N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

125 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

172 MHz

微芯片技术

有

24

Actel

0.196363 oz

5.5 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX16-PQG160M

94 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

1.53

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A42MX16

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

MILITARY

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.8 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

表面贴装

FBGA

144

144-FPBGA (13x13)

400.011771 mg

微芯片技术

M7A3P1000

活跃

1.575 V

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.425V ~ 1.575V

272 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

272 MHz

1

24576

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

133 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

348

IGLOOe

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL125

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.5 V

未说明

85 °C

无

AGL125V5-CS196

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

1500 LE

0 to 70 °C

Tray

AGL125V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B196

不合格

1.5 V

OTHER

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

0.7 mm

8 mm

8 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P1000-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

0 to 70 °C

Tray

M1A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

+ 100 C

SMD/SMT

微芯片技术

有

176

IGLOO2

Tray

M2GL025

活跃

1.2 V

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL025TS-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

27696

1130496

2 Transceiver

27696

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

649 MHz

SMD/SMT

+ 125 C

- 55 C

微芯片技术

1.425 V

516 I/O

N

This product may require additional documentation to export from the United States.

Tray

AX1000

活跃

1.575 V

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-55 °C

1.5 V

30

125 °C

无

AX1000-FG896M

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

Military grade

0.014110 oz

Actel

27

有

-55°C ~ 125°C (TA)

Tray

AX1000

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

649 MHz

S-PBGA-B896

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

MIL-STD-883 Class B

12096

12096

0.99 ns

12096

18144

1000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

248 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

763 MHz

微芯片技术

有

60

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.5 V

40

125 °C

有

AX250-1FGG484M

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

-55°C ~ 125°C (TA)

Tray

AX250

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

248

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

248

2816 CLBS, 250000 GATES

2.44 mm

现场可编程门阵列

55296

250000

4224

MIL-STD-883 Class B

0.84 ns

2816

4224

250000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

34 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

139 MHz

微芯片技术

有

27

Actel

0.084185 oz

Tray

A40MX02

活跃

5.5 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A40MX02-PLG44M

80 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tube

A40MX02

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

3.3 V, 5 V

MILITARY

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.7 ns

295

3000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

57 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

139 MHz

微芯片技术

有

19

Actel

0.171777 oz

Tray

A40MX02

活跃

5.5 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A40MX02-PLG68M

80 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tube

A40MX02

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

MILITARY

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.7 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

This product may require additional documentation to export from the United States.

Details

500000 LE

388 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

480 MHz

有

1

PolarFire

1.03 V/1.08 V

Tray

MPF500

活跃

0°C ~ 100°C (TJ)

Tray

MPF500T

0.97V ~ 1.08V

1.05 V

481000

33792000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

有

微芯片技术

40

Actel

5.5 V

Tray

A42MX36

Obsolete

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX36-1BGG272I

83 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Details

202 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

151 MHz

-40°C ~ 85°C (TA)

Tray

A42MX36

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B272

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

151 MHz

1184

1

1822

2.3 ns

2438

54000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

CSP-289

YES

289-CSP (14x14)

289

SMD/SMT

892.86 MHz

有

微芯片技术

119

IGLOO PLUS

1.575 V

Tray

AGLP125

Obsolete

TFBGA, BGA289,17X17,32

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA289,17X17,32

1.5 V

未说明

70 °C

无

AGLP125V5-CS289

250 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

N

212 I/O

1.425 V

0 C

+ 70 C

0°C ~ 85°C (TJ)

Tray

AGLP125V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.8 mm

unknown

S-PBGA-B289

212

不合格

1.5 V

1.5 V

COMMERCIAL

212

3120 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3120

36864

125000

STD

3120

3120

125000

0.81 mm

14 mm

14 mm

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

388

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF500TL

0.97V ~ 1.08V

1.05 V

481000

33792000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

微芯片技术

40

Actel

Tray

A42MX36

Obsolete

5.25 V

BGA,

网格排列

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX36-BGG272

73 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Details

202 I/O

3 V

0 C

+ 70 C

SMD/SMT

131 MHz

有

0°C ~ 70°C (TA)

