N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

Tray

M2GL050

微芯片技术

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

有

M2GL050-FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

1.53

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

-40°C ~ 100°C (TJ)

Tray

M2GL050

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

STD

56340

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

56340 LE

267 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.26 V

Tray

M2GL050

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL050

1.14V ~ 2.625V

667 Mb/s

56340

1869824

STD

4 Transceiver

含铅

N/A

-

表面贴装

896-BGA

896-FBGA (31x31)

微芯片技术

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

Details

有

27

IGLOO2

377

0°C ~ 85°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

M2GL050

微芯片技术

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

无

M2GL050T-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

176

IGLOO2

200

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

STD

56340

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

200

Tray

M2GL050

微芯片技术

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

有

M2GL050TS-FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

M2GL050

微芯片技术

活跃

11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

有

M2GL050TS-1FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

56340

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

IGLOOe

300

微芯片技术

Tray

M1AGL1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

无

M1AGL1000V2-FG484

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

60

0°C ~ 70°C (TA)

Tray

M1AGL1000V2

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

SMD/SMT

有

160

ProASIC3

600000

600000

微芯片技术

97

Tray

M1A3P600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P600-2FGG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

13824

600000

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-144

YES

144

144-FPBGA (13x13)

144

IGLOOe

97

微芯片技术

Tray

M1AGL1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

无

M1AGL1000V2-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

160

-40°C ~ 85°C (TA)

Tray

M1AGL1000V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

Tray

P1AFS1500

活跃

This product may require additional documentation to export from the United States.

N

有

90

Fusion

119

0°C ~ 85°C (TJ)

Tray

P1AFS1500

1.425V ~ 1.575V

276480

1500000

2

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

114

Tray

U1AFS250

微芯片技术

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

85 °C

有

U1AFS250-FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

-40°C ~ 100°C (TJ)

Tray

U1AFS250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

STD

6144

250000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

N

This product may require additional documentation to export from the United States.

300

微芯片技术

Tray

M1AGL1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

1.14 V

100 °C

无

M1AGL1000V2-FG484I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

IGLOOe

60

有

SMD/SMT

11000 LE

-40°C ~ 85°C (TA)

Tray

M1AGL1000V2

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

60

IGLOOe

300

微芯片技术

Tray

M1AGL1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1AGL1000V5-FGG484I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

SMD/SMT

有

-40°C ~ 85°C (TA)

Tray

M1AGL1000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

Tray

U1AFS600

活跃

This product may require additional documentation to export from the United States.

N

有

90

Fusion

114

0°C ~ 85°C (TJ)

Tray

U1AFS600

1.425V ~ 1.575V

36864

250000

STD

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

Tray

微芯片技术

AFS600

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

20

无

AFS600-FG484K

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.83

This product may require additional documentation to export from the United States.

N

7000 LE

有

60

Fusion

172

-55°C ~ 100°C (TJ)

Tray

AFS600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

172

不合格

1.5,3.3 V

172

现场可编程门阵列

110592

600000

13824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

60

IGLOOe

300

微芯片技术

Tray

M1AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1AGL1000V5-FG484I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

-40°C ~ 85°C (TA)

Tray

M1AGL1000V5

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

215

微芯片技术

Tray

M1AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M1AGL1000V2-CS281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

184

IGLOOe

0°C ~ 70°C (TA)

Tray

M1AGL1000V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

10 mm

10 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

24

ProASIC3

151

Tray

微芯片技术

M1A3P400

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

0°C ~ 85°C (TJ)

Tray

M1A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

活跃

10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, CSP-281

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

20

1.425 V

100 °C

无

M1AGL600V5-CS281I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

有

184

IGLOOe

215

Tray

M1AGL600

-40°C ~ 85°C (TA)

Tray

M1AGL600V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

13824

600000

10 mm

10 mm

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

Details

有

90

Fusion

119

Tray

M1AFS1500

活跃

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

1.425V ~ 1.575V

276480

1500000

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

90

ProASIC3

178

Tray

微芯片技术

M1A3P400

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P400-1FG256I

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

-40°C ~ 100°C (TJ)

Tray

M1A3P400

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

Tray

P1AFS600

活跃

This product may require additional documentation to export from the United States.

N

有

60

Fusion

172

0°C ~ 85°C (TJ)

Tray

P1AFS600

1.425V ~ 1.575V

110592

600000

2

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

160

ProASIC3

97

Tray

微芯片技术

M1A3P400

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P400-FGG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

-40°C ~ 100°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

9216

400000

13 mm

13 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

221

Tray

M1A3PE3000

微芯片技术

活跃

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.5 V

1.425 V

70 °C

有

M1A3PE3000-1FGG324

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

84

ProASIC3

0°C ~ 85°C (TJ)

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

40

S-PBGA-B324

221

不合格

1.5/3.3 V

COMMERCIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

This product may require additional documentation to export from the United States.

215

微芯片技术

Tray

M1AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

有

M1AGL1000V5-CSG281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

IGLOOe

184

有

SMD/SMT

11000 LE

Details

0°C ~ 70°C (TA)

Tray

M1AGL1000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

0.5 mm

compliant

S-PBGA-B281

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

10 mm

10 mm