品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 产品类别 | 高度 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | M2GL060-FG676 | Microchip | 数据表 | 2152 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 676-BGA | 676-FBGA (27x27) | 微芯片技术 | 387 | Tray | M2GL060 | 活跃 | 56520 LE | + 85 C | 1.2 V | 0 C | 1.2 V | SMD/SMT | 0°C ~ 85°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 1.2 V | 56520 | 1869824 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090T-FGG676I | Microchip | 数据表 | 2512 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 676-BGA | YES | 676-FBGA (27x27) | 676 | 微芯片技术 | BGA676,26X26,40 | 1.2 V | 有 | M2GL090T-FGG676I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.26 | 425 | Tray | M2GL090 | 活跃 | 86184 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B676 | 425 | 不合格 | 1.2 V | 1.2 V | 425 | 2.44 mm | 现场可编程门阵列 | 86184 | 2648064 | 4 Transceiver | 86316 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060T-FG676 | Microchip | 数据表 | 2389 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 676-BGA | YES | 676-FBGA (27x27) | 676 | 微芯片技术 | PLASTIC/EPOXY | 1.2 V | 20 | 85 °C | 无 | M2GL060T-FG676 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.26 | 387 | Tray | M2GL060 | 活跃 | 56520 LE | + 85 C | 1.2 V | 0 C | 1.2 V | SMD/SMT | BGA, | 网格排列 | 3 | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 1.2 V | OTHER | 2.44 mm | 现场可编程门阵列 | 56520 | 1869824 | 4 Transceiver | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060-FCS325 | Microchip | 数据表 | 2442 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | 微芯片技术 | 200 | Tray | M2GL060 | 活跃 | 56520 LE | + 85 C | 1.2 V | 0 C | 1.2 V | SMD/SMT | 0°C ~ 85°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 1.2 V | 56520 | 1869824 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060T-FG484I | Microchip | 数据表 | 2392 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 267 | Tray | M2GL060 | 活跃 | 56520 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | -40°C ~ 100°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 1.2 V | 56520 | 1869824 | 4 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060TS-1FG676I | Microchip | 数据表 | 2797 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 676-BGA | YES | 676-FBGA (27x27) | 676 | 微芯片技术 | 1.2 V | 20 | 无 | M2GL060TS-1FG676I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.26 | 387 | Tray | M2GL060 | 活跃 | 56520 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | 27 X 27 MM, 1 MM PITCH, FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 1.2 V | 2.44 mm | 现场可编程门阵列 | 56520 | 1869824 | 4 Transceiver | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX500-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | AX500 | Obsolete | 115 | Tray | 0°C ~ 70°C (TA) | Axcelerator | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P1000L-1FGG256I | Microchip | 数据表 | 2664 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | BGA256,16X16,40 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | A3P1000L-1FGG256I | 350 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.26 | 1.2000 V | 1.14 V | 1.26 V | 177 | Tray | A3P1000 | 活跃 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | -40 to 85 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | 现场可编程门阵列 | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX500-FG676 | Microchip | 数据表 | 904 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 676-BGA | 676-FBGA (27x27) | 微芯片技术 | 336 | Tray | AX500 | 活跃 | 1.5000 V | 1.425 V | 1.575 V | 0 to 70 °C | Axcelerator | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EX128-PTQG100 | Microchip | 数据表 | 2965 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | 100-TQFP (14x14) | 100 | 微芯片技术 | 2.3 V | 70 °C | 有 | EX128-PTQG100 | 357 MHz | LFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 2.06 | 2.5000 V | 2.3 V | 2.7 V | 70 | Tray | EX128 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 2.5 V | 40 | 0 to 70 °C | EX | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | COMMERCIAL | 6000 GATES | 1.6 mm | 现场可编程门阵列 | 256 | 6000 | P | 0.7 ns | 6000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600L-1FG484I | Microchip | 数据表 | 2414 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | 微芯片技术 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | A3P600L-1FG484I | 350 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.24 | 1.2000 V | 1.14 V | 1.26 V | 235 | Compliant | Tray | A3P600 | 活跃 | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | -40 to 85 °C | ProASIC3L | e0 | 锡铅 | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 235 | 不合格 | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 110592 | 600000 | 892.86 MHz | 1 | 13824 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | 无 | ||||||||||||||||||||||||||||||||
