N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

SMD/SMT

175 MHz

有

27

微芯片技术

Actel

0.084185 oz

5.25 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-2PLG44

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

34 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2 ns

295

3000

3.68 mm

16.59 mm

16.59 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

A3PE600-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

270 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

0°C ~ 85°C (TJ)

Tray

A3PE600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

272 MHz

S-PBGA-B484

不合格

COMMERCIAL

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

有

微芯片技术

27

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PE3000-1FGG896I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

620 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

-40°C ~ 100°C (TJ)

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

不合格

INDUSTRIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

180 MHz

2.625 V

Tray

APA450

活跃

BGA, BGA144,12X12,40

网格排列

3

PLASTIC/EPOXY

BGA144,12X12,40

有

APA450-FGG144A

BGA

SQUARE

活跃

MICROSEMI CORP

5.59

This product may require additional documentation to export from the United States.

Details

100 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

0.014110 oz

Actel

160

有

-40°C ~ 125°C (TJ)

Tray

APA450

125 °C

-40 °C

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B144

100

不合格

2.5,2.5/3.3 V

13.5 kB

100

现场可编程门阵列

110592

450000

180 MHz

STD

12288

12288

2.625 V

2.375 V

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

-

1.03 V/1.08 V

170

Tray

MPF100

活跃

-40°C ~ 100°C (TJ)

Tray

MPF100TS

0.97V ~ 1.08V

109000

7600Kbit

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

0 C

+ 70 C

SMD/SMT

180 MHz

有

微芯片技术

27

Actel

0.014110 oz

2.5000 V

2.3 V

2.7 V

Tray

APA1000

活跃

2.7 V

BGA, BGA896,30X30,40

网格排列

3

5.26

MICROSEMI CORP

活跃

SQUARE

BGA

180 MHz

APA1000-FGG896

有

70 °C

40

2.5 V

BGA896,30X30,40

PLASTIC/EPOXY

This product may require additional documentation to export from the United States.

Details

642 I/O

2.3 V

0 to 70 °C

Tray

APA1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

250

1 mm

compliant

180 MHz

S-PBGA-B896

642

不合格

2.5,2.5/3.3 V

COMMERCIAL

24.8 kB

642

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1000000

180 MHz

STD

56320

56320

2.7 V

2.3 V

1000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

- 55 C

+ 125 C

SMD/SMT

160 MHz

有

微芯片技术

90

Actel

Tray

A40MX02

活跃

5.5 V

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A40MX02-1VQG80M

92 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

57 I/O

3 V

-55°C ~ 125°C (TC)

Tray

A40MX02

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

MILITARY

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2.3 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

SMD/SMT

649 MHz

有

微芯片技术

27

Actel

0.014110 oz

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

40

85 °C

有

AX2000-FGG896I

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

586 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 85°C (TA)

Tray

AX2000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B896

684

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

36 kB

990 ps

990 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

649 MHz

32256

21504

21504

0.99 ns

21504

32256

1.575 V

1.425 V

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

90

微芯片技术

Actel

0.014110 oz

Tray

A54SX72

活跃

2.75 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

40

85 °C

有

A54SX72A-1FGG256I

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

2.25 V

-40°C ~ 85°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5,3.3/5 V

INDUSTRIAL

203

6036 CLBS, 108000 GATES

1.97 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

231 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

A3PE3000-FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

A3PE3000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

231 MHz

S-PBGA-B484

341

不合格

1.5/3.3 V

COMMERCIAL

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

231 MHz

STD

75264

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

23 mm

23 mm

无

含铅

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

1098.9 MHz

微芯片技术

有

90

Fusion

1.575 V

Tray

M1AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS600-FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

0.014110 oz

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

1.0989 GHz

S-PBGA-B256

不合格

INDUSTRIAL

13.5 kB

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

1.0989 GHz

STD

13824

1.575 V

1.425 V

600000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

175 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

240 MHz

有

24

微芯片技术

Actel

3.3, 5 V

2.97, 4.5 V

3.63, 5.5 V

Tray

A54SX16

活跃

3.6 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

3.3 V

40

85 °C

有

A54SX16P-PQG208I

240 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

-40 to 85 °C

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

3.3,3.3/5 V

INDUSTRIAL

175

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

STD

0.9 ns

1452

1452

16000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-536

536-CSPBGA (16x16)

微芯片技术

Details

This product may require additional documentation to export from the United States.

300000 LE

300 I/O

0.97 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.08 V

Tray

MPF300

活跃

-40°C ~ 100°C (TJ)

Tray

MPF300T

1 V, 1.05 V

12.5 Gb/s

300000

21094400

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

A3PE3000-2FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

0 to 70 °C

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

This product may require additional documentation to export from the United States.

