N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

270 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

A3PE600-1FGG484

BGA

SQUARE

0°C ~ 85°C (TJ)

Tray

A3PE600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

272 MHz

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

A40MX02-2PLG44

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

34 I/O

3 V

0 C

+ 70 C

SMD/SMT

175 MHz

有

27

Actel

0.084185 oz

5.25 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

0°C ~ 70°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2 ns

295

3000

3.68 mm

16.59 mm

16.59 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

This product may require additional documentation to export from the United States.

Details

100 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

160

Actel

0.014110 oz

2.625 V

Tray

APA450

活跃

BGA, BGA144,12X12,40

网格排列

3

PLASTIC/EPOXY

BGA144,12X12,40

有

APA450-FGG144A

BGA

SQUARE

活跃

MICROSEMI CORP

5.59

-40°C ~ 125°C (TJ)

Tray

APA450

125 °C

-40 °C

8542.39.00.01

CMOS

2.375V ~ 2.625V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B144

100

不合格

2.5 V

2.5,2.5/3.3 V

2.625 V

2.375 V

13.5 kB

100

现场可编程门阵列

110592

450000

180 MHz

STD

12288

12288

1.05 mm

13 mm

13 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

620 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

27

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PE3000-1FGG896I

-40°C ~ 100°C (TJ)

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

MPF100

活跃

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

-

1.03 V/1.08 V

170

Tray

-40°C ~ 100°C (TJ)

Tray

MPF100TS

0.97V ~ 1.08V

109000

7600Kbit

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

PLASTIC/EPOXY

BGA896,30X30,40

2.5 V

40

70 °C

有

APA1000-FGG896

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

642 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

27

Actel

0.014110 oz

2.5000 V

2.3 V

2.7 V

Tray

APA1000

活跃

2.7 V

BGA, BGA896,30X30,40

网格排列

3

0 to 70 °C

Tray

APA1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

250

1 mm

compliant

180 MHz

896

S-PBGA-B896

642

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

2.7 V

2.3 V

24.8 kB

642

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1000000

180 MHz

STD

56320

56320

1000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

微芯片技术

有

125 °C

40

3.3 V

-55 °C

PLASTIC/EPOXY

3

FLATPACK, THIN PROFILE

TQFP,

This product may require additional documentation to export from the United States.

Details

57 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

160 MHz

有

90

Actel

Tray

A40MX02

活跃

5.5 V

5.28

MICROSEMI CORP

活跃

SQUARE

TQFP

92 MHz

A40MX02-1VQG80M

-55°C ~ 125°C (TC)

Tray

A40MX02

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

MILITARY

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2.3 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

SQUARE

BGA

649 MHz

AX2000-FGG896I

有

85 °C

40

1.5 V

-40 °C

This product may require additional documentation to export from the United States.

Details

586 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

649 MHz

有

27

Actel

0.014110 oz

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

5.25

MICROSEMI CORP

活跃

-40°C ~ 85°C (TA)

Tray

AX2000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B896

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

36 kB

990 ps

990 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

649 MHz

32256

21504

21504

0.99 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

2.5 V

40

85 °C

有

A54SX72A-1FGG256I

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

90

Actel

0.014110 oz

Tray

A54SX72

活跃

2.75 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

-40°C ~ 85°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

203

6036 CLBS, 108000 GATES

1.97 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

A3PE3000-FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

0°C ~ 85°C (TJ)

Tray

A3PE3000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

231 MHz

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

231 MHz

STD

75264

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

含铅

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS600-FGG256I

-40°C ~ 100°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

1.0989 GHz

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

1.0989 GHz

STD

13824

600000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

3.3 V

40

85 °C

有

A54SX16P-PQG208I

240 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

175 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

240 MHz

有

24

Actel

3.3, 5 V

2.97, 4.5 V

3.63, 5.5 V

Tray

A54SX16

活跃

3.6 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

-40 to 85 °C

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

3.3 V, 5 V

3.3,3.3/5 V

INDUSTRIAL

175

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

STD

0.9 ns

1452

1452

16000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-536

536-CSPBGA (16x16)

微芯片技术

PolarFire

1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

300 I/O

0.97 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

-40°C ~ 100°C (TJ)

Tray

MPF300T

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

300000

21094400

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

A3PE3000-2FGG484

0 to 70 °C

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.2 V

30

85 °C

无

A3PE3000L-FG896I

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

1.2000 V

1.14 V

This product may require additional documentation to export from the United States.

