N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

870 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

AX1000-2FG484

870 MHz

BGA

0°C ~ 70°C (TA)

Tray

AX1000

e0

锡铅

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

870 MHz

S-PBGA-B484

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

418 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

有

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

30

70 °C

无

AX1000-1FG676

763 MHz

BGA

0°C ~ 70°C (TA)

Tray

AX1000

e0

锡铅

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

763 MHz

S-PBGA-B676

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

12096

1

12096

0.84 ns

12096

18144

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

BGA-456

YES

456-PBGA (35x35)

456

微芯片技术

无

APA300-BG456M

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

290 I/O

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

有

24

Actel

2.7 V

Tray

APA300

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

-55 °C

2.5 V

30

125 °C

-55°C ~ 125°C (TC)

Tray

APA300

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B456

290

不合格

2.5 V

2.5,2.5/3.3 V

MILITARY

290

300000 GATES

2.54 mm

现场可编程门阵列

73728

300000

8192

300000

1.73 mm

35 mm

35 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

BGA-456

456

456-PBGA (35x35)

微芯片技术

SMD/SMT

180 MHz

有

24

Actel

2.7 V

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

N

356 I/O

2.3 V

- 55 C

+ 125 C

-55°C ~ 125°C (TC)

Tray

APA600

125 °C

-55 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

21504

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

微芯片技术

125 °C

20

2.5 V

-55 °C

TPAK208,2.9SQ,20

CERAMIC, METAL-SEALED COFIRED

This product may require additional documentation to export from the United States.

N

171 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

250 MHz

有

1

Actel

2.75 V

Tray

A54SX72

活跃

QFF, TPAK208,2.9SQ,20

FLATPACK

5.25

MICROSEMI CORP

活跃

SQUARE

QFF

250 MHz

A54SX72A-1CQ208M

无

-55°C ~ 125°C (TC)

A54SX72A

e0

3A001.A.2.C

锡铅

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

171

不合格

2.5 V

2.5,3.3/5 V

MILITARY

171

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

29.21 mm

29.21 mm

N/A

-

表面贴装

CQFP

YES

208-CQFP (75x75)

208

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.23

N

174 I/O

3 V

0 C

+ 70 C

SMD/SMT

240 MHz

有

1

Actel

0.372740 oz

Tray

A54SX32

活跃

3.6 V

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

3.3 V

20

70 °C

无

A54SX32-1CQ208

240 MHz

QFF

0°C ~ 70°C (TA)

A54SX32

e0

锡铅

48000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

246

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

246

2880 CLBS, 32000 GATES

3.06 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

32000

2.8 mm

29.21 mm

29.21 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

-40C

有

12288

表面贴装

2.7 V

Tray

APA450

活跃

This product may require additional documentation to export from the United States.

Details

186 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

PROASICPLUS

85C

Industrial

FBGA

450000

-40C to 85C

186

450000

0.22UM

2.7(V)

2.5(V)

无

2.3(V)

-40°C ~ 85°C (TA)

Tray

APA450

85 °C

-40 °C

2.3V ~ 2.7V

180(MHz)

256

2.5 V

2.7 V

2.3 V

13.5 kB

110592

450000

180 MHz

STD

12288

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

40

125 °C

有

APA300-FGG256M

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

186 I/O

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

Tray

APA300

活跃

2.7 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-55 °C

2.5 V

-55°C ~ 125°C (TC)

Tray

APA300

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

186

不合格

2.5 V

2.5,2.5/3.3 V

MILITARY

186

300000 GATES

1.8 mm

现场可编程门阵列

73728

300000

8192

300000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

CQFP-208

208-CQFP (75x75)

微芯片技术

This product may require additional documentation to export from the United States.

N

171 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

217 MHz

有

1

Actel

Tray

A54SX72

活跃

2.75 V

-55°C ~ 125°C (TC)

A54SX72A

2.25V ~ 5.25V

2.5 V

108000

6036

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

649 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

AX1000-FG484

649 MHz

BGA

0°C ~ 70°C (TA)

Tray

AX1000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

649 MHz

S-PBGA-B484

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

12096

12096

0.99 ns

12096

18144

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

无

APA150-FG256

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

186 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

2.7 V

Tray

APA150

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

30

70 °C

0°C ~ 70°C (TA)

Tray

APA150

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

186

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

186

150000 GATES

1.8 mm

现场可编程门阵列

36864

150000

STD

6144

150000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

40

70 °C

有

A54SX72A-2PQG208

294 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

171 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

294 MHz

有

24

Actel

2.5000 V

2.25 V

2.75 V

2.75 V

Tray

A54SX72

活跃

QFP208,1.2SQ,20

PLASTIC/EPOXY

3

FLATPACK, FINE PITCH

FQFP, QFP208,1.2SQ,20

2.5 V

0 to 70 °C

Tray

A54SX72A

e3

哑光锡

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

171

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

171

6036 CLBS, 108000 GATES

4.1 mm

现场可编程门阵列

108000

6036

2

1.1 ns

6036

6036

108000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-456

YES

456-PBGA (35x35)

456

微芯片技术

无

APA1000-BG456M

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.54

This product may require additional documentation to export from the United States.

