

N

418 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

649 MHz

有

40

Actel

0.014110 oz

-55°C ~ 125°C (TA)

Tray

AX1000

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

649 MHz

S-PBGA-B676

516

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

MIL-STD-883 Class B

12096

12096

0.99 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

微芯片技术

A40MX04

活跃

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

5.29

MICROSEMI CORP

活跃

SQUARE

TQFP

48 MHz

A40MX04-1VQG80I

有

85 °C

Details

69 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

160 MHz

有

90

Actel

5.5 V

Tray

-40°C ~ 85°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2.3 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

AFS1500

活跃

Fusion

0.014110 oz

90

有

1282.05 MHz

SMD/SMT

+ 70 C

0 C

1.425 V

119 I/O

0°C ~ 85°C (TJ)

Tray

AFS1500

70 °C

0 °C

1.5 V

33.8 kB

276480

1500000

1.28205 GHz

1

38400

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

活跃

1.575 V

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

40

70 °C

有

AX2000-2FGG896

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

586 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

870 MHz

有

27

Actel

0.014110 oz

Tray

AX2000

0°C ~ 70°C (TA)

Tray

AX2000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

870 MHz

S-PBGA-B896

684

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

36 kB

740 ps

740 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

870 MHz

32256

21504

2

21504

0.74 ns

21504

32256

1.575 V

1.425 V

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

0.014110 oz

微芯片技术

1.5000 V

1.425 V

1.575 V

Tray

M7A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

M7A3P1000-FGG484

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

60

ProASIC3

0 to 70 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

231 MHz

S-PBGA-B484

不合格

COMMERCIAL

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

微芯片技术

网格排列

3

PLASTIC/EPOXY

3.3 V

30

70 °C

无

A42MX36-BG272

73 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.19

BGA

N

202 I/O

3 V

0 C

+ 70 C

SMD/SMT

131 MHz

有

40

Actel

5.25 V

Tray

A42MX36

Obsolete

PLASTIC, BGA-272

0°C ~ 70°C (TA)

Tray

A42MX36

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

BOTTOM

BALL

225

1.27 mm

compliant

S-PBGA-B272

不合格

COMMERCIAL

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

131 MHz

1184

1822

2.7 ns

2438

5.25 V

3 V

54000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA-256

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

11000 LE

177 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

144 kbit

350 MHz

-

90

1 kbit

ProASIC3

1.425 V

1.575 V

1.5 V

Tray

A3P1000

活跃

-55 to 125 °C

Tray

A3P1000

1.5 V

8 mA

700 Mb/s

147456

1000000

1

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

网格排列

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1A3P400-2FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

ProASIC3

90

有

SMD/SMT

N

This product may require additional documentation to export from the United States.

400000

400000

178

Tray

M1A3P400

活跃

BGA,

0°C ~ 85°C (TJ)

Tray

M1A3P400

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

160

ProASIC3

0.014110 oz

微芯片技术

1.575 V

Tray

M1A3P1000

活跃

1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-55 °C

1.5 V

30

125 °C

无

M1A3P1000-FG144M

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

有

-55°C ~ 125°C (TJ)

Tray

M1A3P1000

e0

3A001.A.2.C

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.5,1.5/3.3 V

MILITARY

8 mA

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

1.575 V

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

30

85 °C

无

AX2000-2FG896I

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

586 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

870 MHz

有

27

Actel

0.014110 oz

-40°C ~ 85°C (TA)

Tray

AX2000

e0

锡铅

85 °C

-40 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

870 MHz

S-PBGA-B896

684

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

36 kB

740 ps

740 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

870 MHz

32256

21504

2

21504

0.74 ns

21504

32256

1.575 V

1.425 V

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

676

676-FBGA (27x27)

微芯片技术

86184 LE

425 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2000 V

1.14 V

1.26 V

1.2 V

Tray

M2GL090

活跃

This product may require additional documentation to export from the United States.

Details

0 to 85 °C

Tray

M2GL090T

85 °C

0 °C

1.2 V

323.3 kB

86316

2648064

1

4 Transceiver

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

14 X 14 MM, 0.80 MM PITCH, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL010TS-1VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL010

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm