N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

活跃

248

Tray

AX250

0°C ~ 70°C (TA)

Axcelerator

1.425V ~ 1.575V

55296

250000

4224

STD

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

1.2000 V

1.14 V

1.26 V

177

Tray

A3P1000

活跃

微芯片技术

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

40

1.14 V

85 °C

有

A3P1000L-1FGG256I

350 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.26

-40 to 85 °C

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

676-BGA

676-FBGA (27x27)

微芯片技术

活跃

1.5000 V

1.425 V

1.575 V

336

Tray

AX500

0 to 70 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

STD

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

2.7 V

70

Tray

EX128

活跃

微芯片技术

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

40

2.3 V

70 °C

有

EX128-PTQG100

357 MHz

LFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

2.7 V

2.06

2.5000 V

2.3 V

0 to 70 °C

EX

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

COMMERCIAL

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

P

0.7 ns

6000

14 mm

14 mm

N/A

-

表面贴装

176-LQFP

176-TQFP (24x24)

微芯片技术

活跃

3.3, 5 V

2.97, 4.5 V

3.63, 5.5 V

147

Tray

A54SX16

-40 to 85 °C

SX

3V ~ 3.6V, 4.75V ~ 5.25V

24000

1452

STD

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

144

GRID ARRAY, LOW PROFILE

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

1.79

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

LBGA

108 MHz

M1AGL1000V2-FG144I

无

100 °C

1.14 V

97

Tray

M1AGL1000

活跃

Non-Compliant

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

-40°C ~ 85°C (TA)

IGLOO

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1000000

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

2.97, 4.75 V

3.63, 5.25 V

113

Tray

A54SX32

活跃

微芯片技术

5.24

3.6 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

LFQFP

240 MHz

A54SX32-TQG144

有

70 °C

3 V

40

3.3 V

QFP144,.87SQ,20

PLASTIC/EPOXY

3

FLATPACK, LOW PROFILE, FINE PITCH

LFQFP, QFP144,.87SQ,20

3.3, 5 V

0 to 70 °C

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

3.3,5 V

COMMERCIAL

113

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

STD

0.9 ns

2880

2880

32000

20 mm

20 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

3.3, 5 V

2.97, 4.5 V

3.63, 5.5 V

81

Tray

A54SX16

活跃

微芯片技术

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

-40 °C

3.3 V

40

3 V

85 °C

有

A54SX16P-2VQG100I

320 MHz

TFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.24

-40 to 85 °C

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

3.3,3.3/5 V

INDUSTRIAL

81

1452 CLBS, 16000 GATES

1.2 mm

现场可编程门阵列

24000

1452

2

0.7 ns

1452

1452

16000

14 mm

14 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

2.25 V

2.75 V

175

Tray

A54SX16

活跃

微芯片技术

PLASTIC, ROHS COMPLIANT, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

2.25 V

70 °C

有

A54SX16A-FPQG208

167 MHz

FQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

2.75 V

5.25

2.5000 V

0 to 70 °C

SX-A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

2.5,3.3/5 V

COMMERCIAL

175

1452 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

1452

F

1.9 ns

1452

1452

24000

28 mm

28 mm

N/A

-

表面贴装

64-LQFP

YES

64-TQFP (10x10)

64

TQFP-64

FLATPACK, LOW PROFILE, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

2.5 V

30

2.3 V

70 °C

无

EX64-FTQ64

178 MHz

LFQFP

SQUARE

Obsolete

MICROSEMI CORP

2.7 V

5.61

Miscellaneous

41

Tray

EX64

Obsolete

0°C ~ 70°C (TA)

EX

e0

Tin/Lead (Sn/Pb)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G64

COMMERCIAL

3000 GATES

1.6 mm

现场可编程门阵列

128

3000

1.4 ns

3000

10 mm

10 mm

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

ACH580-BCR-361A-4+B056+K465

ABB

115

Tray

AX500

Obsolete

-40°C ~ 85°C (TA)

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

N/A

-

5 Inches

BT15S54551

Dwyer Instruments

N/A

-

HS351024G134D

Danaher Controls

N/A

-

78101197456

Cooper

N/A

-

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

活跃

HQCCN,

微芯片技术

CHIP CARRIER, HEAT SINK/SLUG

3

UNSPECIFIED

-40 °C

1.5 V

30

1.425 V

85 °C

有

HQCCN

SQUARE

不推荐

MICROSEMI CORP

1.575 V

7.07

Miscellaneous

SW-05V

34

Tray

A3PN030

-40°C ~ 100°C (TJ)

ProASIC3 nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

现场可编程门阵列

30000

STD

768

30000

6 mm

6 mm

N/A

-

表面贴装

536-LFBGA

536-BGA (16x16)

微芯片技术

P56H319

Reliance Electric

300

Tray

活跃

-55°C ~ 125°C (TJ)

PolarFire™

0.97V ~ 1.08V

300000

21600666

N/A

-

YES

208

QFP208,1.2SQ,20

-40 °C

1.5 V

30

1.425 V

85 °C

无

AX250-PQ208I

649 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.61

0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

e0

Tin/Lead (Sn/Pb)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

248

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

248

2816 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

0.99 ns

2816

4224

250000

28 mm

28 mm

N/A

-

YES

208

QFP208,1.2SQ,20

-40 °C

1.5 V

40

1.425 V

85 °C

有

A3PE600-PQG208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.81

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

e3

哑光锡

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

N/A

-

表面贴装

144-LBGA

144-FPBGA (13x13)

微芯片技术

活跃

97

Tray

A3P400

-40°C ~ 100°C (TJ)

ProASIC3

1.425V ~ 1.575V

55296

400000

STD

N/A

-

YES

208

QFP208,1.2SQ,20

-40 °C

1.5 V

30

1.425 V

85 °C

无

A3PE600-2PQ208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

8.76

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

1.2000 V

1.14 V

1.26 V

177

Tray

A3P1000

活跃

微芯片技术

MICROSEMI CORP

1.575 V

1.55

活跃

Microsemi Corporation

SQUARE

BGA

350 MHz

A3P1000L-1FG256I

无

85 °C

1.14 V

30

1.2 V

-40 °C

BGA256,16X16,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA256,16X16,40

-40 to 85 °C

ProASIC3L

e0

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

17 mm

17 mm

N/A

-

YES

144

1.2 V

40

1.14 V

70 °C

有

A3P250L-FGG144

350 MHz

LBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

7.67

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

COMMERCIAL

97

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

6144

250000

13 mm

13 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

A3P1000

活跃

1 MM PITCH, GREEN, FBGA-256

网格排列

3

微芯片技术

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.5 V

40

1.425 V

125 °C

有

A3P1000-FGG256T

350 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.23

Automotive grade

177

Tray

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

AUTOMOTIVE

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

AEC-Q100

STD

24576

24576

1000000

17 mm

17 mm

N/A

-

N/A

-

YES

256

125 °C

A14100A-1CQ256M

125 MHz

GQFF

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

5.79

GQFF, TPAK256,3SQ,20

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

TPAK256,3SQ,20

-55 °C

5 V

4.5 V

e0

3A001.A.2.C

锡铅

25000 PLD EQUIVALENT GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F256

228

不合格

5 V

MILITARY

228

1377 CLBS, 10000 GATES

3.3 mm

现场可编程门阵列

2.6 ns

1377

1377

10000

36 mm

36 mm