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

有

微芯片技术

27

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.2 V

30

85 °C

无

A3PE3000L-FG896I

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

1.14 V

620 I/O

N

-40 to 85 °C

Tray

A3PE3000L

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

620

不合格

1.2/1.5,1.2/3.3 V

INDUSTRIAL

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

1.26 V

1.14 V

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

有

60

ProASIC3

0.014110 oz

This product may require additional documentation to export from the United States.

微芯片技术

Details

235 I/O

1.14 V

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

40

85 °C

有

M1A3P600L-FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

-40 to 85 °C

Tray

M1A3P600L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

235

不合格

1.5/3.3 V

INDUSTRIAL

235

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

有

微芯片技术

27

Actel

0.014110 oz

2.625 V

Tray

APA1000

活跃

BGA, BGA896,30X30,40

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

无

APA1000-FG896A

BGA

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

N

642 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

-40°C ~ 125°C (TJ)

Tray

APA1000

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

1 mm

unknown

S-PBGA-B896

642

不合格

2.5,2.5/3.3 V

642

现场可编程门阵列

202752

1000000

56320

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

138 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

763 MHz

有

90

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

-55°C ~ 125°C (TA)

Tray

AX250

1.5 V

55296

250000

4224

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

有

1

微芯片技术

Actel

2.75 V

Tray

A54SX32

活跃

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

2.5 V

70 °C

无

A54SX32A-1CQ208

278 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.23

N

174 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

278 MHz

0°C ~ 70°C (TA)

A54SX32A

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

FLAT

0.5 mm

unknown

S-CQFP-F208

174

不合格

2.5,3.3/5 V

COMMERCIAL

174

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

29.21 mm

29.21 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

Actel

0.239083 oz

5.5 V

Tray

A42MX24

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX24-PLG84M

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

72 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

有

16

-55°C ~ 125°C (TC)

Tube

A42MX24

e3

3A001.A.2.C

Matte Tin (Sn)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

MILITARY

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

1410

2.5 ns

1890

5.5 V

3 V

36000

3.68 mm

29.31 mm

29.31 mm

无

26 In Stock

-

8 Weeks

Tin

表面贴装

表面贴装

144-LQFP

144

114

0°C~70°C TC

Tray

1997

AT40KAL

e3

yes

活跃

3 (168 Hours)

144

3.3V

QUAD

鸥翼

260

0.5mm

100MHz

40

AT40K20

256

不合格

1kB

1kB

现场可编程门阵列

1024

8192

30000

1

1520

2.2 ns

20000

20mm

20mm

ROHS3 Compliant

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

3 V

202 I/O

微芯片技术

N

5.5 V

Tray

A42MX36

活跃

PLASTIC, BGA-272

网格排列

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

85 °C

无

A42MX36-1BG272I

83 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.19

BGA

Actel

40

有

151 MHz

SMD/SMT

+ 85 C

- 40 C

-40°C ~ 85°C (TA)

Tray

A42MX36

e0

锡铅银

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

BOTTOM

BALL

225

1.27 mm

compliant

S-PBGA-B272

不合格

INDUSTRIAL

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

151 MHz

1184

1

1822

2.3 ns

2438

5.5 V

3 V

54000

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

5.24

MICROSEMI CORP

活跃

SQUARE

BGA

350 MHz

A3P600-2FGG484I

有

100 °C

40

1.5 V

-40 °C

PLASTIC/EPOXY

3

This product may require additional documentation to export from the United States.

Details

235 I/O

1.425 V

-40 to 85 °C

Tray

A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

310 MHz

2

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

BGA-536

536-CSPBGA (16x16)

微芯片技术

This product may require additional documentation to export from the United States.

Details

192000 LE

300 I/O

0.97 V

0 C

+ 100 C

SMD/SMT

有

1

PolarFire

Tray

MPF200

活跃

1.08 V

0°C ~ 100°C (TJ)

Tray

MPF200T

1 V, 1.05 V

12.5 Gb/s

192000

13619200

4 Transceiver

N/A

-

表面贴装

QFN EP

YES

68-QFN (8x8)

68

+ 70 C

- 20 C

1.425 V

49 I/O

微芯片技术

Details

Tray

A3PN015

活跃

1.575 V

8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

LCC68,.32SQ,16

-20 °C

1.5 V

30

70 °C

有

A3PN015-1QNG68

HVQCCN

SQUARE

活跃

MICROSEMI CORP

5.26

ProASIC3 nano

260

有

350 MHz

SMD/SMT

-20°C ~ 85°C (TJ)

Tray

A3PN015

8542.39.00.01

CMOS

1.5 V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

49

不合格

1.5,1.5/3.3 V

OTHER

1 mA

49

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

15000

1

384

384

15000

0.88 mm

8 mm

8 mm