品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||||||||||||||||||||||||||||||||||||||||
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![]() | A54SX08A-TQG100I | Microchip Technology | 数据表 | 21 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-100 | 100-TQFP (14x14) | 微芯片技术 | Details | 512 LE | 81 I/O | 2.25 V | - 40 C | + 85 C | SMD/SMT | 238 MHz | 有 | 90 | Actel | 0.023175 oz | Tray | A54SX08 | 活跃 | 5.25 V | -40°C ~ 85°C (TA) | Tray | A54SX08A | 2.25V ~ 5.25V | 2.5 V | - | 12000 | 768 | STD | - | 1.4 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010TS-1FG484M | Microchip Technology | 数据表 | 2815 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | - 55 C | + 125 C | SMD/SMT | 有 | 微芯片技术 | 60 | IGLOO2 | 1.2 V | Tray | M2GL010 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.2 V | 20 | 125 °C | 无 | M2GL010TS-1FG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | This product may require additional documentation to export from the United States. | N | 12084 LE | 233 I/O | 1.2 V | -55°C ~ 125°C (TJ) | Tray | M2GL010TS | 3A001.A.2.C | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 1.2 V | MILITARY | 233 | 2.44 mm | 现场可编程门阵列 | 12084 | 933888 | 4 Transceiver | 12084 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300T-FCG1152E | Microchip Technology | 数据表 | 2595 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-1152 | 1152-FCBGA (35x35) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 300000 LE | 512 I/O | 0.97 V | 0 C | + 100 C | SMD/SMT | 有 | 1 | 20.6 Mbit | PolarFire | 1.08 V | Tray | MPF300 | 活跃 | 0°C ~ 100°C (TJ) | Tray | MPF300T | 0.97V ~ 1.08V | 1 V, 1.05 V | 12.5 Gb/s | 300000 | 21094400 | 16 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000-FGG896I | Microchip Technology | 数据表 | 679 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | - 40 C | + 85 C | SMD/SMT | 231 MHz | 有 | 微芯片技术 | 27 | 0.014110 oz | ProASIC3 | 1.5000 V | 1.425 V | 1.575 V | Tray | A3PE3000 | 活跃 | 1.575 V | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | -40 °C | 1.5 V | 40 | 85 °C | 有 | A3PE3000-FGG896I | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | Details | 620 I/O | 1.425 V | -40 to 85 °C | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 231 MHz | 896 | S-PBGA-B896 | 620 | 不合格 | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | 现场可编程门阵列 | 516096 | 3000000 | 231 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | 无 | |||||||||||||||||||||
![]() | A54SX72A-1FGG256M | Microchip Technology | 数据表 | 827 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | 2.25 V | - 55 C | + 125 C | SMD/SMT | 250 MHz | 有 | 微芯片技术 | 90 | Actel | 0.014110 oz | 2.75 V | Tray | A54SX72 | 活跃 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -55 °C | 2.5 V | 30 | 125 °C | 有 | A54SX72A-1FGG256M | 250 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | Details | 203 I/O | -55°C ~ 125°C (TC) | Tray | A54SX72A | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 203 | 不合格 | 2.5 V | 2.5,2.5/5 V | MILITARY | 203 | 6036 CLBS, 108000 GATES | 1.97 mm | 现场可编程门阵列 | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||
![]() | A42MX36-3BG272 | Microchip Technology | 数据表 | 853 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | BGA-272 | YES | 272 | 272-PBGA (27x27) | 272 | 微芯片技术 | Actel | 5.25 V | Tray | A42MX36 | Obsolete | PLASTIC, BGA-272 | 网格排列 | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 70 °C | 无 | A42MX36-3BG272 | 100 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.2 | BGA | N | 202 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 180 MHz | 有 | 40 | 0°C ~ 70°C (TA) | Tray | A42MX36 | e0 | 锡铅银 | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 225 | 1.27 mm | compliant | 272 | S-PBGA-B272 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | 现场可编程门阵列 | 1184 | 2560 | 54000 | 180 MHz | 1184 | 3 | 1822 | 1.9 ns | 2438 | 54000 | 1.73 mm | 27 mm | 27 mm | 无 | |||||||||||||||||||||||||||||
![]() | A40MX04-PLG44M | Microchip Technology | 数据表 | 2335 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PLCC-44 | YES | 44-PLCC (16.59x16.59) | 44 | - 55 C | + 125 C | SMD/SMT | 139 MHz | 有 | 微芯片技术 | 27 | Actel | 0.084185 oz | 5.5 V | Tray | A40MX04 | 活跃 | ROHS COMPLIANT, PLASTIC, LCC-44 | CHIP CARRIER | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 40 | 125 °C | 有 | A40MX04-PLG44M | 80 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 1.56 | This product may require additional documentation to export from the United States. | Details | 34 I/O | 3 V | -55°C ~ 125°C (TC) | Tube | A40MX04 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J44 | 不合格 | 3.3 V, 5 V | MILITARY | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 2.7 ns | 547 | 6000 | 3.68 mm | 16.59 mm | 16.59 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-3BGG272 | Microchip Technology | 数据表 | 875 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | BGA-272 | YES | 272 | 272-PBGA (27x27) | 272 | 微芯片技术 | 5.25 V | Tray | A42MX36 | Obsolete | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX36-3BGG272 | 100 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | Details | 202 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 180 MHz | 有 | 40 | Actel | 0°C ~ 70°C (TA) | Tray | A42MX36 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 250 | 1.27 mm | compliant | S-PBGA-B272 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | 现场可编程门阵列 | 1184 | 2560 | 54000 | 180 MHz | 1184 | 3 | 1822 | 1.9 ns | 2438 | 54000 | 1.73 mm | 27 mm | 27 mm | 无 | |||||||||||||||||||||||||||||||