N

620 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

有

27

ProASIC3

0.014110 oz

1.26 V

1.26 V

Tray

A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

-40 to 85 °C

Tray

A3PE3000L

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.2/1.5,1.2/3.3 V

INDUSTRIAL

1.26 V

1.14 V

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

微芯片技术

5.61

This product may require additional documentation to export from the United States.

N

642 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

27

Actel

0.014110 oz

2.625 V

Tray

APA1000

活跃

BGA, BGA896,30X30,40

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

无

APA1000-FG896A

BGA

SQUARE

活跃

MICROSEMI CORP

-40°C ~ 125°C (TJ)

Tray

APA1000

8542.39.00.01

CMOS

2.375V ~ 2.625V

BOTTOM

BALL

1 mm

unknown

S-PBGA-B896

642

不合格

2.5 V

2.5,2.5/3.3 V

642

现场可编程门阵列

202752

1000000

56320

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

M1A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

40

85 °C

有

M1A3P600L-FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

235 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

有

60

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

-40 to 85 °C

Tray

M1A3P600L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

235

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

235

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

微芯片技术

活跃

MICROSEMI CORP

5.23

Actel

1

有

278 MHz

SMD/SMT

+ 70 C

0 C

2.25 V

174 I/O

N

2.75 V

Tray

A54SX32

活跃

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

2.5 V

70 °C

无

A54SX32A-1CQ208

278 MHz

QFF

SQUARE

0°C ~ 70°C (TA)

A54SX32A

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

0.5 mm

unknown

S-CQFP-F208

174

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

174

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

29.21 mm

29.21 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

72 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

有

16

Actel

0.239083 oz

5.5 V

Tray

A42MX24

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX24-PLG84M

QCCJ

SQUARE

-55°C ~ 125°C (TC)

Tube

A42MX24

e3

3A001.A.2.C

Matte Tin (Sn)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

MILITARY

5.5 V

3 V

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

1410

2.5 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

0.014110 oz

1.575 V

Tray

AX250

活跃

This product may require additional documentation to export from the United States.

N

138 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

763 MHz

有

90

Actel

-55°C ~ 125°C (TA)

Tray

AX250

1.425V ~ 1.575V

1.5 V

55296

250000

4224

1.2 mm

17 mm

17 mm

19 In Stock

-

8 Weeks

Tin

表面贴装

表面贴装

144-LQFP

144

114

0°C~70°C TC

Tray

1997

AT40KAL

e3

yes

活跃

3 (168 Hours)

144

3V~3.6V

QUAD

鸥翼

260

3.3V

0.5mm

100MHz

40

AT40K20

256

不合格

3.3V

1kB

1kB

现场可编程门阵列

1024

8192

30000

1

1520

2.2 ns

20000

20mm

20mm

ROHS3 Compliant

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P600-2FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

235 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

-40 to 85 °C

Tray

A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

310 MHz

2

13824

13824

600000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.19

BGA

N

202 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

151 MHz

有

40

Actel

5.5 V

Tray

A42MX36

活跃

PLASTIC, BGA-272

网格排列

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

85 °C

无

A42MX36-1BG272I

83 MHz

-40°C ~ 85°C (TA)

Tray

A42MX36

e0

锡铅银

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

BOTTOM

BALL

225

1.27 mm

compliant

272

S-PBGA-B272

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

151 MHz

1184

1

1822

2.3 ns

2438

54000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

BGA-536

536-CSPBGA (16x16)

微芯片技术

活跃

1.08 V

This product may require additional documentation to export from the United States.

Details

192000 LE

300 I/O

0.97 V

0 C

+ 100 C

SMD/SMT

有

1

PolarFire

Tray

MPF200

0°C ~ 100°C (TJ)

Tray

MPF200T

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

192000

13619200

4 Transceiver

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

+ 125 C

SMD/SMT

240 MHz

有

24

Actel

SX

125C

PQFP

微芯片技术

24000

-55C to 125C

175

16000

1452

0.35um

3.6/5.25(V)

3.3/5(V)

无

3/4.75(V)

-55C

有

924

528

表面贴装

3.6 V

Tray

A54SX16

活跃

QFP, QFP208,1.2SQ,20

FLATPACK

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

125 °C

有

A54SX16P-PQG208M

207 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.81

This product may require additional documentation to export from the United States.

Details

175 I/O

3 V

- 55 C

-55°C ~ 125°C (TC)

Tray

A54SX16P

3A001.A.2.C

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

0.5 mm

compliant

240(MHz)

208

S-PQFP-G208

175

不合格

3.3 V, 5 V

3.3,3.3/5 V

MILITARY

175

现场可编程门阵列

24000

1452

1452

3.4 mm

28 mm

28 mm