Tray

A42MX36

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B272

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

131 MHz

1184

1822

2.7 ns

2438

54000

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

微芯片技术

+ 70 C

SMD/SMT

Tray

A42MX36

Obsolete

5.25 V

BGA,

网格排列

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX36-1BGG272

83 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

151 MHz

有

40

Actel

Details

202 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tray

A42MX36

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B272

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

151 MHz

1184

1

1822

2.3 ns

2438

54000

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

+ 85 C

SMD/SMT

870 MHz

微芯片技术

有

27

Actel

0.014110 oz

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

40

85 °C

有

AX2000-2FGG896I

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

586 I/O

1.425 V

- 40 C

-40°C ~ 85°C (TA)

Tray

AX2000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

870 MHz

S-PBGA-B896

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

36 kB

740 ps

740 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

870 MHz

32256

21504

2

21504

0.74 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

CQFP-256

YES

256-CQFP (75x75)

256

SMD/SMT

278 MHz

微芯片技术

有

1

Actel

Tray

5962-0151802

活跃

2.5 V

GQFF,

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

2.5 V

125 °C

5962-0151802QXC

GQFF

SQUARE

活跃

MICROSEMI CORP

5.23

Military grade

This product may require additional documentation to export from the United States.

N

228 I/O

2.5 V

- 55 C

+ 125 C

-55°C ~ 125°C (TJ)

SX-A

e4

3A001.A.2.C

GOLD

2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F256

Qualified

2.5 V

MILITARY

32000 GATES

3.22 mm

现场可编程门阵列

48000

2880

MIL-PRF-38535 Class Q

32000

36 mm

36 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

AFS1500

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.28205 GHz

1

38400

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

有

微芯片技术

40

Actel

5.25 V

Tray

A42MX24

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX24-TQG176A

124 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.6

Details

150 I/O

4.75 V

- 40 C

+ 125 C

SMD/SMT

135 MHz

-40°C ~ 125°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

125 °C

-40 °C

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

5 V

AUTOMOTIVE

5.25 V

4.75 V

2 ns

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

36000

135 MHz

STD

1410

2 ns

1890

36000

1.4 mm

24 mm

24 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

有

微芯片技术

24

Actel

5.25 V

Tray

A42MX36

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX36-PQG208A

107 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

176 I/O

4.75 V

- 40 C

+ 125 C

SMD/SMT

116 MHz

-40°C ~ 125°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

125 °C

-40 °C

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

5 V

AUTOMOTIVE

5.25 V

4.75 V

320 B

2.3 ns

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

2560

54000

116 MHz

STD

1822

2.3 ns

2438

54000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

5.25 V

Tray

A42MX24

活跃

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX24-3PLG84

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

16

Actel

0.239083 oz

0°C ~ 70°C (TA)

Tube

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M7A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

M7A3P1000-FG256

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

0 C

0 to 70 °C

Tray

M7A3P1000

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1000000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

+ 85 C

SMD/SMT

160 MHz

有

微芯片技术

90

Actel

5.5 V

Tray

A40MX02

活跃

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX02-1VQG80I

92 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

57 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

INDUSTRIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2.3 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

Fusion

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

5.3

MICROSEMI CORP

活跃

SQUARE

BGA

M1AFS1500-2FG484

无

85 °C

30

N

223 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

60

0°C ~ 85°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

OTHER

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

BGA484,22X22,40

20

无

AFS1500-FG484K

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.83

This product may require additional documentation to export from the United States.

N

有

60

Fusion

223

Tray

AFS1500

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

-55°C ~ 100°C (TJ)

Tray

AFS1500

e0

Tin/Lead (Sn/Pb)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

223

不合格

1.5,3.3 V

33.8 kB

223

现场可编程门阵列

276480

1.5e+06

38400