N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

7000 LE

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

AFS600-2FGG256

LBGA

SQUARE

0°C ~ 85°C (TJ)

Tray

AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

OTHER

13824 CLBS, 600000 GATES

1.68 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

484

微芯片技术

1.575 V

Tray

A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P600-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Commercial grade

This product may require additional documentation to export from the United States.

N

235 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

FBGA

1.5000 V

1.425 V

600000

235

600000

1.575 V

表面贴装

0 to 70 °C

Tray

A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

Commercial

1

13824

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

N

71 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

350 MHz

有

90

ProASIC3 nano

1.575 V

Tray

A3PN060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

A3PN060-1VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

-20°C ~ 85°C (TJ)

Tray

A3PN060

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

2 mA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

1

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

896

896-FBGA (31x31)

896

微芯片技术

-40 °C

1.5 V

30

85 °C

无

AX2000-FG896I

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

586 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

649 MHz

有

27

Actel

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 to 85 °C

Tray

AX2000

e0

Tin/Lead (Sn/Pb)

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B896

684

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

294912

2000000

32256

STD

0.99 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

Details

176 I/O

3 V

0 C

+ 70 C

SMD/SMT

131 MHz

有

24

Actel

5.25 V

Tray

A42MX36

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX36-PQG208

73 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.57

0°C ~ 70°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

2560

54000

2.7 ns

2438

54000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P250

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-VQ100

350 MHz

0 to 70 °C

Tray

M1A3P250

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

84-CQFP Exposed Pad and Tie Bar

YES

84

84-CQFP (42x42)

84

微芯片技术

5962-0151801QZC

活跃

MICROSEMI CORP

QFP

QFF,

5.29

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QFF

RECTANGULAR

FLATPACK

5.5 V

5 V

69

Tray

5962-0151801

活跃

4.5 V

-55°C ~ 125°C (TJ)

SX-A

3A001.A.2.C

8542.39.00.01

2.25V ~ 5.25V

QUAD

FLAT

compliant

R-CQFP-F84

Qualified

MILITARY

32000 GATES

现场可编程门阵列

48000

2880

32000

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

147

Compliant

Tray

A3PE1500

Obsolete

1.425 V

A3PE1500-2PQ208I

无

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.61

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

-40°C ~ 100°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1.5e+06

310 MHz

2

38400

38400

38400

1.575 V

1.425 V

1500000

3.4 mm

28 mm

28 mm

无

含铅

N/A

-

表面贴装

YES

176

176

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

40

128

Compliant

3 V

A54SX08-2TQG176I

有

Obsolete

MICROSEMI CORP

LFQFP,

5.31

320 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

e3

哑光锡

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

5 V

QUAD

鸥翼

260

0.5 mm

compliant

320 MHz

S-PQFP-G176

不合格

INDUSTRIAL

700 ps

700 ps

768 CLBS, 8000 GATES

1.6 mm

现场可编程门阵列

768

12000

320 MHz

768

2

256

0.7 ns

768

5.5 V

4.5 V

8000

1.4 mm

24 mm

24 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

1.2 V

30

147

Compliant

Tray

A3PE3000L

Obsolete

1.14 V

A3PE3000L-1PQ208

无

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.61

250 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

0°C ~ 85°C (TJ)

ProASIC3L

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

1.2 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.2/1.5,1.2/3.3 V

COMMERCIAL

63 kB

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3e+06

892.86 MHz

1

75264

75264

75264

1.26 V

1.14 V

3000000

3.4 mm

28 mm

28 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

160-BQFP

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

125

Compliant

Tray

A42MX24

Obsolete

3 V

A42MX24-3PQ160I

无

Obsolete

MICROSEMI CORP

QFP

QFP,

5.25

3

85 °C

-40 °C

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

3.6 V

3.3 V

30

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

5 V

QUAD

鸥翼

225

0.65 mm

compliant

S-PQFP-G160

不合格

INDUSTRIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

5.5 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

YES

176

176

-40 °C

PLASTIC/EPOXY

LFQFP

QFP176,1.0SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

30

3 V

A42MX16-1TQ176I

无

Obsolete

MICROSEMI CORP

QFP

LFQFP, QFP176,1.0SQ,20

5.23

108 MHz

3

85 °C

e0

锡铅

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G176

140

不合格

3.3,3.3/5,5 V

INDUSTRIAL

140

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

2.4 ns

1232

1232

24000

24 mm

24 mm

N/A

-

YES

176

176

-40 °C

PLASTIC/EPOXY

LFQFP

QFP176,1.0SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

30

3 V

A42MX24-2TQ176I

无

Obsolete

MICROSEMI CORP

QFP

1.40 MM HEIGHT, PLASTIC, TQFP-176

5.25

114.75 MHz

3

85 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G176

150

不合格

3.3,3.3/5,5 V

INDUSTRIAL

150

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

1.8 ns

1890

1866

36000

24 mm

24 mm

N/A

-

表面贴装

144-LQFP

YES

144

144-TQFP (20x20)

144

微芯片技术

48000

-40C to 85C

113

32000

2880

0.25um

2.75(V)

2.5(V)

无

2.25(V)