N

356 I/O

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

Actel

24

有

2.7 V

Tray

APA1000

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

-55 °C

2.5 V

未说明

125 °C

-55°C ~ 125°C (TC)

Tray

APA1000

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

未说明

1.27 mm

unknown

S-PBGA-B456

356

不合格

2.5 V

2.5,2.5/3.3 V

MILITARY

356

1000000 GATES

2.54 mm

现场可编程门阵列

202752

1000000

56320

1000000

1.73 mm

35 mm

35 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Tray

APA450

活跃

2.7 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

2.5 V

40

85 °C

有

APA450-PQG208I

180 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

-

158 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

108 kbit

108 kbit

180 MHz

有

-

24

110592 bit

ProASICPLUS

2.5000 V

2.3 V

2.7 V

-40 to 85 °C

Tray

APA450

e3

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

245

0.5 mm

compliant

180 MHz

S-PQFP-G208

158

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

2.7 V

2.3 V

13.5 kB

5 mA

13.5 kB

158

450000 GATES

4.1 mm

现场可编程门阵列

110592

450000

180 MHz

STD

12288

12288

450000

3.4 mm

28 mm

28 mm

无

无铅

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

40

125 °C

有

APA300-FGG144M

180 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

100 I/O

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

有

160

Actel

0.014110 oz

Tray

APA300

活跃

2.7 V

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-55 °C

2.5 V

-55°C ~ 125°C (TC)

Tray

APA300

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

100

不合格

2.5 V

2.5,2.5/3.3 V

MILITARY

100

300000 GATES

1.55 mm

现场可编程门阵列

73728

300000

8192

300000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

微芯片技术

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

-55 °C

2.5 V

20

Military grade

This product may require additional documentation to export from the United States.

N

171 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

250 MHz

有

1

Actel

Tray

A54SX72

活跃

2.75 V

125 °C

无

A54SX72A-1CQ208B

250 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.25

-55°C ~ 125°C (TJ)

A54SX72A

e0

3A001.A.2.C

锡铅

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

171

不合格

2.5 V

2.5,3.3/5 V

MILITARY

171

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

108000

6036

MIL-STD-883 Class B

1.3 ns

6036

6036

108000

29.21 mm

29.21 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

N

-

100 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

-

160

Actel

0.014110 oz

2.625 V

Tray

APA075

活跃

BGA, BGA144,12X12,40

网格排列

PLASTIC/EPOXY

BGA144,12X12,40

无

APA075-FG144A

BGA

SQUARE

活跃

MICROSEMI CORP

5.61

-40°C ~ 125°C (TJ)

Tray

APA075

8542.39.00.01

CMOS

2.375V ~ 2.625V

BOTTOM

BALL

1 mm

unknown

S-PBGA-B144

100

不合格

2.5 V

2.5,2.5/3.3 V

100

现场可编程门阵列

27648

75000

STD

3072

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

3000 LE

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0.014110 oz

Tray

AFS250

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

AFS250-1FGG256

LBGA

SQUARE

活跃

0°C ~ 85°C (TJ)

Tray

AFS250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

1.575 V

1.425 V

4.5 kB

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1.28205 GHz

1

6144

6144

250000

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

This product may require additional documentation to export from the United States.

Details

223 I/O

1.425 V

0 C

+ 70 C

0°C ~ 85°C (TJ)

Tray

AFS1500

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.28205 GHz

1

38400

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

无

APA450-FG256

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

186 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

Tray

APA450

活跃

2.7 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

30

70 °C

0°C ~ 70°C (TA)

Tray

APA450

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

186

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

186

450000 GATES

1.8 mm

现场可编程门阵列

110592

450000

STD

12288

450000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

有

APA300-FGG256

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

有

90

Actel

0.014110 oz

180 MHz

SMD/SMT

+ 70 C

0 C

2.3 V

186 I/O

Details

This product may require additional documentation to export from the United States.

2.7 V

Tray

APA300

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

40

70 °C

0°C ~ 70°C (TA)

Tray

APA300

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

186

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

186

300000 GATES

1.8 mm

现场可编程门阵列

73728

300000

STD

8192

300000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

表面贴装

CQFP

YES

208

208-CQFP (75x75)

10.567001 g

208

微芯片技术

QFF

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

174 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

205 MHz

有

1

Actel

0.372740 oz

3.6 V

Tray

A54SX32

活跃

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

-55 °C

3.3 V

20

125 °C

无

A54SX32-CQ208M

205 MHz

-55°C ~ 125°C (TC)

A54SX32

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

48000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

FLAT

225

0.5 mm

unknown

205 MHz

S-CQFP-F208

246

不合格

3.3 V, 5 V

3.3,5 V

MILITARY

5.5 V

4.5 V

1 ns

1 ns

246

2880 CLBS, 32000 GATES

3.06 mm

现场可编程门阵列

2880

48000

205 MHz

2880

2880

1080

1 ns

2880

2880

32000

2.8 mm

29.21 mm

29.21 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

有

APA075-PQG208

180 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

1000 LE

158 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

24

27648 bit

ProASICPLUS

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA075

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

0 to 70 °C

Tray

APA075

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

158

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

5 mA

-

158

75000 GATES

4.1 mm

现场可编程门阵列

27648

75000

STD

-

3072

75000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

This product may require additional documentation to export from the United States.

N

100 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

160

Actel

0.014110 oz

Tray

APA450

活跃

2.625 V

BGA, BGA144,12X12,40

网格排列

PLASTIC/EPOXY

BGA144,12X12,40

无

APA450-FG144A

BGA

SQUARE

活跃

MICROSEMI CORP

5.61

-40°C ~ 125°C (TJ)

Tray

APA450

8542.39.00.01

CMOS

2.375V ~ 2.625V

BOTTOM

BALL

1 mm

unknown

S-PBGA-B144

100

不合格

2.5 V

2.5,2.5/3.3 V

100

现场可编程门阵列

110592

450000

STD

12288

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

7000 LE

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.425V ~ 1.575V

1.0989 GHz

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.0989 GHz

STD

13824

1.2 mm

17 mm

17 mm

无