N/A

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

Tray

APA150

活跃

This product may require additional documentation to export from the United States.

Details

100 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

160

Actel

0.014110 oz

2.7 V

0°C ~ 70°C (TA)

Tray

APA150

2.3V ~ 2.7V

2.5 V

36864

150000

STD

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA-484

484-FPBGA (23x23)

微芯片技术

有

-

60

110592 bit

ProASIC3

1.575 V

Tray

A3PE600

活跃

This product may require additional documentation to export from the United States.

Details

6500 LE

270 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

0°C ~ 85°C (TJ)

Tray

A3PE600

1.425V ~ 1.575V

1.5 V

5 mA

700 Mb/s

110592

600000

STD

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.3

N

68 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

350 MHz

有

90

ProASIC3 nano

1.575 V

Tray

A3PN250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PN250-VQ100I

TFQFP

-40°C ~ 100°C (TJ)

Tray

A3PN250

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

-40 °C

1.5 V

30

100 °C

无

AGL1000V5-FG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

2.23

This product may require additional documentation to export from the United States.

N

11000 LE

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

90

IGLOOe

0.014110 oz

1.575 V

Tray

AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40°C ~ 85°C (TA)

Tray

AGL1000V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

40

85 °C

有

A3P1000-2FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

11000 LE

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

0°C ~ 85°C (TJ)

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

310 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P400

活跃

1.575 V

This product may require additional documentation to export from the United States.

Details

178 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40 to 85 °C

Tray

A3P400

1.425V ~ 1.575V

1.5 V

55296

400000

2

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

-40 °C

2.5 V

30

85 °C

无

APA300-FG144I

180 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.62

This product may require additional documentation to export from the United States.

N

100 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

160

0.014110 oz

Actel

2.7 V

Tray

APA300

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40°C ~ 85°C (TA)

Tray

APA300

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B144

100

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

100

300000 GATES

1.55 mm

现场可编程门阵列

73728

300000

8192

300000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P600-1FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

BGA,

0 to 70 °C

Tray

A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

N

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

60

Fusion

0.014110 oz

Tray

AFS1500

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AFS1500-FG484I

BGA

-40°C ~ 100°C (TJ)

Tray

AFS1500

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

1.0989 GHz

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.0989 GHz

STD

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

含铅

N/A

-

表面贴装

UCSP-36

YES

36-UCSP (3x3)

36

微芯片技术

AGLN010V5-UCG36

VFBGA

SQUARE

活跃

MICROSEMI CORP

2.07

Details

100 LE

23 I/O

1.425 V

- 20 C

+ 85 C

SMD/SMT

250 MHz

有

490

IGLOO nano

0.000547 oz

Tray

AGLN010

活跃

1.575 V

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-20 °C

1.5 V

未说明

70 °C

有

-20°C ~ 85°C (TJ)

Tray

AGLN010V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.4 mm

compliant

S-PBGA-B36

不合格

1.5 V

OTHER

-

260 CLBS, 10000 GATES

0.8 mm

现场可编程门阵列

260

10000

STD

-

260

10000

3 mm

3 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

BGA896,30X30,40

1.5 V

30

70 °C

无

AX2000-1FG896

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

21504 LE

586 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

有

27

Actel

0.014110 oz

1.425 V

1.575 V

Tray

AX2000

活跃

1.575 V

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

0°C ~ 70°C (TA)

Tray

AX2000

e0

锡铅

70 °C

0 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

763 MHz

S-PBGA-B896

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

36 kB

850 ps

850 ps

-

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

763 MHz

32256

21504

1

-

21504

0.84 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

无

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

活跃

SQUARE

BGA

A3PE3000-2FGG324I

This product may require additional documentation to export from the United States.

Details

221 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

84

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

5.3

MICROSEMI CORP

-40°C ~ 100°C (TJ)

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

25 mA

63 kB

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

100 °C

无

AGL030V2-VQ100I

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

IGLOOe

90

有

526.32 MHz, 892.86 MHz

SMD/SMT

+ 85 C

- 40 C

1.14 V

77 I/O

330 LE

N

1.2, 1.5 V

1.14 V

1.575 V

Tray

AGL030

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

-40 to 85 °C

Tray

AGL030V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.2 V to 1.5 V

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

STD

768

30000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

Tin

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX24-PLG84I

91.8 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

912 LE

72 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

-

16

Actel

0.239083 oz

3.3, 5 V

3 V

5.5 V

5.5 V

Tray

A42MX24

活跃

QCCJ,

CHIP CARRIER

3

-40 to 85 °C

Tube

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

250 MHz

912

STD

1410

2.5 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

有

24

ProASIC3

ProASIC®3

100C

Industrial

微芯片技术

PQFP

125000

-40C to 100C

133

125000

130NM

1.575(V)