-40C

有

1800

1980

表面贴装

113

Tray

A54SX32A

Obsolete

2.25 V

A54SX32A-TQ144I

无

Obsolete

MICROSEMI CORP

1.40 MM, TQFP-144

5.18

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.75 V

2.5 V

30

SX-A

85C

INDUSTRIALC

TQFP

-40°C ~ 85°C (TA)

Tray

SX-A

e0

Tin/Lead (Sn/Pb)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

238(MHz)

S-PQFP-G144

不合格

INDUSTRIAL

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.2 ns

2880

48000

20 mm

20 mm

N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

3.3 V

30

Compliant

176

Tray

A42MX24

Obsolete

3 V

A42MX24-2PQ208

无

Obsolete

MICROSEMI CORP

QFP

FQFP,

5.25

105 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

5.25 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

3.3 V

30

140

Compliant

Obsolete

A42MX16

Tray

3 V

A42MX16-3PQ208

无

Obsolete

MICROSEMI CORP

QFP

FQFP,

5.24

129 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

5.25 V

3 V

24000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

YES

144

1.319103 g

144

3.6 V

3.3 V

40

113

Compliant

3 V

A54SX08-1TQG144I

有

Obsolete

MICROSEMI CORP

LFQFP,

5.31

280 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

e3

哑光锡

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

5 V

QUAD

鸥翼

260

0.5 mm

compliant

280 MHz

S-PQFP-G144

不合格

INDUSTRIAL

800 ps

800 ps

768 CLBS, 8000 GATES

1.6 mm

现场可编程门阵列

768

12000

280 MHz

768

1

256

0.8 ns

768

5.5 V

4.5 V

8000

1.4 mm

20 mm

20 mm

无

N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

QFP

MICROSEMI CORP

Obsolete

无

A42MX24-1PQ208I

Compliant

176

Tray

A42MX24

Obsolete

3 V

30

3.3 V

3.6 V

FLATPACK, FINE PITCH

SQUARE

FQFP

PLASTIC/EPOXY

-40 °C

85 °C

3

105.57 MHz

5.23

PLASTIC, QFP-208

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

1

1410

2.1 ns

1890

5.5 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

YES

176

176

-55 °C

PLASTIC/EPOXY

LFQFP

QFP176,1.0SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

30

3 V

A42MX16-1TQ176M

无

Obsolete

MICROSEMI CORP

QFP

LFQFP, QFP176,1.0SQ,20

5.23

108 MHz

3

125 °C

e0

3A001.A.2.C

锡铅

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G176

140

不合格

3.3,3.3/5,5 V

MILITARY

140

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

2.4 ns

1232

1232

24000

24 mm

24 mm

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44

44-PLCC (16.59x16.59)

44

微芯片技术

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

34

Tray

A40MX04

Obsolete

3 V

A40MX04-1PL44I

无

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.23

48 MHz

3

85 °C

-40 °C

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J44

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

16.5862 mm

16.5862 mm

N/A

-

表面贴装

84-LCC (J-Lead)

YES

84

84-PLCC (29.31x29.31)

84

微芯片技术

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

69

Tray

A40MX04

Obsolete

3 V

A40MX04-1PL84I

无

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.23

48 MHz

3

85 °C

-40 °C

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J84

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

29.3116 mm

29.3116 mm

N/A

-

表面贴装

80-TQFP

YES

80

80-VQFP (14x14)

80

微芯片技术

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

3.6 V

3.3 V

30

69

Tray

A40MX04

Obsolete

3 V

A40MX04-2VQ80I

无

Obsolete

MICROSEMI CORP

QFP

TQFP,

5.26

101 MHz

3

85 °C

-40 °C

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

S-PQFP-G80

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2 ns

547

6000

14 mm

14 mm

N/A

-

表面贴装

YES

240

240

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP240,1.3SQ,20

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

30

202

Compliant

3 V

A42MX36-PQ240I

无

Obsolete

MICROSEMI CORP

QFP

PLASTIC, QFP-240

5.79

73 MHz

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G240

202

不合格

3.3,3.3/5,5 V

INDUSTRIAL

320 B

202

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

54000

131 MHz

1184

1822

2.7 ns

2438

2414

5.5 V

3 V

54000

3.4 mm

32.1 mm

32.1 mm

无

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

微芯片技术

SMD/SMT

90

0 C

0.017637 oz

+ 85 C

71 I/O

36864 bit

1500 LE

有

Tray

A3P125

活跃

1.425 V

A3P125-VQG100

有

活跃

MICROSEMI CORP

TFQFP,

0.73

350 MHz

3

85 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

40

1.5000 V

1.425 V

1.575 V

Details

ProASIC3

350 MHz

Microchip Technology / Atmel

0 to 70 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

2 mA

-

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

36864

125000

STD

-

3072

125000

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

微芯片技术

18432 bit

700 LE

有

Tray

A3P060

活跃

1.425 V

A3P060-VQG100

有

活跃

MICROSEMI CORP

TFQFP,

0.73

350 MHz

3

85 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

40

Details

ProASIC3

350 MHz

Microchip Technology / Atmel

SMD/SMT

90

0 C

0.017637 oz

+ 85 C

71 I/O

0°C ~ 85°C (TJ)

Tray

A3P060

e3

Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

2 mA

-

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

18432

60000

STD

-

1536

60000

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm