N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

90

Fusion

0.014110 oz

Tray

M1AFS1500

活跃

1.575 V

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

0°C ~ 85°C (TJ)

Tray

M1AFS1500

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.47059 GHz

2

38400

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

有

60

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

活跃

M7A3P1000

Tray

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M7A3P1000-2FG484I

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

-40 to 85 °C

Tray

M7A3P1000

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

310 MHz

2

24576

24576

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

60

Fusion

微芯片技术

0.014110 oz

Tray

M7AFS600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M7AFS600-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

172 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

-40°C ~ 85°C (TA)

Tray

M7AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

600000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

IGLOO2

Tray

M2GL010

活跃

1.2 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL010TS-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

114 kB

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

90

IGLOOe

0.014110 oz

1.5000 V

Tray

AGL1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

AGL1000V5-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

N

11000 LE

177 I/O

1.425 V

0 to 70 °C

Tray

AGL1000V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

OTHER

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

1.2 mm

17 mm

17 mm

2285 In Stock

-

表面贴装

表面贴装

208-BFQFP

208

208-PQFP (28x28)

161

0°C~70°C TC

Tray

1997

AT40K/KLV

活跃

3 (168 Hours)

70°C

0°C

4.75V~5.25V

AT40K40

5.25V

4.75V

2.3kB

2.3kB

2304

18432

50000

100MHz

2304

Non-RoHS Compliant

含铅

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.87

This product may require additional documentation to export from the United States.

N

有

60

Fusion

172

Tray

M1AFS600

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

20

无

M1AFS600-FG484K

-55°C ~ 100°C (TJ)

Tray

M1AFS600

e0

Tin/Lead (Sn/Pb)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

172

不合格

1.5,3.3 V

13.5 kB

172

现场可编程门阵列

110592

600000

13824

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

微芯片技术

活跃

5.25 V

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX24-1TQG176

96.6 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

40

Actel

Details

150 I/O

3 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

Tray

A42MX24

0°C ~ 70°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

250 MHz

912

1

1410

2.1 ns

1890

36000

1.4 mm

24 mm

24 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

+ 125 C

SMD/SMT

763 MHz

有

24

微芯片技术

Actel

Tray

AX250

活跃

1.575 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

1.5 V

40

125 °C

有

AX250-1PQG208M

763 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.6

Military grade

This product may require additional documentation to export from the United States.

Details

115 I/O

1.425 V

- 55 C

-55°C ~ 125°C (TA)

Tray

AX250

e3

3A001.A.2.C

Matte Tin (Sn)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

248

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

248

2816 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

55296

250000

4224

MIL-STD-883 Class B

0.84 ns

2816

4224

250000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

11000 LE

300 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

144 kbit

350 MHz

-

60

1 kbit

ProASIC3

Tray

A3P1000

活跃

1.5 V

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.14V ~ 1.575V

1.5 V

8 mA

700 Mb/s

147456

1000000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

158 I/O

Details

This product may require additional documentation to export from the United States.

微芯片技术

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA750

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

有

APA750-PQG208

180 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.3

24

有

180 MHz

SMD/SMT

+ 70 C

0 C

2.3 V

0 to 70 °C

Tray

APA750

e3

Matte Tin (Sn)

70 °C

0 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

245

0.5 mm

compliant

180 MHz

S-PQFP-G208

158

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

2.7 V

2.3 V

18 kB

158

750000 GATES

4.1 mm

现场可编程门阵列

147456

750000

180 MHz

STD

32768

32768

750000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

151 MHz

有

24

微芯片技术

Actel

Tray

A42MX36

活跃

5.5 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

未说明

125 °C

有

A42MX36-1PQG208M

83 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

176 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TC)

Tray

A42MX36

3A001.A.2.C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

MILITARY

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

2560

54000

2.3 ns

2438

2414

54000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

3 V

- 40 C

+ 85 C

SMD/SMT

164 MHz

有

24

Actel

3.3, 5 V

3 V

5.5 V

5.5 V

Tray

A42MX36

活跃

Details

176 I/O

-40 to 85 °C

Tray

A42MX36

85 °C

-40 °C

3V ~ 3.6V, 4.5V ~ 5.5V

3.3 V, 5 V

5.5 V

3 V

320 B

1184

2560

54000

164 MHz

1184

2

1822

3.4 mm

28 mm

28 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

24

微芯片技术

ProASIC3

1.575 V

Tray

A3PE3000

Obsolete

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

30

85 °C

无

A3PE3000-2PQ208I

350 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

5.6

This product may require additional documentation to export from the United States.

