N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

PLASTIC/EPOXY

1.2 V

85 °C

有

M2GL005S-VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

1.14 V

有

119

IGLOO2

161

Tray

M2GL005

活跃

1.26 V

14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

0°C ~ 85°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B256

OTHER

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

-40 °C

1.5 V

30

1.425 V

85 °C

无

M1A3PE3000-2FG324I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

有

84

ProASIC3

221

Tray

M1A3PE3000

活跃

BGA, BGA324,18X18,40

-40°C ~ 100°C (TJ)

Tray

M1A3PE3000

e0

锡铅银

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

221

不合格

1.5/3.3 V

INDUSTRIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

N

203 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

238 MHz

有

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

-40°C ~ 125°C (TA)

Tray

A54SX32A

2.25V ~ 5.25V

2.5 V

48000

2880

STD

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

微芯片技术

Obsolete

5.25 V

ROHS COMPLIANT, PLASTIC, BGA-272

网格排列

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX36-FBGG272

44 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Details

202 I/O

3 V

0 C

+ 70 C

SMD/SMT

79 MHz

有

40

Actel

Tray

A42MX36

0°C ~ 70°C (TA)

Tray

A42MX36

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B272

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

79 MHz

1184

1822

3.8 ns

2438

54000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA-896

YES

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

Details

35000 LE

620 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

504 kbit

350 MHz

微芯片技术

3500 LAB

27

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.2 V

40

85 °C

有

M1A3PE3000L-1FGG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

25 mA

700 Mb/s

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.87

This product may require additional documentation to export from the United States.

N

有

60

Fusion

172

Tray

M1AFS600

活跃

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

20

无

M1AFS600-1FG484K

-55°C ~ 100°C (TJ)

Tray

M1AFS600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

172

不合格

1.5,3.3 V

172

现场可编程门阵列

110592

600000

13824

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

526.32 MHz, 892.86 MHz

有

微芯片技术

90

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

AGL1000V2-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

11000 LE

0 to 70 °C

Tray

AGL1000V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

不合格

1.2 V to 1.5 V

OTHER

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

642 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

27

微芯片技术

Actel

0.014110 oz

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA1000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

2.5 V

30

85 °C

无

APA1000-FG896I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

-40 to 85 °C

Tray

APA1000

e0

3A001.A.7.A

锡铅

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1 mm

unknown

896

S-PBGA-B896

642

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

642

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1000000

STD

56320

1000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

CSP

YES

281-CSP (10x10)

281

SMD/SMT

250 MHz

有

184

微芯片技术

IGLOOe

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL600

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.5 V

未说明

85 °C

无

AGL600V5-CS281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

215 I/O

1.425 V

0 C

+ 70 C

0 to 70 °C

Tray

AGL600V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

281

S-PBGA-B281

不合格

1.5 V

OTHER

30 uA

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

0.71 mm

10 mm

10 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

250 MHz

有

90

Actel

微芯片技术

0.014110 oz

Tray

A54SX72

活跃

2.75 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

30

85 °C

无

A54SX72A-1FG256I

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

203 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tray

A54SX72A

e0

TIN LEAD/TIN LEAD SILVER

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

203

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

203

6036 CLBS, 108000 GATES

1.97 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

256-LBGA

YES

256

256-FPBGA (17x17)

256

微芯片技术

3

PLASTIC/EPOXY

-55 °C

1.5 V

20

1.425 V

100 °C

无

AFS600-1FG256K

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.29

This product may require additional documentation to export from the United States.

N

7000 LE

有

90

Fusion

8542320050, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000

119

Tray

AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

-55°C ~ 100°C (TJ)

Tray

AFS600

e0

Tin/Lead (Sn/Pb)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

OTHER

13.5 kB

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

600000

17 mm

17 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS600-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

网格排列

BGA,

This product may require additional documentation to export from the United States.