![]() | MPF100T-FCVG484E | Microchip Technology | 数据表 | 2543 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FPBGA (19x19) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 109000 LE | 284 I/O | 970 mV/1.02 V | 0 C | + 100 C | SMD/SMT | 7.6 Mbit | 有 | 1 | PolarFire | Tray | MPF100 | 活跃 | 1.03 V/1.08 V | 0°C ~ 100°C (TJ) | Tray | MPF100T | 0.97V ~ 1.08V | 1 V, 1.05 V | 12.7 Gb/s | 109000 | 7782400 | 4 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX72A-2FGG256 | Microchip Technology | 数据表 | 2420 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | SMD/SMT | 294 MHz | 有 | 90 | 微芯片技术 | Actel | 0.014110 oz | 2.75 V | Tray | A54SX72 | 活跃 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 2.5 V | 40 | 70 °C | 有 | A54SX72A-2FGG256 | 294 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | Details | 203 I/O | 2.25 V | 0 C | + 70 C | 0°C ~ 70°C (TA) | Tray | A54SX72A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 203 | 不合格 | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 203 | 6036 CLBS, 108000 GATES | 1.97 mm | 现场可编程门阵列 | 108000 | 6036 | 1.1 ns | 6036 | 6036 | 108000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-2TQG176 | Microchip Technology | 数据表 | 2298 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | TQFP-176 | YES | 176 | 176-TQFP (24x24) | 176 | 微芯片技术 | 5.25 V | Tray | A42MX16 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-2TQG176 | 117 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | Details | 140 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 215 MHz | 有 | 40 | Actel | 0°C ~ 70°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 1232 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 608 | 24000 | 215 MHz | 608 | 2 | 928 | 2.1 ns | 1232 | 1232 | 24000 | 1.4 mm | 24 mm | 24 mm | 无 | ||||||||||||||||||||||||||||||||
![]() | AFS600-FGG256K | Microchip Technology | 数据表 | 922 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | AFS600 | 活跃 | This product may require additional documentation to export from the United States. | Details | 7000 LE | 有 | 90 | Fusion | 119 | Tray | -55°C ~ 100°C (TJ) | Tray | AFS600 | 1.425V ~ 1.575V | 110592 | 600000 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | U1AFS1500-FG256I | Microchip Technology | 数据表 | 871 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | U1AFS1500-FG256I | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | This product may require additional documentation to export from the United States. | N | 有 | 90 | Fusion | 119 | Tray | U1AFS1500 | 活跃 | LBGA, | -40°C ~ 100°C (TJ) | Tray | U1AFS1500 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 不合格 | INDUSTRIAL | 38400 CLBS, 1500000 GATES | 1.68 mm | 现场可编程门阵列 | 276480 | 1500000 | STD | 38400 | 1500000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005S-1VFG256T2 | Microchip Technology | 数据表 | 5000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFBGA-256 | 256-FPBGA (14x14) | 微芯片技术 | Tray | M2GL005 | 活跃 | , | 未说明 | 有 | M2GL005S-1VFG256T2 | 活跃 | MICROSEMI CORP | 5.81 | Details | 6060 LE | 161 I/O | 1.14 V | - 40 C | + 125 C | SMD/SMT | 有 | 119 | IGLOO2 | 0.126568 oz | 1.26 V | -40°C ~ 125°C (TJ) | Tray | M2GL005S | 有 | 1.14V ~ 2.625V | 未说明 | compliant | 1.2 V | - | 现场可编程门阵列 | 6060 | 719872 | 1 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005S-FG484I | Microchip Technology | 数据表 | 40 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 1.26 V | 209 | Tray | M2GL005 | 活跃 | This product may require additional documentation to export from the United States. | N | 1.14 V | 有 | 60 | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL005S | 1.14V ~ 2.625V | 6060 | 719872 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-PLG68M | Microchip Technology | 数据表 | 2835 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | - 55 C | + 125 C | SMD/SMT | 139 MHz | 有 | 微芯片技术 | 19 | Actel | 0.171777 oz | Tray | A40MX04 | 活跃 | 5.5 V | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 40 | 125 °C | 有 | A40MX04-PLG68M | 80 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.28 | This product may require additional documentation to export from the United States. | Details | 57 I/O | 3 V | -55°C ~ 125°C (TC) | Tube | A40MX04 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | 不合格 | 3.3 V, 5 V | MILITARY | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 2.7 ns | 547 | 6000 | 3.68 mm | 24.23 mm | 24.23 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | AT6002-2AI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-TQFP (14x14) | 80 | -40°C~85°C TC | Tray | 1999 | AT6000(LV) | Obsolete | 3 (168 Hours) | 85°C | -40°C | 4.5V~5.5V | AT6002 | 5V | 1024 | 6000 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16P-1TQG176I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-176 | YES | 176-TQFP (24x24) | 176 | 40 | A54SX16 | 3 | A54SX16P-1TQG176I | 微芯片技术 | 280 MHz | MICROSEMI CORP | Details | 147 I/O | 3 V | Actel | Tray | 活跃 | 3.6 V | 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | QFP176,1.0SQ,20 | -40 °C | 3.3 V | 40 | 85 °C | 有 | LFQFP | SQUARE | 活跃 | 5.25 | - 40 C | + 85 C | SMD/SMT | 280 MHz | 有 | -40°C ~ 85°C (TA) | Tray | A54SX16P | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 147 | 不合格 | 3.3 V, 5 V | 3.3,3.3/5 V | INDUSTRIAL | 147 | 1452 CLBS, 16000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 1452 | 0.8 ns | 1452 | 1452 | 16000 | 1.4 mm | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||||||