![]() | A54SX16P-TQG176I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 176-LQFP | 176-TQFP (24x24) | 微芯片技术 | 147 | Tray | A54SX16 | 活跃 | 3.3, 5 V | 2.97, 4.5 V | 3.63, 5.5 V | -40 to 85 °C | SX | 3V ~ 3.6V, 4.75V ~ 5.25V | 24000 | 1452 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL600V2-CSG281 | Microchip | 数据表 | 2312 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 281-TFBGA, CSBGA | YES | 281-CSP (10x10) | 281 | 微芯片技术 | 1.14 V | 85 °C | 有 | AGL600V2-CSG281 | 108 MHz | TFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.32 | 1.2, 1.5 V | 1.14 V | 1.575 V | 215 | Tray | AGL600 | 活跃 | TFBGA, | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 1.2 V | 未说明 | 0 to 70 °C | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | 281 | S-PBGA-B281 | 不合格 | OTHER | 13824 CLBS, 600000 GATES | 1.05 mm | 现场可编程门阵列 | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AGL1000V2-FG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 144 | 微芯片技术 | SQUARE | LBGA | 108 MHz | M1AGL1000V2-FG144I | 无 | 100 °C | 1.14 V | 97 | Tray | M1AGL1000 | 活跃 | Non-Compliant | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 1.2 V | 30 | 1.79 | 1.575 V | MICROSEMI CORP | 活跃 | Microsemi Corporation | -40°C ~ 85°C (TA) | IGLOO | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 不合格 | INDUSTRIAL | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-TQG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | SQUARE | LFQFP | 240 MHz | A54SX32-TQG144 | 有 | 70 °C | 3 V | 40 | 3.3 V | QFP144,.87SQ,20 | PLASTIC/EPOXY | 3 | FLATPACK, LOW PROFILE, FINE PITCH | LFQFP, QFP144,.87SQ,20 | 3.3, 5 V | 2.97, 4.75 V | 3.63, 5.25 V | 113 | Tray | A54SX32 | 活跃 | 5.24 | 3.6 V | MICROSEMI CORP | 活跃 | Microsemi Corporation | 0 to 70 °C | SX | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G144 | 113 | 不合格 | 3.3,5 V | COMMERCIAL | 113 | 2880 CLBS, 32000 GATES | 1.6 mm | 现场可编程门阵列 | 48000 | 2880 | STD | 0.9 ns | 2880 | 2880 | 32000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16P-2VQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | TQFP100,.63SQ | -40 °C | 3.3 V | 40 | 3 V | 85 °C | 有 | A54SX16P-2VQG100I | 320 MHz | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 5.24 | 3.3, 5 V | 2.97, 4.5 V | 3.63, 5.5 V | 81 | Tray | A54SX16 | 活跃 | TFQFP, TQFP100,.63SQ | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 to 85 °C | SX | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 81 | 不合格 | 3.3,3.3/5 V | INDUSTRIAL | 81 | 1452 CLBS, 16000 GATES | 1.2 mm | 现场可编程门阵列 | 24000 | 1452 | 2 | 0.7 ns | 1452 | 1452 | 16000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX72A-FG484I | Microchip | 数据表 | 2945 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (27X27) | 484 | 微芯片技术 | 2.5 V | 30 | 2.25 V | 85 °C | 无 | A54SX72A-FG484I | BGA | SQUARE | Microsemi FPGA & SoC | 活跃 | MICROSEMI SOC PRODUCTS GROUP | 2.75 V | 5.2 | BGA | 2.5000 V | 2.25 V | 2.75 V | 360 | Tray | A54SX72 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | -40 to 85 °C | SX-A | e0 | 无 | 锡铅 | 72000 TYPICAL GATES AVAILABLE | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | compliant | 484 | S-PBGA-B484 | 不合格 | INDUSTRIAL | 6036 CLBS, 108000 GATES | 2.44 mm | 现场可编程门阵列 | 108000 | 6036 | STD | 1.5 ns | 6036 | 108000 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060-FGG676I | Microchip | 数据表 | 2265 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-676 | YES | 676-FBGA (27x27) | 676 | 387 I/O | + 100 C | 1.26 V | - 40 C | 微芯片技术 | 40 | 1.14 V | SMD/SMT | Microchip | Microchip Technology / Atmel | IGLOO2 | Details | Tray | M2GL060 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 1.2 V | 有 | M2GL060-FGG676I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | 1.2000 V | 1.14 V | 1.26 V | 有 | This product may require additional documentation to export from the United States. | 56520 LE | -40 to 100 °C | Tray | M2GL060 | 8542.39.00.01 | 可编程逻辑集成电路 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B676 | 1.2 V | 667 Mb/s | 2.44 mm | 现场可编程门阵列 | 56520 | FPGA - Field Programmable Gate Array | 1869824 | STD | 4 Transceiver | FPGA - Field Programmable Gate Array | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-FPQG208 | Microchip | 数据表 | 2843 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 2.5 V | 40 | 2.25 V | 70 °C | 有 | A54SX16A-FPQG208 | 167 MHz | FQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.75 V | 5.25 | 2.5000 V | 2.25 V | 2.75 V | 175 | Tray | A54SX16 | 活跃 | PLASTIC, ROHS COMPLIANT, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 0 to 70 °C | SX-A | e3 | Matte Tin (Sn) | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 175 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 175 | 1452 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 1452 | F | 1.9 ns | 1452 | 1452 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P030-VQG100 | Microchip | 数据表 | 3160 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 1.5000 V | 1.425 V | 1.575 V | 77 | Tray | A3P030 | 活跃 | 有 | 330 LE | + 85 C | 微芯片技术 | 1.575 V | 0.017637 oz | 0 C | 90 | 1.425 V | SMD/SMT | - | Microchip | Microchip Technology / Atmel | 231 MHz | ProASIC3 | Details | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | A3P030-VQG100 | 350 MHz | TFQFP | SQUARE | 活跃 | FPGA - Field Programmable Gate Array ProASIC3 | MICROSEMI CORP | 1.32 | 0 to 70 °C | Tray | ProASIC3 | e3 | Matte Tin (Sn) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 1.5 V | COMMERCIAL | 2 mA | - | 768 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 30000 | STD | - | 768 | 30000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||
