N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

SMD/SMT

781.25 MHz

有

84

微芯片技术

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3PE3000

活跃

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.2 V

40

70 °C

有

A3PE3000L-FGG324

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

221 I/O

1.14 V

0 C

+ 70 C

0 to 70 °C

Tray

A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.5 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

400

400-VFBGA (17x17)

微芯片技术

有

Details

This product may require additional documentation to export from the United States.

207

Tray

M2GL050

活跃

90

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL050T

100 °C

-40 °C

1.14V ~ 2.625V

228.3 kB

56340

1869824

1

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

This product may require additional documentation to export from the United States.

Details

35000 LE

147 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

504 kbit

350 MHz

微芯片技术

3500 LAB

24

ProASIC3

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3PE3000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.2 V

40

85 °C

有

M1A3PE3000L-1PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.6

-40 to 85 °C

Tray

M1A3PE3000L

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

25 mA

700 Mb/s

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

119

Tray

U1AFS1500

活跃

-40°C ~ 100°C (TJ)

Tray

U1AFS1500

1.425V ~ 1.575V

276480

1500000

STD

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

BGA, BGA324,18X18,40

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

-40 °C

1.5 V

30

1.425 V

85 °C

无

M1A3PE3000-1FG324I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

有

84

ProASIC3

221

Tray

M1A3PE3000

活跃

-40°C ~ 100°C (TJ)

Tray

M1A3PE3000

e0

锡铅银

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

221

不合格

1.5/3.3 V

INDUSTRIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.5 V

30

1.425 V

70 °C

无

M1A3PE3000-2FG324

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

有

84

ProASIC3

221

Tray

M1A3PE3000

活跃

BGA, BGA324,18X18,40

0°C ~ 85°C (TJ)

Tray

M1A3PE3000

e0

锡铅银

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

221

不合格

1.5/3.3 V

COMMERCIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

1.425 V

177 I/O

N

This product may require additional documentation to export from the United States.

微芯片技术

ProASIC3

0.014110 oz

1.575 V

Tray

A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P600-1FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

90

有

272 MHz

SMD/SMT

+ 70 C

0 C

0°C ~ 85°C (TJ)

Tray

A3P600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

+ 85 C

SMD/SMT

231 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P1000-FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

有

160

微芯片技术

ProASIC3

0.014110 oz

1.575 V

Tray

M7A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M7A3P1000-FG144I

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

-40°C ~ 100°C (TJ)

Tray

M7A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

90

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P1000-2FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

177 I/O

0 to 70 °C

Tray

M1A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M7A3P1000

活跃

1.575 V

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

231 MHz

STD

24576

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

310 MHz

有

60

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

M7A3P1000-2FG484

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

0 C

+ 70 C

0 to 70 °C

Tray

M7A3P1000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

310 MHz

2

24576

24576

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

有

40

Actel

微芯片技术

3.6 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

3.3 V

40

70 °C

有

A54SX16-TQG176

240 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

147 I/O

3 V

0 C

+ 70 C

SMD/SMT

240 MHz

0°C ~ 70°C (TA)

Tray

A54SX16

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

147

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

24000

1452

0.9 ns

1452

1452

16000

1.4 mm

24 mm

24 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

微芯片技术

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

LFQFP

105 MHz

A42MX24-2TQG176

有

70 °C

40

3.3 V

PLASTIC/EPOXY

3

FLATPACK, LOW PROFILE, FINE PITCH

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

Details

150 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

40

Actel

5.25 V

Tray

A42MX24

0°C ~ 70°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

36000

1.4 mm

24 mm

24 mm

无

N/A

-

表面贴装

表面贴装

FBGA

144

144-FPBGA (13x13)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.425V ~ 1.575V

310 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

310 MHz

2

24576

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

160 MHz

有

19

Actel

微芯片技术

0.171777 oz

Tray

A40MX04

活跃

5.5 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX04-1PLG68I

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

57 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P400-1FGG256I

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

90

ProASIC3

178

Tray

M1A3P400

活跃

-40°C ~ 100°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

24

IGLOO2

574

Tray

M2GL150

活跃

0°C ~ 85°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

TQFP-100

100-TQFP (14x14)

微芯片技术

Details

81 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

227 MHz

有

90

Actel

0.023175 oz

2.75 V

Tray

A54SX16

活跃

-40°C ~ 125°C (TA)

Tray

A54SX16A

2.25V ~ 5.25V

2.5 V

24000

1452

STD

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

有

27

Actel

微芯片技术

3.6 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

3.3 V

30

70 °C

无

A54SX32-1BG329

280 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

249 I/O

3 V

0 C

+ 70 C

SMD/SMT

280 MHz

0°C ~ 70°C (TA)

Tray

A54SX32

e0

锡铅

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

114 I/O

1.425 V

0 C

微芯片技术

+ 70 C

SMD/SMT

1.575 V

Tray

M1AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS250-1FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

1282.05 MHz

有

90

Fusion

0.014110 oz

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

M1AFS250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

5.5 V

Tray

A42MX24

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX24-PQG160M

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

125 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

有

24

Actel

0.196363 oz

-55°C ~ 125°C (TC)

Tray

A42MX24

e3

3A001.A.2.C

Matte Tin (Sn)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

MILITARY

5.5 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

1410

2.5 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

- 55 C

+ 125 C

SMD/SMT

250 MHz

有

90

微芯片技术

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-55 °C

2.5 V

20

125 °C

无

A54SX72A-1FG256M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

203 I/O

2.25 V

-55°C ~ 125°C (TC)

Tray

A54SX72A

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

203

不合格

2.5 V

2.5,2.5/5 V

MILITARY

203

6036 CLBS, 108000 GATES

1.97 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

256-LBGA

256

256-FPBGA (17x17)

微芯片技术

119

FLASH

Tray

AFS1500

活跃

LBGA,

无

AFS1500-FG256K

活跃

MICROSEMI CORP

This product may require additional documentation to export from the United States.

N

有

90

Fusion

-55°C ~ 100°C (TJ)

Tray

AFS1500

100 °C

-55 °C

8542.39.00.01

1.425V ~ 1.575V

unknown

3.63 V

1.425 V

1 MB

33.8 kB

276480

1.5e+06

1.7 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

1.425 V

- 55 C

+ 125 C

SMD/SMT

649 MHz

有

60

微芯片技术

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.5 V

40

125 °C

有

AX250-FGG484M

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

Military grade

This product may require additional documentation to export from the United States.

Details

248 I/O

-55°C ~ 125°C (TA)

Tray

AX250

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

248

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

248

2816 CLBS, 250000 GATES

2.44 mm

现场可编程门阵列

55296

250000

4224

MIL-STD-883 Class B

0.99 ns

2816

4224

250000

1.73 mm

23 mm

23 mm