1.5(V)

无

1.425(V)

-40C

有

3072

表面贴装

1.575 V

Tray

A3P125

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P125-PQ208I

350 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

5.25

N

133 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

-40°C ~ 100°C (TJ)

Tray

A3P125

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

231(MHz)

208

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

3072 CLBS, 125000 GATES

4.1 mm

现场可编程门阵列

36864

125000

3072

125000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

3

PLASTIC/EPOXY

-40 °C

3.3 V

未说明

85 °C

有

A40MX02-PLG44I

80 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

Details

295 LE

34 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

139 MHz

有

295 LAB

27

Actel

0.084185 oz

3.3, 5 V

5.5 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, LCC-44

CHIP CARRIER

-40 to 85 °C

Tube

A40MX02

e3

Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

未说明

1.27 mm

compliant

S-PQCC-J44

不合格

3.3 V, 5 V

INDUSTRIAL

-

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

STD

-

2.7 ns

295

3000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

BGA-456

YES

456-PBGA (35x35)

456

微芯片技术

无

APA1000-BG456

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

356 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

24

Actel

2.7 V

Tray

APA1000

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

2.5 V

30

70 °C

0°C ~ 70°C (TA)

Tray

APA1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B456

356

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

356

1000000 GATES

2.54 mm

现场可编程门阵列

202752

1000000

STD

56320

1000000

1.73 mm

35 mm

35 mm

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

40

70 °C

有

A54SX08A-FTQG144

172 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.23

Details

113 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

172 MHz

有

768 LAB

60

Actel

0.046530 oz

2.75 V

Tray

A54SX08

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

0°C ~ 70°C (TA)

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.25 V to 5.25 V

2.5,3.3/5 V

COMMERCIAL

113

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

1.7 ns

768

768

12000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

5.23

MICROSEMI CORP

活跃

SQUARE

LBGA

350 MHz

A3P250-1FGG144I

有

100 °C

40

1.5 V

-40 °C

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P250

活跃

-40 to 85 °C

Tray

A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

16000

1452

0.25um

2.75(V)

2.5(V)

无

2.25(V)

0C

有

924

990

表面贴装

2.75 V

Tray

A54SX16

活跃

Details

113 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

227 MHz

有

60

Actel

0.046530 oz

SX-A

70C

Commercial

TQFP

24000

0C to 70C

113

0°C ~ 70°C (TA)

Tray

A54SX16A

2.25V ~ 5.25V

227(MHz)

144

2.5 V

24000

1452

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

34 I/O

3 V

0 C

+ 70 C

SMD/SMT

139 MHz

有

-

27

Actel

0.084185 oz

微芯片技术

40MX

70C

COMMERCIALC

PLCC

6000

0C to 70C

34

6000

547

0.45UM

5.25(V)

3.3/5(V)

无

3(V)

0C

有

547

273

表面贴装

MSL 3 - 168 hours

5.25 V

Tube

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-PLG44

80 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

1.51

Details

547 LE

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

83/139(MHz)

44

S-PQCC-J44

不合格

3.3 V, 5 V

COMMERCIAL

-

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

-

6000

STD

-

2.7 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

40

100 °C

有

M1AGL600V2-FGG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

177 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

有

90

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGL600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.2 V

-40 to 85 °C

Tray

M1AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.2 V to 1.5 V

INDUSTRIAL

1.575 V

1.14 V

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

344 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

60

Actel

0.014110 oz

2.7 V

Tray

APA450

活跃

This product may require additional documentation to export from the United States.

N

0°C ~ 70°C (TA)

Tray

APA450

70 °C

0 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

13.5 kB

110592

450000

180 MHz

STD

12288

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

-40 °C

1.2 V

30

100 °C

无

AGL1000V2-FG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

11000 LE

177 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

526.32 MHz, 892.86 MHz

有

90

IGLOOe

0.014110 oz

1.575 V

Tray

AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40°C ~ 85°C (TA)

Tray

AGL1000V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

不合格

1.2 V to 1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

微芯片技术

313 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

N

249 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

有

27

Actel

2.75 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

2.5 V

30

70 °C

无

A54SX32A-2BG329

0°C ~ 70°C (TA)

Tray

A54SX32A

e0

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.8 mm

31 mm

31 mm