N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

Details

-40°C ~ 85°C (TA)

Tray

M7AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

STD

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

60

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P1000-FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.48

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

-40 to 85 °C

Tray

M1A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

BGA-536

536-CSPBGA (16x16)

微芯片技术

This product may require additional documentation to export from the United States.

Details

300000 LE

300 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

-40°C ~ 100°C (TJ)

Tray

MPF300TS

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

400-LFBGA

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

90

IGLOO2

207

Tray

M2GL050

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

有

90

微芯片技术

Actel

Tray

A40MX04

活跃

5.5 V

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A40MX04-1VQG80M

48 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

69 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

160 MHz

-55°C ~ 125°C (TC)

Tray

A40MX04

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

MILITARY

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2.3 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (27X27)

484

SMD/SMT

250 MHz

有

40

微芯片技术

Actel

0.014110 oz

Tray

A54SX72

活跃

2.75 V

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-55 °C

2.5 V

20

125 °C

无

A54SX72A-1FG484M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

360 I/O

2.25 V

- 55 C

+ 125 C

-55°C ~ 125°C (TC)

Tray

A54SX72A

e0

3A001.A.2.C

锡铅

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

360

不合格

2.5 V

2.5,3.3/5 V

MILITARY

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

微芯片技术

A42MX36

Obsolete

BGA,

网格排列

3

PLASTIC/EPOXY

3.3 V

30

70 °C

无

A42MX36-FBG272

44 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.19

BGA

N

202 I/O

3 V

0 C

+ 70 C

SMD/SMT

79 MHz

有

40

Actel

5.25 V

Tray

0°C ~ 70°C (TA)

Tray

A42MX36

e0

锡铅银

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

225

1.27 mm

compliant

272

S-PBGA-B272

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

79 MHz

1184

1822

3.8 ns

2438

54000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Details

11000 LE

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

144 kbit

144 kbit

微芯片技术

272 MHz

有

-

24

147456 bit

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P1000-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

A3P1000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

8 mA

700 Mb/s

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-325

325-FCBGA (11x14.5)

微芯片技术

1.03 V/1.08 V

170

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

0°C ~ 100°C (TJ)

Tray

MPF200TL

0.97V ~ 1.08V

1.05 V

192000

13619200

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

微芯片技术

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

有

M1AGL1000V5-CSG281I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

SMD/SMT

有

184

IGLOOe

1.5000 V

215

Tray

M1AGL1000

活跃

-40 to 85 °C

Tray

M1AGL1000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

0.5 mm

compliant

S-PBGA-B281

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1e+06

STD

24576

1000000

10 mm

10 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

ProASIC3

- 40 C

+ 85 C

SMD/SMT

微芯片技术

272 MHz

有

-

1.575 V

Tray

A3P060

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P060-1VQG100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.23

Details

660 LE

71 I/O

1.425 V

90

18432 bit

-40°C ~ 100°C (TJ)

Tray

A3P060

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

15 mA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

1

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

272 MHz

有

60

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M7A3P1000-1FG484I

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40 to 85 °C

Tray

M7A3P1000

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

272 MHz

1

24576

24576

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

+ 70 C

SMD/SMT

231 MHz

0.014110 oz

ProASIC3

微芯片技术

90

有

1.5000 V

1.425 V

1.575 V

Tray

M1A3P1000

活跃

1.575 V

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P1000-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

0 C

0 to 70 °C

Tray

M1A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

微芯片技术

2.5 V

Tray

5962-0151801

活跃

GQFF,

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

2.5 V

125 °C

5962-0151801QYC

GQFF

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

This product may require additional documentation to export from the United States.

N

174 I/O

2.5 V

- 55 C

+ 125 C

SMD/SMT

238 MHz

有

1

Actel

-55°C ~ 125°C (TJ)

SX-A

e4

3A001.A.2.C

GOLD

2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F208

Qualified

2.5 V

MILITARY

32000 GATES

3.22 mm

现场可编程门阵列

48000

2880

MIL-PRF-38535 Class Q

32000

29.21 mm

29.21 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

172 I/O

1.425 V

0 C

0.014110 oz

Fusion

60

有

1282.05 MHz

SMD/SMT

+ 70 C

1.575 V

Tray

M7AFS600

活跃

N

0°C ~ 70°C (TA)

Tray

M7AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

1

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

5.5 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX24-2PQG160I

114.75 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

1.57

Details

125 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

有

24

Actel

0.196363 oz

Tray

A42MX24

活跃

-40°C ~ 85°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

SMD/SMT

310 MHz

有

60

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

Tray

M1A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P1000-2FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

- 40 C

+ 85 C

-40 to 85 °C

Tray

M1A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

24

Actel

微芯片技术

3.6 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

3.3 V

40

85 °C

有

A54SX32-1PQG208I

280 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

174 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

280 MHz

有

-40°C ~ 85°C (TA)

Tray

A54SX32

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

3.3 V, 5 V

3.3,5 V

INDUSTRIAL

174

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

160

微芯片技术

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGL250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

M1AGL250V2-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

3000 LE

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

有

0 to 70 °C

Tray

M1AGL250V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.2 V to 1.5 V

OTHER

1.575 V

1.14 V

4.5 kB

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

84

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PE3000-1FGG324I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

221 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

-40 to 85 °C

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

272 MHz

S-PBGA-B324

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

25 mA

63 kB

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-CQFP (75x75)

208

微芯片技术

Tray

5962-9958501

活跃

5.25 V

GQFF,

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

125 °C

5962-9958501QYC

GQFF

SQUARE

活跃

MICROSEMI CORP

5.24

Military grade

This product may require additional documentation to export from the United States.

N

176 I/O

4.75 V

- 55 C

+ 125 C

SMD/SMT

79 MHz, 131 MHz

有

1

Actel

-55°C ~ 125°C (TJ)

MX

e4

3A001.A.2.C

GOLD

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F208

Qualified

3.3 V, 5 V

MILITARY

36000 GATES

3.18 mm

现场可编程门阵列

2560

54000

MIL-PRF-38535 Class Q

36000

29.21 mm

29.21 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

+ 125 C

- 55 C

1.425 V

97 I/O

微芯片技术

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

M1A3P1000

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-55 °C

1.5 V

30

125 °C

无

M1A3P1000-1FG144M

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

0.014110 oz

ProASIC3

160

有

350 MHz

SMD/SMT

-55°C ~ 125°C (TJ)

Tray

M1A3P1000

e0

3A001.A.2.C

锡铅银

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.5 V

1.5,1.5/3.3 V

MILITARY

8 mA

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

BGA-536

536-CSPBGA (16x16)

微芯片技术

Details

192000 LE

300 I/O

0.97 V

- 40 C

+ 100 C

SMD/SMT

有

1

PolarFire

1.08 V

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

MPF200T

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

192000

13619200

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

活跃

5.5 V

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX36-1PQG208I

83 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

176 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

151 MHz

有

24

Actel

Tray

A42MX36

-40°C ~ 85°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

151 MHz

1184

1

1822

2.3 ns

2438

54000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

Tray

M2GL025

活跃

1.2 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL025TS-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

27696 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

IGLOO2

60

有

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

138 kB

267

2.44 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

23 mm

23 mm