N

147 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

-40°C ~ 100°C (TJ)

Tray

A3PE3000

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

310 MHz

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

75264

3000000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

- 40 C

+ 85 C

SMD/SMT

294 MHz

有

90

Actel

微芯片技术

0.014110 oz

2.5000 V

2.25 V

2.75 V

2.75 V

Tray

A54SX72

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

20

85 °C

无

A54SX72A-2FG256I

294 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

203 I/O

2.25 V

-40 to 85 °C

Tray

A54SX72A

e0

锡铅

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

203

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

203

6036 CLBS, 108000 GATES

1.97 mm

现场可编程门阵列

108000

6036

2

1.1 ns

6036

6036

108000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

1152

1152-FPBGA (35x35)

400.011771 mg

1152

有

24

微芯片技术

Actel

0.014110 oz

1.575 V

Tray

AX2000

Obsolete

BGA, BGA1152,34X34,40

网格排列

3

PLASTIC/EPOXY

BGA1152,34X34,40

-55 °C

1.5 V

20

125 °C

无

AX2000-FG1152M

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

Military grade

This product may require additional documentation to export from the United States.

N

684 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

649 MHz

-55°C ~ 125°C (TA)

Tray

AX2000

3A001.A.2.C

TIN LEAD/TIN LEAD SILVER

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B1152

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

36 kB

990 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

649 MHz

32256

MIL-STD-883 Class B

21504

0.99 ns

21504

32256

2000000

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

1.5 V

20

1.425 V

100 °C

无

M1AFS1500-FG256K

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

N

有

90

Fusion

119

Tray

M1AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-55 °C

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

1500000

17 mm

17 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

微芯片技术

A42MX24

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

未说明

125 °C

有

A42MX24-1TQG176M

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

150 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

有

40

Actel

5.5 V

Tray

-55°C ~ 125°C (TC)

Tray

A42MX24

3A001.A.2.C

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

MILITARY

5.5 V

3 V

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

912

1

1410

2.1 ns

1890

36000

1.4 mm

24 mm

24 mm

无

无铅

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

198 MHz

有

40

微芯片技术

Actel

5.5 V

Tray

A42MX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX16-1TQG176M

108 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

140 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TC)

Tray

A42MX16

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

MILITARY

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

2.4 ns

1232

1232

24000

1.4 mm

24 mm

24 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

90

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

Details

203 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

217 MHz

有

-40°C ~ 85°C (TA)

Tray

A54SX72A

85 °C

-40 °C

2.25V ~ 5.25V

217 MHz

2.5 V

2.75 V

2.25 V

1.5 ns

1.5 ns

6036

108000

217 MHz

6036

6036

4024

1.2 mm

17 mm

17 mm

无

无铅

29 In Stock

-

表面贴装

表面贴装

144-LQFP

144

144-LQFP (20x20)

114

0°C~70°C TC

Tray

1997

AT40K/KLV

Obsolete

3 (168 Hours)

70°C

0°C

4.75V~5.25V

166.67MHz

AT40K05

5V

5.25V

4.75V

256B

256B

256

2048

10000

100MHz

256

2

256

无

Non-RoHS Compliant

含铅

N/A

-

表面贴装

FBGA-256

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

11000 LE

177 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

144 kbit

350 MHz

-

90

1 kbit

ProASIC3

1.5 V

Tray

A3P1000

活跃

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.14V ~ 1.575V

1.5 V

8 mA

700 Mb/s

147456

1000000

N/A

-

Production (Last Updated: 2 months ago)

通孔

通孔

CCGA

624

624-CCGA (32.5x32.5)

微芯片技术

SMD/SMT

649 MHz

有

1

Actel

1.575 V

Tray

AX2000

活跃

This product may require additional documentation to export from the United States.

N

418 I/O

1.425 V

- 55 C

+ 125 C

-55°C ~ 125°C (TA)

AX2000

125 °C

-55 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

36 kB

990 ps

21504

294912

2000000

649 MHz

32256

21504

2.73 mm

32.5 mm

32.5 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS600-2FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

172 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

60

Fusion

-40°C ~ 100°C (TJ)

Tray

M1AFS600

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1.47059 GHz

2

13824

13824

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

N

203 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

217 MHz

有

90

Actel

0.014110 oz

2.5000 V

2.25 V

2.75 V

2.75 V

Tray

A54SX72

活跃

-40 to 85 °C

Tray

A54SX72A

2.25V ~ 5.25V

2.5 V

108000

6036

STD

1.2 mm

17 mm

17 mm