![]() | M7AFS600-FG256I | Microchip Technology | 数据表 | 2271 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | 1098.9 MHz | 有 | 90 | 微芯片技术 | Fusion | 0.014110 oz | 1.575 V | Tray | M7AFS600 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 85 °C | 无 | M7AFS600-FG256I | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | N | 119 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | -40°C ~ 85°C (TA) | Tray | M7AFS600 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 不合格 | 1.5 V | INDUSTRIAL | 600000 GATES | 1.7 mm | 现场可编程门阵列 | 110592 | 600000 | 600000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M7AFS600-FG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | 484-FPBGA (23x23) | 微芯片技术 | N | 172 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 1098.9 MHz | 有 | 60 | Fusion | 0.014110 oz | Tray | M7AFS600 | 活跃 | 1.575 V | -40°C ~ 85°C (TA) | Tray | M7AFS600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | STD | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P1000-2FG484 | Microchip Technology | 数据表 | 2875 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 484-FPBGA (23x23) | 484 | 0 C | + 70 C | SMD/SMT | 310 MHz | 有 | 微芯片技术 | 60 | ProASIC3 | 0.014110 oz | 1.5000 V | Tray | M1A3P1000 | 活跃 | 1.575 V | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 85 °C | 无 | M1A3P1000-2FG484 | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | N | 300 I/O | 1.425 V | 0 to 70 °C | Tray | M1A3P1000 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 不合格 | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 147456 | 1000000 | 2 | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16-1TQG176 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-176 | YES | 176-TQFP (24x24) | 176 | 280 MHz | 有 | 40 | 微芯片技术 | Actel | 3.6 V | Tray | A54SX16 | 活跃 | LFQFP, QFP176,1.0SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | 3.3 V | 40 | 70 °C | 有 | A54SX16-1TQG176 | 280 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | Details | 147 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 0°C ~ 70°C (TA) | Tray | A54SX16 | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 147 | 不合格 | 3.3 V, 5 V | 3.3,5 V | COMMERCIAL | 147 | 1452 CLBS, 16000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 1452 | 0.8 ns | 1452 | 1452 | 16000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | A54SX72A-2FGG484 | Microchip Technology | 数据表 | 2359 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 484-FPBGA (27X27) | 484 | Actel | 0.014110 oz | 0 C | 2.25 V | 微芯片技术 | 360 I/O | Details | Tray | A54SX72 | 活跃 | 2.75 V | BGA, BGA484,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,26X26,40 | 2.5 V | 40 | 70 °C | 有 | A54SX72A-2FGG484 | 294 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | + 70 C | SMD/SMT | 294 MHz | 有 | 40 | 0°C ~ 70°C (TA) | Tray | A54SX72A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 360 | 不合格 | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 360 | 6036 CLBS, 108000 GATES | 2.44 mm | 现场可编程门阵列 | 108000 | 6036 | 1.1 ns | 6036 | 6036 | 108000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||
![]() | M1A3P1000-2FG144I | Microchip Technology | 数据表 | 2933 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 144-FPBGA (13x13) | 144 | 310 MHz | SMD/SMT | + 85 C | - 40 C | 1.425 V | 微芯片技术 | 97 I/O | N | This product may require additional documentation to export from the United States. | 1.575 V | Tray | M1A3P1000 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 无 | M1A3P1000-2FG144I | 350 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 0.014110 oz | ProASIC3 | 160 | 有 | -40°C ~ 100°C (TJ) | Tray | M1A3P1000 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 不合格 | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | 现场可编程门阵列 | 147456 | 1000000 | 2 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P600-FGG484I | Microchip Technology | 数据表 | 2832 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 484-FPBGA (23x23) | 484 | 235 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 231 MHz | 有 | 微芯片技术 | 60 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | M1A3P600 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | M1A3P600-FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | Details | -40 to 85 °C | Tray | M1A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 不合格 | 1.5 V | INDUSTRIAL | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 110592 | 600000 | STD | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm |
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