N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

有

160

IGLOOe

0.014110 oz

1.575 V

Tray

M1AGL600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1AGL600V5-FGG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

-40°C ~ 85°C (TA)

Tray

M1AGL600V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

1.575 V

1.425 V

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Details

174 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

280 MHz

微芯片技术

有

24

Actel

This product may require additional documentation to export from the United States.

3.6 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

3.3 V

40

125 °C

有

A54SX32-1PQG208M

280 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

-55°C ~ 125°C (TC)

Tray

A54SX32

e3

3A001.A.2.C

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

3.3,5 V

MILITARY

174

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

Details

418 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

870 MHz

有

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

40

70 °C

有

AX1000-2FGG676

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

0°C ~ 70°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

870 MHz

S-PBGA-B676

516

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

Details

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

310 MHz

有

24

ProASIC3

Tray

M7A3P1000

活跃

1.575 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

85 °C

有

M7A3P1000-2PQG208I

350 MHz

FQFP

SQUARE

不推荐

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M7A3P1000

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

0.5 mm

compliant

310 MHz

S-PQFP-G208

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

310 MHz

2

24576

24576

1.575 V

1.425 V

1000000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

Details

418 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

649 MHz

有

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

40

70 °C

有

AX1000-FGG676

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

0°C ~ 70°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B676

516

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

12096

12096

0.99 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (27X27)

484

Details

360 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

40

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

2.5 V

40

70 °C

有

A54SX72A-1FGG484

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0°C ~ 70°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

360

不合格

2.5,3.3/5 V

COMMERCIAL

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

3 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

微芯片技术

有

40

Actel

Tray

A42MX24

活跃

5.5 V

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

未说明

85 °C

有

A42MX24-1TQG176I

105.57 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

150 I/O

-40°C ~ 85°C (TA)

Tray

A42MX24

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G176

不合格

INDUSTRIAL

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

250 MHz

912

1

1410

2.1 ns

1890

5.5 V

3 V

36000

1.4 mm

24 mm

24 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

3 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

微芯片技术

有

24

Actel

0.196363 oz

5.5 V

活跃

A42MX24

Tray

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX24-1PQG160I

105.57 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

125 I/O

-40°C ~ 85°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

INDUSTRIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

250 MHz

912

1

1410

2.1 ns

1890

5.5 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Details

175 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

280 MHz

微芯片技术

有

24

Actel

3.6 V

Tray

A54SX16

活跃

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

3.3 V

40

85 °C

有

A54SX16P-1PQG208I

280 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.23

-40°C ~ 85°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

3.3,3.3/5 V

INDUSTRIAL

175

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

0.8 ns

1452

1452

16000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

活跃

Details

175 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

227 MHz

有

24

Actel

2.75 V

Tray

A54SX16

-40°C ~ 125°C (TA)

Tray

A54SX16A

2.5 V

24000

1452

STD

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

Tray

M7AFS600

活跃

Details

172 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

1.575 V

-40°C ~ 85°C (TA)

Tray

M7AFS600

1.5 V

110592

600000

1

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

Details

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M7AFS600-1FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40°C ~ 85°C (TA)

Tray

M7AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

1

600000

1.2 mm

17 mm

17 mm

37 In Stock

-

23 Weeks

Tin

表面贴装

表面贴装

144-LQFP

144

114

-40°C~85°C TC

Tray

1997

AT40KAL

yes

活跃

3 (168 Hours)

144

MAXIMUM USABLE GATES 50000

3.3V

QUAD

鸥翼

0.5mm

100MHz

AT40K10

192

576B

576B

2304 CLBS, 40000 GATES

现场可编程门阵列

576

4608

20000

1

954

2.2 ns

2304

576

40000

20mm

20mm

无

ROHS3 Compliant

无铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

3 V

- 55 C

+ 125 C

SMD/SMT

微芯片技术

有

40

Actel

5.5 V

Tray

A42MX24

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX24-TQG176M

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

150 I/O

-55°C ~ 125°C (TC)

Tray

A42MX24

e3

3A001.A.2.C

Matte Tin (Sn)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

MILITARY

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

912

1410

2.5 ns

1890

5.5 V

3 V

36000

1.4 mm

24 mm

24 mm

无

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

This product may require additional documentation to export from the United States.

Details

140 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

微芯片技术

Actel

40

有

172 MHz

5.5 V

Tray

A42MX16

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX16-TQG176M

94 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

-55°C ~ 125°C (TC)

Tray

A42MX16

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

MILITARY

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

2.8 ns

1232

24000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

CQFP-208

208-CQFP (75x75)

微芯片技术

2.75 V

N

174 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

238 MHz

有

1

Actel

Tray

A54SX32

活跃

0°C ~ 70°C (TA)

A54SX32A

2.5 V

48000

2880

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

N

有

84

ProASIC3

221

Tray

微芯片技术

M1A3PE3000

活跃

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

-40 °C

1.5 V

30

1.425 V

85 °C

无

M1A3PE3000-FG324I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M1A3PE3000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

221

不合格

1.5/3.3 V

INDUSTRIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

256-LBGA

YES

256

256-FPBGA (17x17)

256

Tray

微芯片技术

M1AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-55 °C

1.5 V

30

1.425 V

100 °C

有

M1AFS600-FGG256K

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

119

-55°C ~ 100°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B256

不合格

OTHER

13.5 kB

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

600000

17 mm

17 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

1.575 V

This product may require additional documentation to export from the United States.

N

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

Tray

M1AFS600

活跃

-40°C ~ 100°C (TJ)

Tray

M1AFS600

85 °C

-40 °C

1.5 V

1.0989 GHz

13.5 kB

110592

600000

1.0989 GHz

STD

13824

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

微芯片技术

350 MHz

有

24

ProASIC3

1.575 V

Tray

M1A3P1000

活跃

0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

1.5 V

40

125 °C

有

M1A3P1000-1PQG208M

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

-55°C ~ 125°C (TJ)

Tray

M1A3P1000

e3

3A001.A.2.C

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5,1.5/3.3 V

MILITARY

8 mA

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

This product may require additional documentation to export from the United States.

Details

175 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

微芯片技术

280 MHz

有

24

Actel

3.6 V

活跃

A54SX16

Tray

QFP, QFP208,1.2SQ,20

FLATPACK

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

125 °C

有

A54SX16P-1PQG208M

241 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.82

-55°C ~ 125°C (TC)

Tray

A54SX16P

3A001.A.2.C

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G208

175

不合格

3.3,3.3/5 V

MILITARY

175

现场可编程门阵列

24000

1452

1452

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

Tray

M2GL025

活跃

This product may require additional documentation to export from the United States.

N

27696 LE

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

有

60

IGLOO2

1.2 V

-55°C ~ 125°C (TJ)

Tray

M2GL025TS

1.2 V

27696

1130496

4 Transceiver

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

0.014110 oz

1.575 V

Tray

AX250

活跃

This product may require additional documentation to export from the United States.

Details

138 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

649 MHz

有

90

Actel

-55°C ~ 125°C (TA)

Tray

AX250

1.5 V

55296

250000

4224

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

微芯片技术

有

40

Actel

5.5 V

Tray

A42MX36

Obsolete

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX36-3BGG272I

100 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

202 I/O

-40°C ~ 85°C (TA)

Tray

A42MX36

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B272

不合格

INDUSTRIAL

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

180 MHz

1184

3

1822

1.9 ns

2438

5.5 V

3 V

54000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

388 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

0°C ~ 100°C (TJ)

Tray

MPF300TL

1.05 V

12.7 Gb/s

300000

21094400