![]() | A54SX16-2TQG176 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 176-LQFP | YES | 176-TQFP (24x24) | 176 | 微芯片技术 | 3.3 V | 40 | 3 V | 70 °C | 有 | A54SX16-2TQG176 | 320 MHz | LFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 5.24 | 3.3, 5 V | 2.97, 4.75 V | 3.63, 5.25 V | 147 | Tray | A54SX16 | 活跃 | 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | 0 to 70 °C | SX | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 147 | 不合格 | 3.3,5 V | COMMERCIAL | 147 | 1452 CLBS, 16000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 1452 | 2 | 0.7 ns | 1452 | 1452 | 16000 | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA750-FGG896 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | 微芯片技术 | 180 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.26 | 2.5000 V | 562 | Compliant | Tray | APA750 | 活跃 | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | 2.5 V | 40 | 2.3 V | 70 °C | 有 | APA750-FGG896 | 0 to 70 °C | ProASICPLUS | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 250 | 1 mm | compliant | 180 MHz | 896 | S-PBGA-B896 | 562 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | 18 kB | 562 | 750000 GATES | 2.44 mm | 现场可编程门阵列 | 147456 | 750000 | 180 MHz | STD | 32768 | 32768 | 750000 | 1.73 mm | 31 mm | 31 mm | 无 | |||||||||||||||||||||||||||||||||||
![]() | AX125-2FGG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 256 | 400.011771 mg | 256 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | 138 | Compliant | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | AX125-2FGG256I | 870 MHz | LBGA | e1 | 锡银铜 | 85 °C | -40 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | 870 MHz | S-PBGA-B256 | 168 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 2.3 kB | 740 ps | 740 ps | 168 | 1344 CLBS, 125000 GATES | 1.7 mm | 现场可编程门阵列 | 1344 | 125000 | 870 MHz | 1344 | 2 | 1344 | 0.74 ns | 1344 | 2016 | 125000 | 1.2 mm | 17 mm | 17 mm | 无 | ||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-2PLG84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 84 | 6.777889 g | 84 | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.27 | 69 | Compliant | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 3 V | 85 °C | 有 | A54SX08-2PLG84I | 320 MHz | QCCJ | SQUARE | e3 | 哑光锡 | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | J BEND | 245 | 1.27 mm | compliant | 320 MHz | S-PQCC-J84 | 不合格 | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 700 ps | 700 ps | 768 CLBS, 8000 GATES | 4.572 mm | 现场可编程门阵列 | 768 | 12000 | 320 MHz | 768 | 2 | 256 | 0.7 ns | 768 | 8000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150T-1FCSG536 | Microchip | 数据表 | 2770 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 微芯片技术 | M2GL150 | 活跃 | 293 | Tray | 0°C ~ 85°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 146124 | 5120000 |
M2GL060-FG676
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,294.834087
M2GL090T-FGG676I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
2,092.390867
M2GL060T-FG676
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,433.461831
M2GL060-FCS325
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
910.480624
M2GL060T-FG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,540.969411
M2GL060TS-1FG676I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,936.770418
AX500-PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000L-1FGG256I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
2,435.325152
AX500-FG676
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
3,965.615169
EX128-PTQG100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
986.248271
A3P600L-1FG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,968.816501
A54SX16P-TQG176I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL600V2-CSG281
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,042.227579
M1AGL1000V2-FG144I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32-TQG144
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16P-2VQG100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX72A-FG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
2,485.317431
M2GL060-FGG676I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
942.986458
A54SX16A-FPQG208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,071.241108
A3P030-VQG100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
52.745001
A54SX16-2TQG176
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA750-FGG896
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX125-2FGG256I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08-2PLG84I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL150T-1FCSG536
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,752.245818
