N/A

-

144

5.25

97

Compliant

3

30

有

AGL600V2-FGG144T

Microsemi Corporation

活跃

MICROSEMI CORP

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

260

compliant

1.5 V

13.5 kB

现场可编程门阵列

13824

600000

N/A

-

表面贴装

100

80

Compliant

85 °C

-40 °C

125 MHz

5 V

5.5 V

4.5 V

3 ns

3 ns

200

1500

200

264

无

N/A

-

表面贴装

YES

240

240

Compliant

FQFP, QFP240,1.3SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP240,1.3SQ,20

-55 °C

3.3 V

40

3 V

125 °C

有

A42MX36-1PQG240M

83 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.81

202

e3

3A001.A.2.C

哑光锡

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G240

202

不合格

5 V

3.3,3.3/5,5 V

MILITARY

5.5 V

3 V

320 B

202

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

54000

151 MHz

1184

1

1822

2.3 ns

2438

2438

54000

3.4 mm

32 mm

32 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

256

400.011771 mg

138

Compliant

70 °C

0 °C

649 MHz

1.5 V

1.575 V

1.425 V

2.3 kB

990 ps

990 ps

1344

125000

649 MHz

1344

1344

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

144

97

Non-Compliant

3

20

无

AGL250V2-FG144T

Microsemi Corporation

活跃

MICROSEMI CORP

5.79

e0

锡铅

70 °C

0 °C

8542.39.00.01

235

unknown

4.5 kB

现场可编程门阵列

6144

250000

N/A

-

N/A

-

YES

1152

Microsemi Corporation

活跃

MICROSEMI CORP

5.88

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

无

M2GL100TS-1FC1152I

BGA

SQUARE

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

N/A

-

YES

1152

Microsemi Corporation

活跃

MICROSEMI CORP

5.88

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

无

M2GL150S-1FC1152I

BGA

SQUARE

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

146124

N/A

-

N/A

-

N/A

-

,

3

有

M2S050S-1VFG400I

Microsemi Corporation

活跃

MICROSEMI CORP

5.76

compliant

现场可编程门阵列

N/A

-

YES

1152

1.26 V

5.86

M2S100-1FC1152I

无

1.14 V

未说明

1.2 V

BGA1152,34X34,40

PLASTIC/EPOXY

网格排列

35 X 35 MM, 1 MM PITCH, FBGA-1152

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

e0

锡铅

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm

N/A

-

表面贴装

YES

1152

1152

无

M2GL100-1FC1152

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.88

574

Non-Compliant

BGA, BGA1152,34X34,40

网格排列

PLASTIC

BGA1152,34X34,40

1.2 V

85 °C

0 °C

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

1.2 V

1.26 V

1.14 V

444 kB

574

现场可编程门阵列

99512

99512

N/A

-

YES

1152

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

未说明

1.14 V

85 °C

有

M2S100-1FCG1152

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.8

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

网格排列

4

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm

N/A

-

N/A

-

N/A

-

表面贴装

425

Compliant

100 °C

-40 °C

323.3 kB

86316

N/A

-

Compliant

70 °C

0 °C

5 V

2.3 ns

2

568

无

N/A

-

表面贴装

144

104

Non-Compliant

70 °C

0 °C

90 MHz

5 V

5.25 V

4.75 V

5 ns

684

4000

684

568

无

N/A

-

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

176

Tray

活跃

48000 LE

+ 100 C

1.03 V/1.08 V

- 40 C

970 mV/1.02 V

SMD/SMT

-40°C ~ 100°C (TJ)

-

0.97V ~ 1.08V

1 V, 1.05 V

3774874

48000

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

YES

84

84

CHIP CARRIER

3

PLASTIC/EPOXY

5 V

30

4.75 V

70 °C

无

A1425A-1PL84C

150 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

5.88

70

Non-Compliant

PLASTIC, LCC-84

e0

锡铅

70 °C

0 °C

MAX 70 I/OS

CMOS

QUAD

J BEND

225

1.27 mm

compliant

150 MHz

S-PQCC-J84

不合格

5 V

COMMERCIAL

5.25 V

4.75 V

2.6 ns

310 CLBS, 2500 GATES

4.572 mm

现场可编程门阵列

310

2500

310

2.6 ns

310

2500

29.3116 mm

29.3116 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

1152

400.011771 mg

1152

3

PLASTIC/EPOXY

BGA1152,34X34,40

1.5 V

20

1.425 V

70 °C

无

AX2000-2FG1152

870 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.84

684

Compliant

1 MM PITCH, FBGA-1152

网格排列

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

unknown

870 MHz

S-PBGA-B1152

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

36 kB

740 ps

740 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

2e+06

870 MHz

21504

2

21504

0.74 ns

21504

32256

2000000

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

1657-BCLGA

1657-CLGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325