N

172 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

60

Fusion

-40°C ~ 100°C (TJ)

Tray

M1AFS600

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

1.0989 GHz

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1.0989 GHz

STD

13824

13824

600000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

有

60

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

活跃

A3PE3000

Tray

1.575 V

FLASH

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

A3PE3000-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

0 to 70 °C

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

272 MHz

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

128 B

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

35000

516096

3000000

272 MHz

1

75264

75264

85 °C

70 °C

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP

YES

352

352-CQFP (75x75)

10.567001 g

352

1

微芯片技术

Actel

0.372740 oz

1.575 V

Tray

AX2000

活跃

GQFF, TPAK352,2.9SQ,20

FLATPACK, GUARD RING

5.3

MICROSEMI CORP

活跃

SQUARE

GQFF

649 MHz

AX2000-CQ352M

无

125 °C

20

1.5 V

-55 °C

TPAK352,2.9SQ,20

CERAMIC, METAL-SEALED COFIRED

Military grade

This product may require additional documentation to export from the United States.

N

198 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

649 MHz

有

-55°C ~ 125°C (TA)

AX2000

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

FLAT

225

0.5 mm

unknown

649 MHz

S-CQFP-F352

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

36 kB

990 ps

990 ps

684

21504 CLBS, 2000000 GATES

2.89 mm

现场可编程门阵列

21504

294912

2000000

649 MHz

32256

MIL-STD-883 Class B

21504

21504

0.99 ns

21504

32256

2000000

2.66 mm

48 mm

48 mm

无

N/A

-

表面贴装

CQFP-256

YES

256-CQFP (75x75)

256

1

Actel

微芯片技术

2.5 V

Tray

A54SX32

活跃

QFF, TPAK256,3SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK256,3SQ,20

-55 °C

2.5 V

20

125 °C

无

A54SX32A-1CQ256M

278 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

249 I/O

2.5 V

- 55 C

+ 125 C

SMD/SMT

278 MHz

-55°C ~ 125°C (TC)

A54SX32A

e0

3A001.A.2.C

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F256

228

不合格

2.5 V

2.5,3.3/5 V

MILITARY

228

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

36 mm

36 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

+ 125 C

SMD/SMT

180 MHz

有

27

微芯片技术

Actel

0.014110 oz

2.7 V

Tray

APA1000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-55 °C

2.5 V

30

125 °C

无

APA1000-FG896M

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

642 I/O

2.3 V

- 55 C

-55°C ~ 125°C (TC)

Tray

APA1000

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B896

642

不合格

2.5 V

2.5,2.5/3.3 V

MILITARY

642

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1000000

56320

1000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

+ 125 C

- 55 C

3 V

57 I/O

微芯片技术

Details

This product may require additional documentation to export from the United States.

5.5 V

Tray

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A40MX04-1PLG68M

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

0.171777 oz

Actel

19

有

160 MHz

SMD/SMT

-55°C ~ 125°C (TC)

Tube

A40MX04

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

MILITARY

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

3.68 mm

24.23 mm

24.23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

有

60

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PE3000-2FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

-40 to 85 °C

Tray

A3PE3000

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

310 MHz

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

有

Tray

M1AFS600

活跃

1.575 V

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS600-2FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

0.014110 oz

Fusion

90

-40°C ~ 100°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

1.47059 GHz

2

13824

600000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

TQFP-100

100-TQFP (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

Details

81 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

有

1452 LAB

90

Actel

0.023175 oz

2.75 V

Tray

A54SX16

活跃

-55°C ~ 125°C (TC)

Tray

A54SX16A

2.25V ~ 5.25V

2.25 V to 5.25 V

24000

1452

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

119

Tray

P1AFS600

活跃

-40°C ~ 100°C (TJ)

Tray

P1AFS600

1.425V ~ 1.575V

110592

600000

2

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

微芯片技术

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

未说明

85 °C

有

A42MX24-2TQG176I

114.75 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.28

Details

150 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

有

40

Actel

5.5 V

Tray

A42MX24

-40°C ~ 85°C (TA)

Tray

A42MX24

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

36000

1.4 mm

24 mm

24 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3P1000

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P1000-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

97 I/O

-40 to 85 °C

Tray

M1A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

256-LBGA

256

256-FPBGA (17x17)

微芯片技术

Tray

AFS1500

活跃

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

119

-55°C ~ 100°C (TJ)

Tray

AFS1500

100 °C

-55 °C

1.425V ~ 1.575V

33.8 kB

276480

1.5e+06

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

27

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

40

70 °C

有

M1A3PE3000-FGG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

620 I/O

0 to 70 °C

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

31 mm

31 mm