N/A

-

YES

208

PLASTIC/EPOXY

1.5 V

40

1.425 V

70 °C

有

M7AFS600-2PQG208

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.8

FQFP,

FLATPACK, FINE PITCH

3

e3

哑光锡

8542.39.00.01

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

600000 GATES

4.1 mm

现场可编程门阵列

600000

28 mm

28 mm

N/A

-

YES

484

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1A3P400-2FG484

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

BGA,

网格排列

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

2.44 mm

现场可编程门阵列

9216

400000

23 mm

23 mm

N/A

-

YES

208

PLASTIC/EPOXY

1.5 V

40

1.425 V

70 °C

有

M7AFS600-PQG208

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.8

FQFP,

FLATPACK, FINE PITCH

3

e3

哑光锡

8542.39.00.01

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

600000 GATES

4.1 mm

现场可编程门阵列

600000

28 mm

28 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

FLATPACK, LOW PROFILE, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

5.57

1.26 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

LFQFP

M2GL010-1TQ144I

无

1.14 V

20

1.2 V

84

Tray

Obsolete

LFQFP,

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G144

1.6 mm

现场可编程门阵列

12084

933888

20 mm

20 mm

N/A

-

N/A

-

YES

84

3

PLASTIC/EPOXY

3.3 V

40

3 V

70 °C

有

A54SX08-PLG84

240 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

QCCJ,

CHIP CARRIER

e3

哑光锡

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

768 CLBS, 8000 GATES

4.572 mm

现场可编程门阵列

0.9 ns

768

8000

29.3116 mm

29.3116 mm

N/A

-

N/A

-

YES

121

1.5 V

1.425 V

100 °C

无

A3P060-CS121I

VFBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

8542.39.00.01

CMOS

BOTTOM

BALL

0.5 mm

compliant

S-PBGA-B121

不合格

INDUSTRIAL

1536 CLBS, 60000 GATES

0.99 mm

现场可编程门阵列

1536

60000

6 mm

6 mm

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

活跃

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

84-LCC (J-Lead)

84-PLCC (29.31x29.31)

微芯片技术

Tray

A40MX04

Obsolete

69

0°C ~ 70°C (TA)

MX

3V ~ 3.6V, 4.75V ~ 5.25V

6000

N/A

-

表面贴装

YES

400

400

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

有

M2GL010S-1VFG400I

FBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.82

195

Compliant

FBGA, BGA400,20X20,32

GRID ARRAY, FINE PITCH

3

100 °C

-40 °C

现场可编程门阵列

BOTTOM

BALL

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

114 kB

195

现场可编程门阵列

12084

12084

N/A

-

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

166

Bulk

活跃

-55°C ~ 125°C

RTG4™

1.2V

151824

5200000

N/A

-

YES

208

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1AFS250-PQ208

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.88

QFP-208

FLATPACK

3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

QUAD

FLAT

225

0.5 mm

compliant

R-PQFP-F208

不合格

OTHER

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

250000

30.6 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

Tray

M1A3P400

Obsolete

FQFP,

微芯片技术

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

5.25

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

FQFP

350 MHz

M1A3P400-PQ208

无

85 °C

1.425 V

151

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

28 mm

28 mm

N/A

-

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

活跃

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

144

5.79

97

Non-Compliant

3

20

无

AGL250V2-FG144T

Microsemi Corporation

活跃

MICROSEMI CORP

e0

锡铅

70 °C

0 °C

8542.39.00.01

235

unknown

4.5 kB

现场可编程门阵列

6144

250000

N/A

-

N/A

-

YES

1152

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.88

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

无

M2GL100TS-1FC1152I

BGA

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

N/A

-

YES

1152

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.88

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

无

M2GL150S-1FC1152I

BGA

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

146124

N/A

-

N/A

-

N/A

-

,

3

有

M2S050S-1VFG400I

Microsemi Corporation

活跃

MICROSEMI CORP

5.76

compliant

现场可编程门阵列

N/A

-

YES

1152

MICROSEMI CORP

1.26 V

5.86

M2S100-1FC1152I

无

1.14 V

未说明

1.2 V

BGA1152,34X34,40

PLASTIC/EPOXY

网格排列

35 X 35 MM, 1 MM PITCH, FBGA-1152

BGA

SQUARE

Microsemi Corporation

活跃

e0

锡铅

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm

N/A

-

YES

1152

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

未说明

1.14 V

85 °C

有

M2S100-1FCG1152

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.8

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

网格排列

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm